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KR890012370A - 반도체 장치 - Google Patents

반도체 장치 Download PDF

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Publication number
KR890012370A
KR890012370A KR1019890000575A KR890000575A KR890012370A KR 890012370 A KR890012370 A KR 890012370A KR 1019890000575 A KR1019890000575 A KR 1019890000575A KR 890000575 A KR890000575 A KR 890000575A KR 890012370 A KR890012370 A KR 890012370A
Authority
KR
South Korea
Prior art keywords
semiconductor device
semiconductor devices
determination pattern
width
conductive pads
Prior art date
Application number
KR1019890000575A
Other languages
English (en)
Other versions
KR910007510B1 (ko
Inventor
미치히로 이시카와
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR890012370A publication Critical patent/KR890012370A/ko
Application granted granted Critical
Publication of KR910007510B1 publication Critical patent/KR910007510B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

내용 없음.

Description

반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 사용되는 도통판단 패턴의 예를 나타낸 도면.
제2도는 본 발명에 따른 탐침과 프로빙패드의 위치정하점검 방법을 설명하기 위한 도면.
제3도는 반도체칩내의 도통판단패턴의 배치를 나타낸 배치도.

Claims (2)

  1. 탐침(21,22)과 프로빙패드의 위치정합이 정확하게 수행되는가 수행되지 않는가의 여부를 판단하기 위한 판단패턴(1)을 갖춘 반도체장치에 있어서, 상기 판단패턴(1)이 서로 전기적으로 접속된 적어도 2개의 도전패드(2,3)로 구성되어 있고, 이 판단패턴(1)이 위치정합 판정영역내에 적어도 2장소(30a, 30b)에 설치되도록 된것을 특징으로 하는 반도체장치.
  2. 제1항에 있어서, 상기 2개의 도전패드(2,3)중 적어도 1개의 도전패드의 폭이 상기 프로빙패드의 폭보다도 좁게 형성된 것을 특징으로 하는 반도체 장치.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890000575A 1988-01-20 1989-01-20 반도체장치 KR910007510B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-10030 1988-01-20
JP63010030A JPH01184935A (ja) 1988-01-20 1988-01-20 半導体装置

Publications (2)

Publication Number Publication Date
KR890012370A true KR890012370A (ko) 1989-08-26
KR910007510B1 KR910007510B1 (ko) 1991-09-26

Family

ID=11738999

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890000575A KR910007510B1 (ko) 1988-01-20 1989-01-20 반도체장치

Country Status (5)

Country Link
US (1) US5014003A (ko)
EP (1) EP0325269B1 (ko)
JP (1) JPH01184935A (ko)
KR (1) KR910007510B1 (ko)
DE (1) DE68914005T2 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198756A (en) * 1991-07-29 1993-03-30 Atg-Electronics Inc. Test fixture wiring integrity verification device
JP2720688B2 (ja) * 1992-01-31 1998-03-04 ジェイエスアール株式会社 回路基板の検査方法
KR100272659B1 (ko) * 1997-06-28 2000-12-01 김영환 반도체 소자의 금속배선 선폭 측정방법
FR2770029B1 (fr) * 1997-10-22 2000-01-07 Sgs Thomson Microelectronics Plage de test a positionnement automatique de microsonde et procede de realisation d'une telle plage de test
US6175245B1 (en) 1998-06-25 2001-01-16 International Business Machines Corporation CMOS SOI contact integrity test method
JP2005091065A (ja) * 2003-09-16 2005-04-07 Oki Electric Ind Co Ltd 半導体装置への動作電圧供給装置及び動作電圧供給方法
KR100593647B1 (ko) * 2004-05-18 2006-06-28 삼성전자주식회사 프로브 센싱용 패드, 반도체 소자가 탑재된 기판 및 반도체 소자 검사 방법
US7323897B2 (en) * 2004-12-16 2008-01-29 Verigy (Singapore) Pte. Ltd. Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment
US20060158208A1 (en) * 2005-01-14 2006-07-20 Applied Materials, Inc. Prober tester
US6989682B1 (en) * 2005-03-16 2006-01-24 United Microelectronics Corp. Test key on a wafer
JP2007129108A (ja) * 2005-11-04 2007-05-24 Mitsubishi Electric Corp 半導体装置の検査方法
IT1397222B1 (it) 2009-12-30 2013-01-04 St Microelectronics Srl Metodo per controllare il corretto posizionamento di sonde di test su terminazioni di dispositivi elettronici integrati su semiconduttore e relativo dispositivo elettronico.
IT1402434B1 (it) * 2010-06-10 2013-09-04 St Microelectronics Srl Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3781683A (en) * 1971-03-30 1973-12-25 Ibm Test circuit configuration for integrated semiconductor circuits and a test system containing said configuration
US3974443A (en) * 1975-01-02 1976-08-10 International Business Machines Corporation Conductive line width and resistivity measuring system
US4266191A (en) * 1979-04-18 1981-05-05 Spano John D Test probe alignment apparatus
US4386459A (en) * 1980-07-11 1983-06-07 Bell Telephone Laboratories, Incorporated Electrical measurement of level-to-level misalignment in integrated circuits
DD226741A3 (de) * 1983-12-27 1985-08-28 Kontaktbau & Spezmaschbau Veb Einrichtung zum pruefen der lagerichtigkeit von transportierten bauteilen
JPS61199623A (ja) * 1985-03-01 1986-09-04 Nippon Telegr & Teleph Corp <Ntt> ウエハの位置検出方法およびウエハ
US4801869A (en) * 1987-04-27 1989-01-31 International Business Machines Corporation Semiconductor defect monitor for diagnosing processing-induced defects

Also Published As

Publication number Publication date
EP0325269A1 (en) 1989-07-26
US5014003A (en) 1991-05-07
DE68914005D1 (de) 1994-04-28
KR910007510B1 (ko) 1991-09-26
JPH01184935A (ja) 1989-07-24
DE68914005T2 (de) 1994-08-11
EP0325269B1 (en) 1994-03-23

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