IT1402434B1 - Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati - Google Patents
Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integratiInfo
- Publication number
- IT1402434B1 IT1402434B1 ITVI2010A000159A ITVI20100159A IT1402434B1 IT 1402434 B1 IT1402434 B1 IT 1402434B1 IT VI2010A000159 A ITVI2010A000159 A IT VI2010A000159A IT VI20100159 A ITVI20100159 A IT VI20100159A IT 1402434 B1 IT1402434 B1 IT 1402434B1
- Authority
- IT
- Italy
- Prior art keywords
- probe
- integrated circuits
- alignment structure
- testing integrated
- sensing alignment
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q1/00—Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q2304/00—Chemical means of detecting microorganisms
-
- C—CHEMISTRY; METALLURGY
- C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
- C12Q—MEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
- C12Q2326/00—Chromogens for determinations of oxidoreductase enzymes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R11/00—Electromechanical arrangements for measuring time integral of electric power or current, e.g. of consumption
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
- Health & Medical Sciences (AREA)
- Zoology (AREA)
- Wood Science & Technology (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Immunology (AREA)
- Molecular Biology (AREA)
- Microbiology (AREA)
- Biotechnology (AREA)
- Biochemistry (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Biophysics (AREA)
- General Health & Medical Sciences (AREA)
- Genetics & Genomics (AREA)
- Analytical Chemistry (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITVI2010A000159A IT1402434B1 (it) | 2010-06-10 | 2010-06-10 | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
US13/155,623 US9134367B2 (en) | 2010-06-10 | 2011-06-08 | Sensing structure of alignment of a probe for testing integrated circuits |
US14/754,906 US9880219B2 (en) | 2010-06-10 | 2015-06-30 | Sensing structure of alignment of a probe for testing integrated circuits |
US15/848,996 US10267849B2 (en) | 2010-06-10 | 2017-12-20 | Sensing structure of alignment of a probe for testing integrated circuits |
US16/296,052 US10746788B2 (en) | 2010-06-10 | 2019-03-07 | Sensing structure of alignment of a probe for testing integrated circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITVI2010A000159A IT1402434B1 (it) | 2010-06-10 | 2010-06-10 | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
Publications (2)
Publication Number | Publication Date |
---|---|
ITVI20100159A1 ITVI20100159A1 (it) | 2011-12-11 |
IT1402434B1 true IT1402434B1 (it) | 2013-09-04 |
Family
ID=43513875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITVI2010A000159A IT1402434B1 (it) | 2010-06-10 | 2010-06-10 | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
Country Status (2)
Country | Link |
---|---|
US (4) | US9134367B2 (it) |
IT (1) | IT1402434B1 (it) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1402434B1 (it) * | 2010-06-10 | 2013-09-04 | St Microelectronics Srl | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
US8633721B1 (en) * | 2010-11-17 | 2014-01-21 | Michael Ames | Test fixture utilizing a docking station and interchangeable cassettes |
US9110129B1 (en) | 2010-11-17 | 2015-08-18 | Michael Ames | Test fixture utilizing a docking station and interchangeable cassettes and method of use |
US9562943B2 (en) * | 2012-11-19 | 2017-02-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer temperature sensing methods and related semiconductor wafer |
KR20140128620A (ko) * | 2013-04-29 | 2014-11-06 | 에스케이하이닉스 주식회사 | 테스트 패드의 미스얼라인 검출 장치 |
US20150084659A1 (en) * | 2013-09-20 | 2015-03-26 | Infineon Technologies Ag | Contact arrangements and methods for detecting incorrect mechanical contacting of contact structures |
KR20150046476A (ko) * | 2013-10-22 | 2015-04-30 | 삼성전자주식회사 | 반도체 장치, 반도체 장치의 테스트 구조 및 반도체 장치의 테스트 방법 |
KR102184697B1 (ko) * | 2014-02-20 | 2020-12-01 | 에스케이하이닉스 주식회사 | 반도체 장치 |
JP6339834B2 (ja) * | 2014-03-27 | 2018-06-06 | 東京エレクトロン株式会社 | 基板検査装置 |
US9618574B2 (en) | 2014-06-06 | 2017-04-11 | Advantest Corporation | Controlling automated testing of devices |
US9995767B2 (en) | 2014-06-06 | 2018-06-12 | Advantest Corporation | Universal container for device under test |
US9678148B2 (en) | 2014-06-06 | 2017-06-13 | Advantest Corporation | Customizable tester having testing modules for automated testing of devices |
US9618570B2 (en) | 2014-06-06 | 2017-04-11 | Advantest Corporation | Multi-configurable testing module for automated testing of a device |
US9638749B2 (en) | 2014-06-06 | 2017-05-02 | Advantest Corporation | Supporting automated testing of devices in a test floor system |
KR20160076219A (ko) * | 2014-12-22 | 2016-06-30 | 에스케이하이닉스 주식회사 | 얼라인먼트 검사 장치 및 이를 포함하는 반도체 집적 회로 장치 |
KR102577263B1 (ko) * | 2015-10-08 | 2023-09-12 | 삼성전자주식회사 | 반도체 장치 |
US9570446B1 (en) | 2015-10-08 | 2017-02-14 | Samsung Electronics Co., Ltd. | Semiconductor device |
KR102600623B1 (ko) * | 2017-02-08 | 2023-11-08 | 삼성전자주식회사 | 프로브 카드 어셈블리 |
CN108663648A (zh) * | 2017-03-27 | 2018-10-16 | 富泰华工业(深圳)有限公司 | 调校探针位置的测试板及测试方法 |
US20210223288A1 (en) * | 2018-05-10 | 2021-07-22 | University Of Virginia Patent Foundation | System and method for integrating diode sensors on micromachined wafer probes |
US11099235B1 (en) | 2020-04-07 | 2021-08-24 | Winbond Electronics Corp. | Semiconductor device and method for detecting needle mark shifting |
KR102339087B1 (ko) * | 2021-07-07 | 2021-12-15 | (주)티에스이 | 오작동 방지 가능한 프로브 블록 어레이 테스트 장치 |
JP2023035702A (ja) * | 2021-09-01 | 2023-03-13 | 富士電機株式会社 | 試験方法 |
US12169208B2 (en) | 2021-11-30 | 2024-12-17 | Innovatum Instruments Inc. | Probe tip X-Y location identification using a charged particle beam |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01184935A (ja) * | 1988-01-20 | 1989-07-24 | Toshiba Corp | 半導体装置 |
US5065092A (en) * | 1990-05-14 | 1991-11-12 | Triple S Engineering, Inc. | System for locating probe tips on an integrated circuit probe card and method therefor |
US5977575A (en) * | 1992-04-27 | 1999-11-02 | Seiko Instruments Inc. | Semiconductor sensor device comprised of plural sensor chips connected to function as a unit |
US5406209A (en) * | 1993-02-04 | 1995-04-11 | Northern Telecom Limited | Methods and apparatus for testing circuit boards |
JP3165056B2 (ja) * | 1997-02-28 | 2001-05-14 | 日本電産リード株式会社 | 基板検査装置および基板検査方法 |
US8480580B2 (en) * | 1998-04-30 | 2013-07-09 | Abbott Diabetes Care Inc. | Analyte monitoring device and methods of use |
JP2000021939A (ja) * | 1998-06-29 | 2000-01-21 | Mitsubishi Electric Corp | 突起電極付半導体チップおよびその検査方法 |
US6876203B2 (en) * | 2001-06-11 | 2005-04-05 | Frederick K. Blades | Parallel insulation fault detection system |
DE10213609B4 (de) * | 2002-03-27 | 2006-02-09 | Infineon Technologies Ag | Elektrisches Bauelement mit einer Kontaktierungsfläche und Verfahren zum Ausbilden einer Kontaktierungsfläche auf einem Halbleitermaterial |
AU2003294419A1 (en) * | 2002-11-19 | 2004-06-15 | University Of Utah | Device and method for detecting anomolies in a wire and related sensing methods |
DE10339939B4 (de) * | 2003-08-29 | 2010-02-11 | Infineon Technologies Ag | Intergierte Schaltungsanordnung und Verfahren zur Herstellung und Beurteilung derselben |
JP2005183863A (ja) * | 2003-12-24 | 2005-07-07 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP4803966B2 (ja) * | 2004-03-31 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
KR100593647B1 (ko) | 2004-05-18 | 2006-06-28 | 삼성전자주식회사 | 프로브 센싱용 패드, 반도체 소자가 탑재된 기판 및 반도체 소자 검사 방법 |
WO2005122238A1 (ja) * | 2004-06-09 | 2005-12-22 | Renesas Technology Corp. | 半導体集積回路装置の製造方法 |
DE602004032455D1 (de) * | 2004-12-15 | 2011-06-09 | St Microelectronics Srl | Ein nichtflüchtiger Speicher mit Unterstützung von hochparallelem Test auf Waferebene |
KR100739629B1 (ko) * | 2005-12-02 | 2007-07-16 | 삼성전자주식회사 | 프로브 센싱용 패드 및 이를 이용한 프로브 니들 접촉 위치검사 방법. |
JP4800007B2 (ja) * | 2005-11-11 | 2011-10-26 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法およびプローブカード |
US7973380B2 (en) * | 2005-11-23 | 2011-07-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for providing metal extension in backside illuminated sensor for wafer level testing |
US8246910B2 (en) * | 2006-03-16 | 2012-08-21 | Universal Nanosensor Technologies Inc. | Dielectric sensing method and system |
US8067718B2 (en) * | 2006-05-04 | 2011-11-29 | Tektronix, Inc. | Method and apparatus for probing |
US7772866B2 (en) * | 2007-03-07 | 2010-08-10 | International Business Machines Corporation | Structure and method of mapping signal intensity to surface voltage for integrated circuit inspection |
WO2009048618A1 (en) * | 2007-10-11 | 2009-04-16 | Veraconnex, Llc | Probe card test apparatus and method |
US7759955B2 (en) * | 2007-12-21 | 2010-07-20 | Infineon Technologies Ag | Method and device for position detection using connection pads |
IT1398204B1 (it) * | 2010-02-16 | 2013-02-14 | St Microelectronics Srl | Sistema e metodo per eseguire il test elettrico di vie passanti nel silicio (tsv - through silicon vias). |
JP2011196934A (ja) * | 2010-03-23 | 2011-10-06 | Hitachi Ltd | 試験方法およびそれに用いられるインターポーザ |
IT1402434B1 (it) * | 2010-06-10 | 2013-09-04 | St Microelectronics Srl | Struttura di rilevamento dell'allineamento di una sonda atta a testare circuiti integrati |
ITMI20111418A1 (it) * | 2011-07-28 | 2013-01-29 | St Microelectronics Srl | Architettura di testing di circuiti integrati su un wafer |
-
2010
- 2010-06-10 IT ITVI2010A000159A patent/IT1402434B1/it active
-
2011
- 2011-06-08 US US13/155,623 patent/US9134367B2/en active Active
-
2015
- 2015-06-30 US US14/754,906 patent/US9880219B2/en active Active
-
2017
- 2017-12-20 US US15/848,996 patent/US10267849B2/en active Active
-
2019
- 2019-03-07 US US16/296,052 patent/US10746788B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US10746788B2 (en) | 2020-08-18 |
US9880219B2 (en) | 2018-01-30 |
US10267849B2 (en) | 2019-04-23 |
US20190204381A1 (en) | 2019-07-04 |
US20150301106A1 (en) | 2015-10-22 |
US20120068725A1 (en) | 2012-03-22 |
ITVI20100159A1 (it) | 2011-12-11 |
US20180113168A1 (en) | 2018-04-26 |
US9134367B2 (en) | 2015-09-15 |
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