TWI511303B - 液晶顯示器的陣列基板 - Google Patents
液晶顯示器的陣列基板 Download PDFInfo
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- TWI511303B TWI511303B TW102131190A TW102131190A TWI511303B TW I511303 B TWI511303 B TW I511303B TW 102131190 A TW102131190 A TW 102131190A TW 102131190 A TW102131190 A TW 102131190A TW I511303 B TWI511303 B TW I511303B
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- 239000000758 substrate Substances 0.000 title claims description 83
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 44
- 239000003990 capacitor Substances 0.000 claims description 27
- 238000002161 passivation Methods 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 description 6
- 230000005684 electric field Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136213—Storage capacitors associated with the pixel electrode
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133553—Reflecting elements
- G02F1/133555—Transflectors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/441—Interconnections, e.g. scanning lines
- H10D86/443—Interconnections, e.g. scanning lines adapted for preventing breakage, peeling or short circuiting
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133397—Constructional arrangements; Manufacturing methods for suppressing after-image or image-sticking
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134372—Electrodes characterised by their geometrical arrangement for fringe field switching [FFS] where the common electrode is not patterned
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
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Description
本發明涉及一種液晶顯示器,尤其涉及一種液晶顯示器的陣列基板。
目前,顯示器市場上的邊緣電場(Fringe Field Switching,FFS) 型液晶顯示器廣受歡迎。該邊緣場電場型液晶顯示器是在陣列基板上形成畫素電極與公共電極,對該畫素電極與該公共電極之間施加電壓,使之產生邊緣電場以在與該陣列基板基本平行的面內驅動液晶分子。這種液晶顯示器具有廣視角、低色偏及高開口率的特性。
近年來,市場對顯示器的解析度的要求越來越高。為了提高解析度,需提高液晶顯示器陣列基板的畫素密度。然而,畫素密度越大,存儲電容值則越小,存儲電容的不足將引起液晶顯示器的品質下降,例如在顯示畫面中產生閃爍(flicker)或串擾(cross-talk)等不良現象。
現有技術中陣列基板的存儲電容由公共電極、畫素電極及夾設於兩者之間的絕緣層構成,其電容按如下公式計算:
CST
=εA/d
上述公式中,CST
表示存儲電容值,ε表示絕緣層的介電常數,A表示畫素電極與公共電極的有效面積,d表示絕緣層的厚度。因此,該存儲電容的電容值CST
與有效面積A成正比,與厚度d成反比。為了實現高解析度,先前技術的做法是減薄絕緣層的厚度,然而,由於制程式控制能力有限,並不能過度減薄絕緣層的厚度。
鑒於以上內容,有必要提供一種液晶顯示器陣列基板,其可以在提高陣列基板解析度的情況下,增大存儲電容值。
本發明提供一種液晶顯示器的陣列基板,包括一存儲電容,該存儲電容包括一第一公共電極、一設置在該第一公共電極上的第一絕緣層與一設置在第一絕緣層上的畫素電極,其中該存儲電容還包括一設置在畫素電極上的第二絕緣層與一設置在第二絕緣層上的第二公共電極,該第二公共電極具有多數個狹縫,且與第一公共電極電連接。
相較於現有技術,根據本發明提供的陣列基板以增加單位面積存儲電容的方式,增加了陣列基板設計的靈活度與制程邊界(process window),尤其可適用於高解析度的液晶顯示器。對於液晶顯示器而言,即使為了提高解析度而增大畫素密度,也不會因存儲電容不足而影響顯示品質。
100、200、 300、400‧‧‧陣列基板
10‧‧‧存儲電容
GL‧‧‧掃描線
DL‧‧‧資料線
CL‧‧‧公共電極線
110‧‧‧基板
120‧‧‧TFT
121‧‧‧閘極
122‧‧‧閘極絕緣層
123‧‧‧通道層
124‧‧‧源極
125‧‧‧汲極
130‧‧‧鈍化層
140‧‧‧平坦層
150、250‧‧‧第一公共電極
160‧‧‧第一絕緣層
170、270‧‧‧畫素電極
180‧‧‧第二絕緣層
190、290、 390、490‧‧‧第二公共電極
192、392、492‧‧‧狹縫
141‧‧‧第一開孔
151‧‧‧第二開孔
161‧‧‧第三開孔
191‧‧‧第四開孔
182‧‧‧通孔
252‧‧‧平板狀公共電極
253‧‧‧第一公共電極連接部
圖1為本發明提供的第一實施方式的液晶顯示器陣列基板的俯視圖。
圖2為圖1中所示的陣列基板沿線Ⅱ-Ⅱ的剖示圖。
圖3為圖1中所示的部分陣列基板中三層電極結構的示意圖。
圖4為圖1中所示的陣列基板公共電極接墊區的剖示圖。
圖5為圖1中所示的陣列基板沿線Ⅳ-Ⅳ的剖示圖。
圖6為本發明提供的第二實施方式中陣列基板的俯視圖。
圖7為圖6中所示的部分陣列基板中三層電極結構的示意圖。
圖8為本發明提供的第三實施方式中陣列基板的俯視圖。
圖9為本發明提供的第四實施方式中陣列基板的俯視圖。
圖1是本發明第一實施方式的部分液晶顯示器陣列基板100的俯視圖。本實施方式中液晶顯示器是FFS型液晶顯示器。該陣列基板100包括多條平行排列的掃描線GL與多條平行排列的資料線DL,該掃描線GL與該資料線DL交叉以限定多個子畫素。每個子畫素中包括一薄膜電晶體(TFT)120與一畫素電極170。其中,畫素電極170為平板狀電極,分別位於每個子畫素中,並與TFT 120電連接。
陣列基板100還包括第一公共電極150與第二公共電極190。本實施方式中,該陣列基板100共包括三層電極結構。其中,第一公共電極150與第二公共電極190重疊,且都覆蓋所有的子畫素。第二公共電極190位於第一公共電極150上方,第一公共電極150為平板狀電極。第二公共電極190具有多個平行排列的狹縫192,使得第二公共電極190與畫素電極170之間可形成邊緣電場,以驅動液晶(未繪出)旋轉。請參照圖1,該狹縫192為條型,但並不限於此,該狹縫192還可以是“<”字型或其他彎折形狀。在該實施方式中,狹縫192與資料線DL均不與掃描線GL垂直。
圖2是圖1中陣列基板100沿線Ⅱ-Ⅱ的剖面圖。如圖2所示,陣列基板100包括基板110、TFT 120、鈍化層130、平坦層140、第一公共電極150、第一絕緣層160、畫素電極170以及第二公共電極190。其中,TFT 120設置於基板110上。每一TFT 120包括閘極121、閘極絕緣層122、通道層123、源極124與汲極125。閘極121位於基板110上,閘極絕緣層122覆蓋閘極121與基板110,通道層123位於該閘極絕緣層122上方,並對應閘極121上方設置。源極124與汲極125分別位於通道層123兩側並彼此分離。請同時參照圖1與圖2。在該實施方式中,TFT 120的閘極121凸出於掃描線GL之外。源極124包含在資料線DL中,大致呈馬蹄形狀(C),並與閘極121重疊。汲極123與源極124相對設置,並與閘極121部分重疊。當然,TFT 120的形狀並不限於此,也可以為其他形狀。在每個子圖元中,資料線DL以一定的角度與掃描線傾斜交錯設置,並包括馬蹄形狀的源極124。
鈍化層130覆蓋TFT 120與基板110,平坦層140覆蓋鈍化層130。本實施方式中,平坦層140的材質是有機材料,與鈍化層130相比,其厚度較厚,起到平坦化的作用。平坦層140與鈍化層130具有第一開孔141,露出部分汲極125。
為使汲極125與畫素電極170連接,第一公共電極150開設有第二開孔151,該第二開孔151位於第一開孔141上方且大於第一開孔141。第一絕緣層160具有第三開孔161,第三開孔161位於第一開孔141與第二開孔151中並露出部分汲極125,畫素電極170位於第一絕緣層上方,並通過第三開孔161與汲極125電連接。
第二絕緣層180位於畫素電極170上方,並覆蓋該畫素電極170。第二公共電極190位於第二絕緣層180上方,並具有第四開孔191,第四開孔191與第二開孔151重疊,且大小一致。由於該第二公共電極190具有第四開孔191,可避免第二公共電極190與圖元電極170之間發生短路(short)。
圖3是圖1中部分陣列基板100所包含的三層電極結構的示意圖。如圖3所示,第一公共電極150為一整面連續的電極,連續覆蓋所有子畫素,並在每個子畫素中均開設有第二開孔151。多個畫素電極170為不連續分佈的平板狀電極,每個畫素電極170分別設於每個子畫素中。第二公共電極170也是連續覆蓋所有子畫素的一整面電極,與第一公共電極150重疊。第二公共電極190對應每個子畫素開設有第四開孔191。第四開孔191優選與第二開孔151在垂直面板的方向完全重疊。另外,第二公共電極190在每個子畫素中還具有多個如圖2所示的狹縫192。相鄰兩行的子圖元中,第二公共電極190的狹縫192的傾斜方向是對稱的,因此,相鄰兩行的子圖元所對應的液晶會形成兩種不同的配向。
請參照圖4,圖4是該陣列基板100周邊區域的公共電極接墊區(pad)的剖示圖。該陣列基板100包括一公共電極線CL,該公共電極線CL位於該基板110上。該第一公共電極150與第二公共電極190之間夾有第一絕緣層160與第二絕緣層180,該第一絕緣層160與該第二絕緣層180具有通孔182,以露出部分第一公共電極150,使該第二公共電極190通過該通孔182與該第一公共電極150電連接。該第一公共電極150與該公共電極線CL電連接,以接入公共電極訊號。第一公共電極可通過一位於公共電極線CL上方的金屬層126與公共電極線CL電連接,也可直接與公共電極線CL電連接。該金屬層126與資料線DL、源極124與汲極125的材質相同,並位於同一金屬層。
請參照圖5,圖5是圖1中的陣列基板100沿線Ⅳ-Ⅳ的剖面圖。圖5示出了該陣列基板100的存儲電容10的結構。該存儲電容10位於平坦層140上,包括第一公共電極150、設置在該第一公共電極150上的第一絕緣層160與設置在第一絕緣層160上的畫素電極170、設置在畫素電極170上的第二絕緣層180與設置在第二絕緣層180上的第二公共電極190。畫素電極170、該第一公共電極150與該第二公共電極190的材質是導電材料,例如氧化銦錫(ITO)或者氧化銦鋅(IZO)。該第一絕緣層與該第二絕緣層的材質是絕緣材料,例如氧化矽(SiOX)或者氮化矽(SiNx)。
第一公共電極150與畫素電極170部分重疊,形成第一存儲電容;第二公共電極190與畫素電極170部分重疊,形成第二存儲電容。第一存儲電容與第二存儲電容並聯,相較於先前技術,公共電極與畫素電極之間僅有一種存儲電容,因此,該陣列基板100單位面積的存儲電容值較大。換句話說,在保持畫素電極與公共電極有效面積不變的情況下,本發明提供的陣列基板100的單位面積的存儲電容值較大。
該陣列基板100藉由增加一層第二公共電極層190,可以增加單位面積的存儲電容,並且不需要減薄電極之間絕緣層的厚度,因此,增加了陣列基板100的設計靈活度與制程邊界,尤其可適用於高解析度的液晶顯示器。對於液晶顯示器而言,即使為了提高解析度,增大畫素密度,也不會因存儲電容不足而影響顯示品質,避免產生閃爍或串擾等不良現象。另外,沒有開口的第一公共電極150位於畫素電極170下方,可以有效遮蔽資料線DL的電場,減少資料線DL與畫素電極170的電場耦合,從而可避免串擾,提高顯示品質。
圖6是本發明提供的第二實施方式中的陣列基板200。圖7是圖6中部分陣列基板200所包括的三層電極的示意圖。請同時參考圖6與圖7。陣列基板200與陣列基板100的結構相似,都包括三層電極結構,分別是第一公共電極250、畫素電極270與第二公共電極290。陣列基板200與陣列基板100的差異在於:第一公共電極250重疊在資料線DL上方的部份基本被省略,即第一公共電極250僅覆蓋部份資料線DL。本實施方式中,第一公共電極250重疊在數據線DL上方的部份完全被省略。由於第一公共電極250與資料線DL重疊的面積較小,如此可以降低第一公共電極250與資料線DL之間的寄生電容。具體而言,第一公共電極250包括位於每個子畫素中的平板狀公共電極252以及每一列相鄰子畫素之間的第一公共電極連接部253。該多個平板狀公共電極252經第一公共電極連接部253串接後基本平行掃描線方向延伸。位於子畫素中的平板狀公共電極252與資料線DL相互不重疊。每條第一公共電極連接部253基本平行掃描線GL延伸且與資料線DL絕緣交叉,使得每條第一公共電極連接部253覆蓋資料線DL的面積較少。
本發明第二實施方式中的陣列基板200所包含的第一公共電極連接部253位於每一列相鄰的子畫素之間,但本發明並不限於此,每一行相鄰的子畫素之間也可設置第一公共電極連接部,使每一行相鄰的子畫素所對應的第一公共電極連接。
以上僅為本發明的三種實施方式,陣列基板100、200中的一個子畫素對應的液晶層都僅形成一種配向方向,位於相鄰兩行的兩個子畫素對應的液晶層則形成不同的配向方向,因此,該液晶顯示器的陣列基板100、200對應的液晶層均包括兩種配向方向,廣視角效果更佳。
圖8是本發明第三實施方式的陣列基板300的俯視圖。陣列基板300與陣列基板100的結構相似,差異在於:資料線DL及第二公共電極390的狹縫392為“<”字型,因此,一個子畫素對應的液晶層包括兩種配向方向。該陣列基板300同樣可以達到廣視角效果。
圖9是本發明第四實施方式的陣列基板400的俯視圖。陣列基板400與陣列基板100的結構相似,差異在於:該資料線DL與第二公共電極490的狹縫492是都直條狀且與掃描線GL基本垂直,第二公共電極490的狹縫492為條型狹縫。因此,一個子畫素對應的液晶層僅包括一種配向方向,該陣列基板400對應的液晶層也僅包括一種配向方向。
本發明陣列基板中的TFT可以是非晶矽型TFT,也可以是金屬氧化物半導體薄膜晶體管,或者低溫多晶矽型薄膜晶體管。
本發明提供的液晶顯示器的陣列基板,藉由設置兩層公共電極層,可以增加單位面積的存儲電容,並且不需要減薄電極之間絕緣層的厚度,因此,增加了陣列基板的設計靈活度與制程邊界,尤其可適用於高解析度的液晶顯示器。對於液晶顯示器而言,即使為了提高解析度,增大畫素密度,也不會因存儲電容不足而影響顯示品質,避免產生閃爍或串擾等不良現象。
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。
無
100‧‧‧陣列基板
110‧‧‧基板
120‧‧‧TFT
121‧‧‧閘極
122‧‧‧閘極絕緣層
123‧‧‧通道層
124‧‧‧源極
125‧‧‧汲極
130‧‧‧鈍化層
140‧‧‧平坦層
150‧‧‧第一公共電極
160‧‧‧第一絕緣層
170‧‧‧畫素電極
180‧‧‧第二絕緣層
190‧‧‧第二公共電極
141‧‧‧第一開孔
151‧‧‧第二開孔
161‧‧‧第三開孔
191‧‧‧第四開孔
192‧‧‧狹縫
Claims (14)
- 一種液晶顯示器的陣列基板,包括一存儲電容,該存儲電容包括一第一公共電極、一設置在該第一公共電極上的第一絕緣層與一設置在第一絕緣層上的畫素電極,其改良在於:該存儲電容還包括一設置在畫素電極上的第二絕緣層與一設置在第二絕緣層上的第二公共電極,該第二公共電極具有多數個狹縫,且與該第一公共電極電連接。
- 如專利申請範圍第1項所述之液晶顯示器的陣列基板,其中該陣列基板還包括一基板、一薄膜電晶體設置於該基板上、一鈍化層覆蓋該薄膜電晶體與該基板,以及一平坦層覆蓋該鈍化層。
- 如專利申請範圍第2項所述之液晶顯示器的陣列基板,其中該存儲電容位於該平坦層上。
- 如專利申請範圍第2項所述之液晶顯示器的陣列基板,其中該平坦層與該鈍化層具有第一開孔以露出部分薄膜晶體管,該第一公共電極具有第二開孔,該第二開孔位於第一開孔上方且大於第一開孔,該第一絕緣層具有第三開孔,該第三開孔位於該第一開孔與該第二開孔中並露出部分該薄膜晶體管。
- 如專利申請範圍第4項所述之液晶顯示器的陣列基板,其中該畫素電極通過該第三開孔與該薄膜電晶體電連接。
- 如專利申請範圍第4項所述之液晶顯示器的陣列基板,其中該第二公共電極具有第四開孔,該第四開孔與該第二開孔重疊且大小一致。
- 如專利申請範圍第1項所述之液晶顯示器的陣列基板,其中該第一公共電極與該畫素電極之間形成第一存儲電容,該第二公共電極與該畫素電極之間形成第二存儲電容。
- 如專利申請範圍第1項所述之液晶顯示器的陣列基板,其中該第一公共電極與該第二公共電極電性連接。
- 如專利申請範圍第1項所述之液晶顯示器的陣列基板,其中該陣列基板還包括多條掃描線、多條資料線與該多條掃描線交叉以限定多個子畫素。
- 如專利申請範圍第9項所述之液晶顯示器的陣列基板,其中該畫素電極為平板狀電極且分別位於每個子畫素中。
- 如專利申請範圍第9項所述之液晶顯示器的陣列基板,其中該第一公共電極為平板狀電極且連續覆蓋所有子畫素。
- 如專利申請範圍第9項所述之液晶顯示器的陣列基板,其中該第二公共電極與該第一公共電極重疊,且連續覆蓋所有子畫素。
- 如專利申請範圍第9項所述之液晶顯示器的陣列基板,其中該第一公共電極包括位於子畫素中的平板狀公共電極以及位於相鄰子畫素之間的第一公共電極連接部,位於子畫素中的平板狀公共電極與資料線相互不重疊。
- 如專利申請範圍第13項所述之液晶顯示器的陣列基板,其中該第一公共電極連接部重疊覆蓋部分該資料線。
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Also Published As
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US9823528B2 (en) | 2017-11-21 |
CN104423110B (zh) | 2018-03-20 |
CN104423110A (zh) | 2015-03-18 |
US20150060973A1 (en) | 2015-03-05 |
TW201508928A (zh) | 2015-03-01 |
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