KR987000636A - 표면파 부품 및 이에 대한 감쇠 구조를 제조하는 방법(surface wave component and method of producing an attenuaing struture the refor) - Google Patents
표면파 부품 및 이에 대한 감쇠 구조를 제조하는 방법(surface wave component and method of producing an attenuaing struture the refor) Download PDFInfo
- Publication number
- KR987000636A KR987000636A KR1019970703829A KR19970703829A KR987000636A KR 987000636 A KR987000636 A KR 987000636A KR 1019970703829 A KR1019970703829 A KR 1019970703829A KR 19970703829 A KR19970703829 A KR 19970703829A KR 987000636 A KR987000636 A KR 987000636A
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- surface wave
- wave component
- cured
- cycloaliphatic epoxide
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims 5
- 239000003822 epoxy resin Substances 0.000 claims abstract 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract 12
- 238000013016 damping Methods 0.000 claims abstract 6
- 230000000977 initiatory effect Effects 0.000 claims abstract 5
- 125000002091 cationic group Chemical group 0.000 claims abstract 3
- 229920005989 resin Polymers 0.000 claims abstract 2
- 239000011347 resin Substances 0.000 claims abstract 2
- 150000002118 epoxides Chemical class 0.000 claims 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims 3
- -1 3,4-epoxycyclohexylmethyl Chemical group 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 2
- 230000002238 attenuated effect Effects 0.000 claims 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 150000001298 alcohols Chemical group 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 239000011230 binding agent Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 claims 1
- 239000003999 initiator Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 230000002459 sustained effect Effects 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 229940125898 compound 5 Drugs 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/162—Selection of materials
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/36—Devices for manipulating acoustic surface waves
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (10)
- - 압전 재료로 이루어진 기판(2), - 기판의 한 표면상에 변환기 전극(3, 4), 및 - 표면의 일부 또는 전부 상에 프린팅되고 UV 조사 개시에 의해 양이온적으로 경화되는 에폭시 수지로 구성된 음향 감쇠 구조(5)를 갖는 표면파 부품.
- 제 1 항에 있어서, 간섭 시그날이 주 시그날에 비해 50dB 이상 감쇠되는 것을 특징으로 하는 표면파 부품.
- 제 1 항 또는 2 항에 있어서, 감쇠 구조(5)의 에폭시 수지가 시클로지방족 에폭시화물을 기초로 하고 용매로부터 유리되는 것을 특징으로 하는 표면파.
- 원하는 구조(5)에서 UV 조사 개시에 의해 양이온적으로 경화되는 에폭시 수지를 표면파 부품의 표면상에 프린팅시키고, 60분 이하의 유지 시간을 지속시키며, 수지 구조(5)를 UN 복사선에 노출시켜서 경화시킴으로써 표면파 부품(7)상에 음향 감쇠 구조(5)를 제조하는 방법.
- 제 4 항에 있어서, - 시클로지방족 에폭시화물, - 시클로지방족 에폭시화물과 다가 페놀을 1:1 내지 20:1 의 반응성기의 몰비로 반응시킨 생성물, - 양이온성 경화 반응용 광개시제, 및 - 에폭시 수지에 대해 표준인 첨가제를 포함하는 에폭시 수지가 사용되고, 이 에폭시 수지가 20 내지 150 Pa.s 의 점도를 갖는 것을 특징으로 하는 방법.
- 제 4 항 또는 5 항에 있어서, 시클로지방족 에폭시화물이 3,4-에폭시시클로헥실멜틸, 3', 4'-에폭시시클로헥산카르복실산염 및 비스-(3,4-에폭시시클로헥실메틸)아디프산염 또는 이들의 혼합물로부터 선택되는 것을 특징으로 하는 방법.
- 제 4 항 내지 6 항 중 어느 한 항에 있어서, 에폭시 수지가 UV-조사 개시 양이온성 경화 반응에 대해 반응성인 구성 요소를 더 함유하고, 지방족 에폭시화물 및 일작용성 또는 다작용성 지방족 및 아르알리파틱 알코올 및 비닐 에테르로부터 선택되는 것을 특징으로 하는 방법.
- 제 4 항 내지 7 항 중 어느 한 항에 있어서, 에폭시 수지에 대한 표준인 첨가제가 유량 조절제, 결합제, 틱소트로프제 및 열경화성 개시제로부터 선택되는 것을 특징으로 하는 방법.
- 제 1 항 내지 8 항 중 어느 한 항에 있어서, 다수의 부품(7)을 웨이퍼상에 제조하고, 프린트-구조(5)의 경화 후에, 절단 과정을 구조의 일부를 통해 수행하여 부품을 분리시키는 것을 특징으로 하는 방법.
- 감쇠 구조를 표면파 부품상에 프린팅시키기 위해 UV 조사 개시에 의해 양이온적으로 경화되는 에폭시 수지를 사용하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEP4443946.6 | 1994-12-09 | ||
DE4443946 | 1994-12-09 | ||
PCT/DE1995/001738 WO1996018182A1 (de) | 1994-12-09 | 1995-12-05 | Oberflächenwellenbauelement und verfahren zur erzeugung einer dämpfungsstruktur dafür |
Publications (1)
Publication Number | Publication Date |
---|---|
KR987000636A true KR987000636A (ko) | 1998-03-30 |
Family
ID=6535426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019970703829A KR987000636A (ko) | 1994-12-09 | 1995-12-05 | 표면파 부품 및 이에 대한 감쇠 구조를 제조하는 방법(surface wave component and method of producing an attenuaing struture the refor) |
Country Status (9)
Country | Link |
---|---|
US (1) | US5900286A (ko) |
EP (1) | EP0796488B1 (ko) |
JP (1) | JPH10510401A (ko) |
KR (1) | KR987000636A (ko) |
CN (1) | CN1122360C (ko) |
DE (1) | DE59505535D1 (ko) |
FI (1) | FI972392A0 (ko) |
RU (1) | RU2131624C1 (ko) |
WO (1) | WO1996018182A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3806993B2 (ja) * | 1996-10-28 | 2006-08-09 | 東洋インキ製造株式会社 | カチオン硬化性プレポリマーおよびそれを用いた活性エネルギー線硬化型塗料組成物 |
DE19750147A1 (de) * | 1997-11-12 | 1999-05-27 | Siemens Ag | Einkomponenten-Epoxidharz zur Abdeckung von elektronischen Bauelementen |
EP1090387B1 (de) * | 1998-06-26 | 2002-10-30 | Epcos Ag | Verfahren zur dämpfenden beschichtung von oberflächenwellenbauelementen |
DE19943149A1 (de) * | 1999-09-09 | 2001-04-05 | Siemens Ag | Verfahren zur Verkapselung von Bauelementen |
DE10006446A1 (de) * | 2000-02-14 | 2001-08-23 | Epcos Ag | Verkapselung für ein elektrisches Bauelement und Verfahren zur Herstellung |
DE10023353A1 (de) * | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
JPWO2024024442A1 (ko) * | 2022-07-25 | 2024-02-01 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56149811A (en) * | 1980-04-23 | 1981-11-19 | Hitachi Ltd | Elastic surface wave device and its preparation |
EP0097642A1 (en) * | 1981-12-14 | 1984-01-11 | Gte Products Corporation | Acoustical wax on a surface wave device |
JPS598419A (ja) * | 1982-07-07 | 1984-01-17 | Hitachi Ltd | 弾性表面波装置 |
JPS59210715A (ja) * | 1984-04-16 | 1984-11-29 | Toshiba Corp | 弾性表面波装置 |
CA1305823C (en) * | 1986-08-29 | 1992-07-28 | Union Carbide Corporation | Photocurable blends of cyclic ethers and cycloaliphatic epoxides |
EP0360037B1 (de) * | 1988-09-19 | 1994-11-17 | Siemens Aktiengesellschaft | Dämpfungsmasse für Oberflächen-wellenbauelemente |
JPH02104011A (ja) * | 1988-10-12 | 1990-04-17 | Nec Corp | 表面弾性波素子の吸収帯形成方法 |
KR100189642B1 (ko) * | 1991-02-18 | 1999-06-01 | 디어터 크리스트 | 전자 부품 및 조립체를 피복시키거나 접착시키는 방법 |
US5328940A (en) * | 1992-07-20 | 1994-07-12 | Lord Corporation | Radiation-curable compositions containing hydroxy-terminated polyurethanes and an epoxy compound |
TW269017B (ko) * | 1992-12-21 | 1996-01-21 | Ciba Geigy Ag |
-
1995
- 1995-12-05 WO PCT/DE1995/001738 patent/WO1996018182A1/de active IP Right Grant
- 1995-12-05 KR KR1019970703829A patent/KR987000636A/ko active IP Right Grant
- 1995-12-05 CN CN95197504A patent/CN1122360C/zh not_active Expired - Fee Related
- 1995-12-05 JP JP8517247A patent/JPH10510401A/ja not_active Abandoned
- 1995-12-05 DE DE59505535T patent/DE59505535D1/de not_active Expired - Fee Related
- 1995-12-05 EP EP95940141A patent/EP0796488B1/de not_active Expired - Lifetime
- 1995-12-05 RU RU97111815/28A patent/RU2131624C1/ru not_active IP Right Cessation
-
1996
- 1996-12-05 US US08/849,465 patent/US5900286A/en not_active Expired - Fee Related
-
1997
- 1997-06-05 FI FI972392A patent/FI972392A0/fi unknown
Also Published As
Publication number | Publication date |
---|---|
WO1996018182A1 (de) | 1996-06-13 |
FI972392L (fi) | 1997-06-05 |
JPH10510401A (ja) | 1998-10-06 |
EP0796488A1 (de) | 1997-09-24 |
US5900286A (en) | 1999-05-04 |
CN1174622A (zh) | 1998-02-25 |
CN1122360C (zh) | 2003-09-24 |
EP0796488B1 (de) | 1999-03-31 |
RU2131624C1 (ru) | 1999-06-10 |
DE59505535D1 (de) | 1999-05-06 |
FI972392A0 (fi) | 1997-06-05 |
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