[go: up one dir, main page]

TWI593470B - Substrate processing apparatus, substrate processing method, substrate manufacturing apparatus, and substrate manufacturing method - Google Patents

Substrate processing apparatus, substrate processing method, substrate manufacturing apparatus, and substrate manufacturing method Download PDF

Info

Publication number
TWI593470B
TWI593470B TW104114403A TW104114403A TWI593470B TW I593470 B TWI593470 B TW I593470B TW 104114403 A TW104114403 A TW 104114403A TW 104114403 A TW104114403 A TW 104114403A TW I593470 B TWI593470 B TW I593470B
Authority
TW
Taiwan
Prior art keywords
substrate
nozzle
nozzles
fluid
liquid
Prior art date
Application number
TW104114403A
Other languages
English (en)
Chinese (zh)
Other versions
TW201601850A (zh
Inventor
Yuichi Imaoka
Akinori Iso
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW201601850A publication Critical patent/TW201601850A/zh
Application granted granted Critical
Publication of TWI593470B publication Critical patent/TWI593470B/zh

Links

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW104114403A 2014-05-13 2015-05-06 Substrate processing apparatus, substrate processing method, substrate manufacturing apparatus, and substrate manufacturing method TWI593470B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014099121 2014-05-13
JP2015089659A JP6258892B2 (ja) 2014-05-13 2015-04-24 基板処理装置及び基板処理方法

Publications (2)

Publication Number Publication Date
TW201601850A TW201601850A (zh) 2016-01-16
TWI593470B true TWI593470B (zh) 2017-08-01

Family

ID=54933460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104114403A TWI593470B (zh) 2014-05-13 2015-05-06 Substrate processing apparatus, substrate processing method, substrate manufacturing apparatus, and substrate manufacturing method

Country Status (2)

Country Link
JP (1) JP6258892B2 (ja)
TW (1) TWI593470B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI603421B (zh) * 2016-07-04 2017-10-21 盟立自動化股份有限公司 溼式製程設備
JP2018108892A (ja) * 2016-12-28 2018-07-12 芝浦メカトロニクス株式会社 浮上搬送装置および基板処理装置
CN108249159B (zh) 2016-12-28 2020-02-14 芝浦机械电子株式会社 浮起搬运装置以及基板处理装置
KR101864713B1 (ko) * 2017-05-02 2018-06-05 김문환 일체형 세탁장치
CN108515463B (zh) * 2018-05-31 2025-01-21 长沙矿冶研究院有限责任公司 一种高压水射流板带材清理装置及水射流清理线

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227816A (en) * 2010-11-17 2012-07-01 Samsung Mobile Display Co Ltd System and method for cleaning substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3323385B2 (ja) * 1995-12-21 2002-09-09 大日本スクリーン製造株式会社 基板洗浄装置および基板洗浄方法
JP2007103883A (ja) * 2005-10-07 2007-04-19 Sharp Corp 基板洗浄方法および基板洗浄装置
JP2010258125A (ja) * 2009-04-23 2010-11-11 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5710921B2 (ja) * 2010-09-22 2015-04-30 株式会社Screenホールディングス 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227816A (en) * 2010-11-17 2012-07-01 Samsung Mobile Display Co Ltd System and method for cleaning substrate

Also Published As

Publication number Publication date
TW201601850A (zh) 2016-01-16
JP2015231617A (ja) 2015-12-24
JP6258892B2 (ja) 2018-01-10

Similar Documents

Publication Publication Date Title
TWI593470B (zh) Substrate processing apparatus, substrate processing method, substrate manufacturing apparatus, and substrate manufacturing method
TWI428969B (zh) Substrate cleaning treatment device
JP6336801B2 (ja) 基板乾燥装置
TWI441275B (zh) Substrate processing device
JP4776380B2 (ja) 処理装置及び処理方法
KR20140063420A (ko) 제진 장치
TWI546131B (zh) 基板處理裝置、噴嘴以及基板處理方法
TWI457266B (zh) And a substrate processing device having a non-contact floating conveyance function
CN106340473B (zh) 基板处理装置及基板处理方法
TWI443734B (zh) Substrate processing device
TWI431676B (zh) Substrate processing device and processing method thereof
JP2004330180A (ja) 基板処理装置、基板処理方法、及び基板の製造方法
JP6580177B2 (ja) 基板乾燥装置
JP2008277682A (ja) 基板処理装置
CN112534556B (zh) 处理物体的方法和实施该方法的设备
JP4514140B2 (ja) 基板処理装置及び基板処理方法
JPH09276773A (ja) 基板処理装置
TWI364069B (en) Apparatus for treating substrates
JP2009279477A (ja) 処理液除去装置、基板処理装置およびノズル間隔設定方法
CN105185726B (zh) 基板处理装置、基板处理方法、基板制造装置及基板制造方法
JP2010103383A (ja) 基板処理装置
KR102174364B1 (ko) 평면형 기판을 처리하기 위한 장치 및 방법
JP6552363B2 (ja) 基板乾燥装置および基板処理装置
TWI603421B (zh) 溼式製程設備
JP2011129758A (ja) 基板処理装置