[go: up one dir, main page]

KR870002442A - 프루브 검사방법 - Google Patents

프루브 검사방법 Download PDF

Info

Publication number
KR870002442A
KR870002442A KR1019860006704A KR860006704A KR870002442A KR 870002442 A KR870002442 A KR 870002442A KR 1019860006704 A KR1019860006704 A KR 1019860006704A KR 860006704 A KR860006704 A KR 860006704A KR 870002442 A KR870002442 A KR 870002442A
Authority
KR
South Korea
Prior art keywords
probe
metal film
height
contact
stage
Prior art date
Application number
KR1019860006704A
Other languages
English (en)
Other versions
KR900001040B1 (ko
Inventor
츠토무 미야자키
히사히토 에토오
신 토자와
Original Assignee
와타리 스기이찌로
가부시끼 가이샤 도오시바
야마모또 히로시
도오시바-마이크로 캄퓨터 엔지니어링 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60178721A external-priority patent/JPS6239021A/ja
Priority claimed from JP60178732A external-priority patent/JPS6239022A/ja
Application filed by 와타리 스기이찌로, 가부시끼 가이샤 도오시바, 야마모또 히로시, 도오시바-마이크로 캄퓨터 엔지니어링 코포레이션 filed Critical 와타리 스기이찌로
Publication of KR870002442A publication Critical patent/KR870002442A/ko
Application granted granted Critical
Publication of KR900001040B1 publication Critical patent/KR900001040B1/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

내용 없음

Description

프루브 검사방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 프루브 검사방법의 일실시예를 구현하기 위한 검사장치의 개략도.
제2도는 제1도에 따른 검사장치에 주컴퓨터를 연결시킨 개략도.
제5a 및 제5b도는 프루브 검사장치의 측면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 테스터 2 : 프루브장치
3 : 프루브카드 4 : 반도체웨이퍼
5 : 스테이지 6 : CPU
7 : 주컴퓨터 9-12 : IC칩
14 : 탐침 16 : 스테이지제어유니트
17 : 릴레이 18 : 계측기
19 : 전류계 20 : 가변전원공급기

Claims (2)

  1. 프루브카드를 이용하여 IC칩의 특성을 점검하는 프루브 검사방법에 있어서, 칩영역위에 금속필름이 형성된 반도체웨이퍼를 지지하는 스테이지를 주기적으로 상승시키고, 상기 스테이지위에 설치된 프루브카드에 설치된 다수개의 탐침중에서 상기 금속필름에 처음 접촉되는 탐침의 첨부 높이와 나머지 모든 탐침이 상기 금속필름과 접촉하는 높이 사이의 높이차를 산출하며, 나머지 모든 탐침이 상기 금속필름과 접촉되었을 때 상기 각 탐침과 금속필름 사이의 접촉저항을 구하고, 상기 높이차와 접촉저항이 각각 미리 정해진 수치와 비교되어 탐침의 높이차와 접촉저항이 허용치 이내로 되어 있는가를 검출하도록 되어 있음을 특징으로 하는 프루브 검사방법.
  2. 반도체 IC칩의 특성을 점검하기 위한 프루브 검사방법에 있어서, 칩영역위에 금속필름이 형성된 반도체 웨이퍼를 지지하는 스테이지를 주기적으로 상승시키고, 상기 스테이지위에 설치된 프루브카드에 설치된 다수의 탐침중에서 상기 금속필름에 처음 접촉되는 탐침첨부의 높이와 나머지 모든 탐침이 상기 금속필름과 접촉하는 높이 사이의 높이차를 산출하며, 상기 스테이지를 나머지 탐침이 상기 금속필름과 접촉된 위치로부터 예정된 구동영역만큼 상승시키고, 상기 스테이지가 예정된 구동영역만큼 상승되었을 때 각 탐침과 금속필픔 사이의 접촉저항을 구하며, 상기 높이차와 접촉저항이 각각 미리 정해진 수치와 비교되어 탐침의 높이차와 접촉저항이 허용치 이내로 되어 있는가를 검출하도록 되어 있음을 특징으로 하는 프루브 검사방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860006704A 1985-08-14 1986-08-14 프루브 검사방법 KR900001040B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP60178721A JPS6239021A (ja) 1985-08-14 1985-08-14 プロ−ブテスト方法
JP60-178732 1985-08-14
JP60-178721 1985-08-14
JP178732 1985-08-14
JP178721 1985-08-14
JP60178732A JPS6239022A (ja) 1985-08-14 1985-08-14 プロ−ブテスト方法

Publications (2)

Publication Number Publication Date
KR870002442A true KR870002442A (ko) 1987-03-31
KR900001040B1 KR900001040B1 (ko) 1990-02-26

Family

ID=26498811

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860006704A KR900001040B1 (ko) 1985-08-14 1986-08-14 프루브 검사방법

Country Status (2)

Country Link
US (1) US4780836A (ko)
KR (1) KR900001040B1 (ko)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US4842973A (en) * 1988-04-08 1989-06-27 Xerox Corporation Vacuum deposition of selenium alloy
GB8820042D0 (en) * 1988-08-24 1988-09-28 Bath Scient Ltd Circuit testing
US5060371A (en) * 1988-10-05 1991-10-29 Applied Precision, Inc. Method of making probe cards
US4918374A (en) * 1988-10-05 1990-04-17 Applied Precision, Inc. Method and apparatus for inspecting integrated circuit probe cards
JPH02237047A (ja) * 1989-03-09 1990-09-19 Mitsubishi Electric Corp 半導体試験装置
US5019771A (en) * 1990-05-09 1991-05-28 Knights Technology, Inc. Contact sensing for integrated circuit testing
US5057772A (en) * 1990-05-29 1991-10-15 Electro Scientific Industries, Inc. Method and system for concurrent electronic component testing and lead verification
JP3208734B2 (ja) * 1990-08-20 2001-09-17 東京エレクトロン株式会社 プローブ装置
EP0547251A1 (en) * 1991-12-14 1993-06-23 International Business Machines Corporation A method for testing a micro circuit
US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5550480A (en) * 1994-07-05 1996-08-27 Motorola, Inc. Method and means for controlling movement of a chuck in a test apparatus
US5777485A (en) * 1995-03-20 1998-07-07 Tokyo Electron Limited Probe method and apparatus with improved probe contact
US5821784A (en) * 1995-12-29 1998-10-13 Intel Corporation Method and apparatus for generating 2/N mode bus clock signals
US5834956A (en) 1995-12-29 1998-11-10 Intel Corporation Core clock correction in a 2/N mode clocking scheme
US5802132A (en) * 1995-12-29 1998-09-01 Intel Corporation Apparatus for generating bus clock signals with a 1/N characteristic in a 2/N mode clocking scheme
WO1997027489A1 (en) * 1996-01-24 1997-07-31 Intel Corporation Improved method and apparatus for scrubbing the bond pads of an integrated circuit during wafer sort
US5773987A (en) * 1996-02-26 1998-06-30 Motorola, Inc. Method for probing a semiconductor wafer using a motor controlled scrub process
US5862373A (en) * 1996-09-06 1999-01-19 Intel Corporation Pad cells for a 2/N mode clocking scheme
US5826067A (en) * 1996-09-06 1998-10-20 Intel Corporation Method and apparatus for preventing logic glitches in a 2/n clocking scheme
JPH10335395A (ja) * 1997-05-28 1998-12-18 Advantest Corp プローブカードの接触位置検出方法
US6298312B1 (en) * 1998-07-22 2001-10-02 Taiwan Semiconductor Manufacturing Company, Ltd. Method of determining the tip angle of a probe card needle
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US7218127B2 (en) * 2004-02-18 2007-05-15 Formfactor, Inc. Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component
KR100790817B1 (ko) * 2006-12-06 2008-01-03 삼성전자주식회사 반도체 제조관리 시스템
US20120256651A1 (en) * 2011-04-08 2012-10-11 International Business Machines Corporation Test structure for parallel test implemented with one metal layer
JP5947647B2 (ja) * 2012-07-25 2016-07-06 株式会社日本マイクロニクス プローブカード、及び検査装置
IT202000012556A1 (it) * 2020-05-27 2021-11-27 Crea Collaudi Elettr Automatizzati Srl Sistema di sicurezza per scheda sonda ad aghi per test ad alta tensione ed alta corrente su dispositivi a semiconduttore di potenza e relativa macchina di test.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835381A (en) * 1969-02-14 1974-09-10 Tieco Inc Probe card including a multiplicity of probe contacts and methods of making
US4038599A (en) * 1974-12-30 1977-07-26 International Business Machines Corporation High density wafer contacting and test system
US4045737A (en) * 1975-12-22 1977-08-30 Charles Wheeler Coberly Integrated circuit probe
US4195259A (en) * 1978-04-04 1980-03-25 Texas Instruments Incorporated Multiprobe test system and method of using same
US4523144A (en) * 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer

Also Published As

Publication number Publication date
US4780836A (en) 1988-10-25
KR900001040B1 (ko) 1990-02-26

Similar Documents

Publication Publication Date Title
KR870002442A (ko) 프루브 검사방법
KR940008039A (ko) 반도체테스트장치, 반도체테스트회로칩 및 프로브카드
US6043668A (en) Planarity verification system for integrated circuit test probes
KR870000599A (ko) 반도체 검사장치 및 반도체 검사방법
JPH04130639A (ja) プローブカードの触針とウェーハとの接触検出方法および検出装置
KR970071021A (ko) 매트릭스 구조를 이용한 신호선의 단선 단락 검사장치 및 검사방법
KR960039253A (ko) 반도체 시험 장치
KR970072255A (ko) 간단한 검사용 배선을 갖고 짧은 시간에 검사될 수 있는 반도체 웨이퍼상의 반도체 장치
US6452410B1 (en) Apparatus and method for electrolytic bare board testing
KR890012370A (ko) 반도체 장치
KR890008960A (ko) 전기적 프로우빙 시험 장치
KR960043071A (ko) 반도체 장치의 검사방법
JPS54112174A (en) Testing method for semiconductor device
KR0154835B1 (ko) 표시 장치용 측정 패턴
KR900010355A (ko) 액정 모듈의 특성 검사방법 및 장치
JPH0412468Y2 (ko)
KR970022342A (ko) 반도체 장치의 테스트 장치
KR100231481B1 (ko) 프로브패드
JP2002214274A (ja) 回路配線の検査方法
KR200145298Y1 (ko) 탐침 확인용 패드(pad)가 내장된 반도체 칩
KR970015875A (ko) 반도체 소자의 프로빙 에러 체크 방법
KR0141956B1 (ko) 웨이퍼 테스트용 프로브 카드의 프로빙 상태 감지장치
JPH10253686A (ja) プリント配線板検査装置
KR940008040A (ko) 반도체 집적회로기판 제조 및 검사방법과 그 기판의 반제품
JPS61208840A (ja) 半導体チツプ検出方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19860814

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19860814

Comment text: Request for Examination of Application

PG1501 Laying open of application
G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19900125

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 19900518

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 19900816

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 19900816

End annual number: 3

Start annual number: 1

PR1001 Payment of annual fee

Payment date: 19930215

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 19940204

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 19950222

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 19960223

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 19970226

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 19971224

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 19990126

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20000127

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20010130

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20020129

Start annual number: 13

End annual number: 13

FPAY Annual fee payment

Payment date: 20030130

Year of fee payment: 14

PR1001 Payment of annual fee

Payment date: 20030130

Start annual number: 14

End annual number: 14

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee