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NL7609428A - Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate - Google Patents

Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Info

Publication number
NL7609428A
NL7609428A NL7609428A NL7609428A NL7609428A NL 7609428 A NL7609428 A NL 7609428A NL 7609428 A NL7609428 A NL 7609428A NL 7609428 A NL7609428 A NL 7609428A NL 7609428 A NL7609428 A NL 7609428A
Authority
NL
Netherlands
Prior art keywords
metal
substrate
oxidising
laminate
contacting
Prior art date
Application number
NL7609428A
Other languages
Dutch (nl)
Original Assignee
Uop Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uop Inc filed Critical Uop Inc
Priority to NL7609428A priority Critical patent/NL7609428A/en
Publication of NL7609428A publication Critical patent/NL7609428A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0012—Mechanical treatment, e.g. roughening, deforming, stretching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A metal-clad laminate is prepd. by (i) applying a release agent to a surface of a substrate, (ii) plating the surface with a conductive metal of thickness 1-20 mu (iii) subjecting the resultant conductive metal layer to a high current density to roughen the exposed surface of the metal, (iv) oxidising the surface, (v) contacting the surface with a bonding agent, (vi) bonding the thus treated conductive metal to a laminate, (vii) removing the substrate, and (vii) recovering the resulting laminate. The metal-clad laminate is also claimed. Esp. useful in forming copper (or other conductive metals such as Ni, Sn, Au etc) clad laminates for use in making printed circuits. The method allows a very thin metal layer to be formed on the laminate so that etching time is greatly reduced, the amt. of etching soln. is smaller, and less undercutting (allowing greater circuit density) occurs.
NL7609428A 1976-08-25 1976-08-25 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate NL7609428A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL7609428A NL7609428A (en) 1976-08-25 1976-08-25 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7609428A NL7609428A (en) 1976-08-25 1976-08-25 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Publications (1)

Publication Number Publication Date
NL7609428A true NL7609428A (en) 1978-02-28

Family

ID=19826790

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7609428A NL7609428A (en) 1976-08-25 1976-08-25 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Country Status (1)

Country Link
NL (1) NL7609428A (en)

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Legal Events

Date Code Title Description
BV The patent application has lapsed