[go: up one dir, main page]

FR2361224A1 - Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate - Google Patents

Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Info

Publication number
FR2361224A1
FR2361224A1 FR7624557A FR7624557A FR2361224A1 FR 2361224 A1 FR2361224 A1 FR 2361224A1 FR 7624557 A FR7624557 A FR 7624557A FR 7624557 A FR7624557 A FR 7624557A FR 2361224 A1 FR2361224 A1 FR 2361224A1
Authority
FR
France
Prior art keywords
metal
substrate
oxidising
laminate
contacting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7624557A
Other languages
French (fr)
Other versions
FR2361224B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell UOP LLC
Original Assignee
UOP LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UOP LLC filed Critical UOP LLC
Priority to FR7624557A priority Critical patent/FR2361224A1/en
Publication of FR2361224A1 publication Critical patent/FR2361224A1/en
Application granted granted Critical
Publication of FR2361224B1 publication Critical patent/FR2361224B1/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/16—Tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A metal-clad laminate is prepd. by (i) applying a release agent to a surface of a substrate, (ii) plating the surface with a conductive metal of thickness 1-20 mu (iii) subjecting the resultant conductive metal layer to a high current density to roughen the exposed surface of the metal, (iv) oxidising the surface, (v) contacting the surface with a bonding agent, (vi) bonding the thus treated conductive metal to a laminate, (vii) removing the substrate, and (vii) recovering the resulting laminate. The metal-clad laminate is also claimed. Esp. useful in forming copper (or other conductive metals such as Ni, Sn, Au etc) clad laminates for use in making printed circuits. The method allows a very thin metal layer to be formed on the laminate so that etching time is greatly reduced, the amt. of etching soln. is smaller, and less undercutting (allowing greater circuit density) occurs.
FR7624557A 1976-08-11 1976-08-11 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate Granted FR2361224A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7624557A FR2361224A1 (en) 1976-08-11 1976-08-11 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7624557A FR2361224A1 (en) 1976-08-11 1976-08-11 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Publications (2)

Publication Number Publication Date
FR2361224A1 true FR2361224A1 (en) 1978-03-10
FR2361224B1 FR2361224B1 (en) 1980-05-16

Family

ID=9176794

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7624557A Granted FR2361224A1 (en) 1976-08-11 1976-08-11 Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate

Country Status (1)

Country Link
FR (1) FR2361224A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554046A1 (en) * 1983-10-28 1985-05-03 Gen Electric Laminate covered with metal and method of manufacture
EP0310010A2 (en) * 1987-10-01 1989-04-05 Mcgean-Rohco, Inc. Multilayer printed circuit board formation

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2210882A1 (en) * 1972-12-15 1974-07-12 Fortin Laminating Corp Metal faced laminate - for making printed circuits
FR2252920A1 (en) * 1973-12-03 1975-06-27 Yates Industries

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2210882A1 (en) * 1972-12-15 1974-07-12 Fortin Laminating Corp Metal faced laminate - for making printed circuits
FR2252920A1 (en) * 1973-12-03 1975-06-27 Yates Industries

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554046A1 (en) * 1983-10-28 1985-05-03 Gen Electric Laminate covered with metal and method of manufacture
EP0310010A2 (en) * 1987-10-01 1989-04-05 Mcgean-Rohco, Inc. Multilayer printed circuit board formation
EP0310010A3 (en) * 1987-10-01 1989-09-13 E.I. Du Pont De Nemours And Company Multilayer printed circuit board formation

Also Published As

Publication number Publication date
FR2361224B1 (en) 1980-05-16

Similar Documents

Publication Publication Date Title
EP0258452A4 (en) Process for producing copper-clad laminate.
US3565707A (en) Metal dissolution
EP1209958A3 (en) Laminated structure for electronic equipment and method of electroless gold plating
FR2361224A1 (en) Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate
IT1065714B (en) Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate
NL7609428A (en) Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate
JPS63168077A (en) Manufacture of printed wiring board
JP2884935B2 (en) Nickel or nickel alloy etching solution, method using this etching solution, and method for manufacturing wiring board using this etching solution
JP2000151096A (en) Manufacture of printed wiring board
JPH01290289A (en) Method of forming conductor pattern
JP2664246B2 (en) Printed circuit board manufacturing method
JP4168798B2 (en) Method for manufacturing printed wiring board
JPH07221430A (en) Manufacture of wiring board
KR101308485B1 (en) Copper-clad laminate manufacture method and printed circuit board using copper-clad laminate
JPS63188992A (en) Manufacture of printed wiring board
JPS59106181A (en) Method of producing printed circuit board
JPH01124286A (en) Manufacture of printed-circuit board
JPS55111142A (en) Manufacturing method of lead wire for semiconductor device
JPS6340395A (en) Manufacture of through-hole printed interconnection board
GB1276527A (en) Thermal dissipating metal core printed circuit board
JPH081985B2 (en) Wiring board manufacturing method
JPS63283097A (en) Formation of pattern
JPH1051098A (en) Circuit board with built-in resistor
JP2010100868A (en) Metallic material for substrate and method of manufacturing the same
JPS60263496A (en) Method of producing circuit board

Legal Events

Date Code Title Description
ST Notification of lapse