IT1065714B - Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate - Google Patents
Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrateInfo
- Publication number
- IT1065714B IT1065714B IT2649976A IT2649976A IT1065714B IT 1065714 B IT1065714 B IT 1065714B IT 2649976 A IT2649976 A IT 2649976A IT 2649976 A IT2649976 A IT 2649976A IT 1065714 B IT1065714 B IT 1065714B
- Authority
- IT
- Italy
- Prior art keywords
- metal
- substrate
- oxidising
- laminate
- contacting
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A metal-clad laminate is prepd. by (i) applying a release agent to a surface of a substrate, (ii) plating the surface with a conductive metal of thickness 1-20 mu (iii) subjecting the resultant conductive metal layer to a high current density to roughen the exposed surface of the metal, (iv) oxidising the surface, (v) contacting the surface with a bonding agent, (vi) bonding the thus treated conductive metal to a laminate, (vii) removing the substrate, and (vii) recovering the resulting laminate. The metal-clad laminate is also claimed. Esp. useful in forming copper (or other conductive metals such as Ni, Sn, Au etc) clad laminates for use in making printed circuits. The method allows a very thin metal layer to be formed on the laminate so that etching time is greatly reduced, the amt. of etching soln. is smaller, and less undercutting (allowing greater circuit density) occurs.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2649976A IT1065714B (en) | 1976-08-24 | 1976-08-24 | Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT2649976A IT1065714B (en) | 1976-08-24 | 1976-08-24 | Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1065714B true IT1065714B (en) | 1985-03-04 |
Family
ID=11219652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT2649976A IT1065714B (en) | 1976-08-24 | 1976-08-24 | Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate |
Country Status (1)
| Country | Link |
|---|---|
| IT (1) | IT1065714B (en) |
-
1976
- 1976-08-24 IT IT2649976A patent/IT1065714B/en active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0258452A4 (en) | Process for producing copper-clad laminate. | |
| US3565707A (en) | Metal dissolution | |
| EP1209958A3 (en) | Laminated structure for electronic equipment and method of electroless gold plating | |
| FR2361224A1 (en) | Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate | |
| IT1065714B (en) | Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate | |
| NL7609428A (en) | Metal clad laminates mfr. for printed circuit prodn. - by plating metal onto substrate roughening it, oxidising it, contacting it with bonding agent, laminating it, and removing substrate | |
| JPS63168077A (en) | Manufacture of printed wiring board | |
| JP2884935B2 (en) | Nickel or nickel alloy etching solution, method using this etching solution, and method for manufacturing wiring board using this etching solution | |
| JP2000151096A (en) | Manufacture of printed wiring board | |
| JPH01290289A (en) | Method of forming conductor pattern | |
| JP2664246B2 (en) | Printed circuit board manufacturing method | |
| JP4168798B2 (en) | Method for manufacturing printed wiring board | |
| JPH07221430A (en) | Manufacture of wiring board | |
| KR101308485B1 (en) | Copper-clad laminate manufacture method and printed circuit board using copper-clad laminate | |
| JPS63188992A (en) | Manufacture of printed wiring board | |
| JPS59106181A (en) | Method of producing printed circuit board | |
| JPH01124286A (en) | Manufacture of printed-circuit board | |
| JPS55111142A (en) | Manufacturing method of lead wire for semiconductor device | |
| JPS6340395A (en) | Manufacture of through-hole printed interconnection board | |
| GB1276527A (en) | Thermal dissipating metal core printed circuit board | |
| JPH081985B2 (en) | Wiring board manufacturing method | |
| JPS63283097A (en) | Formation of pattern | |
| JPH1051098A (en) | Circuit board with built-in resistor | |
| JP2010100868A (en) | Metallic material for substrate and method of manufacturing the same | |
| JPS60263496A (en) | Method of producing circuit board |