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KR960039253A - 반도체 시험 장치 - Google Patents

반도체 시험 장치 Download PDF

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Publication number
KR960039253A
KR960039253A KR1019960012161A KR19960012161A KR960039253A KR 960039253 A KR960039253 A KR 960039253A KR 1019960012161 A KR1019960012161 A KR 1019960012161A KR 19960012161 A KR19960012161 A KR 19960012161A KR 960039253 A KR960039253 A KR 960039253A
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KR
South Korea
Prior art keywords
self
diagnosis
probe card
board
contact
Prior art date
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Application number
KR1019960012161A
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English (en)
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KR100208551B1 (ko
Inventor
가즈나리 스가
Original Assignee
오우라 히로시
가부시키가이샤 아드반테스트
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Application filed by 오우라 히로시, 가부시키가이샤 아드반테스트 filed Critical 오우라 히로시
Publication of KR960039253A publication Critical patent/KR960039253A/ko
Application granted granted Critical
Publication of KR100208551B1 publication Critical patent/KR100208551B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

프로브 카드 교환 기구로 자지 진단용 보드를 교환하여 자기 진단을 할 수 있는 웨이퍼 프로버 장치를 가진 반도체 시험 장치를 제공한다. 따라서 프로브카드 교환 기구를 갖춘 웨이퍼 프로버 장치를 가진 반도체 시험 장치에서 프로브 카드 교환 기구는 수동과 자동이 있지만 어느것에도 대응할 수 있도록 자기 진단용 보드(210)는 프로브 카드(170)의 형상과 동일하게 설치하였다. 프로그 링 접촉자(141)와 접촉하는 구성의 자기 진단용 보드(210)와 프로그링(130)내의 빈 면적보다 작은 자기 진단회로(230)를 설치하였다.

Description

반도체 시험 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 자기 진단용의 일실시예로서 프로브 카드 교환 기구로 자기 진단용 보드를 교환하고 자기 진단을 행하는 웨이퍼 프로버장치와 테스트 헤드 장치와 반도체 시험 장치에서 일부가 절단된 정면도, 제2도는 본 발명의 자기 진단용 회로를 장착한 자기 진단용 보드의 일실시예의 평면도.

Claims (1)

  1. 프로브 카드 교환 기구를 갖는 웨이퍼 프로버 장치를 포함하는 반도체 시험장치에 있어서, 프로브 카드 교환 기구의 수동과 자동의 어느것에도 대응할 수 있도록 프로브카드(170)의 형상과 동일한 자기 진단용 보드(210)와; 상기 자기 진단용 보드(210)가 프로그 링 접촉자(141)와 접촉하도록 설치한 자기 진단용 보드 접촉자(235)와; 상기 자기 진단용 보드 접촉자(235)와 전기적으로 접속된 자기 진단회로(230)와; 상기 프로그 링(130)내의 빈 면적보다 작게 만든 자기 진단회로(230)를 구비하는 것을 특징으로 하는 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960012161A 1995-04-28 1996-04-22 반도체 시험 장치 Expired - Fee Related KR100208551B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP12984995A JP3382059B2 (ja) 1995-04-28 1995-04-28 半導体試験装置
JP95-129849 1995-04-28

Publications (2)

Publication Number Publication Date
KR960039253A true KR960039253A (ko) 1996-11-21
KR100208551B1 KR100208551B1 (ko) 1999-07-15

Family

ID=15019772

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960012161A Expired - Fee Related KR100208551B1 (ko) 1995-04-28 1996-04-22 반도체 시험 장치

Country Status (5)

Country Link
US (1) US5747994A (ko)
JP (1) JP3382059B2 (ko)
KR (1) KR100208551B1 (ko)
DE (1) DE19616810C2 (ko)
TW (1) TW297930B (ko)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997027491A1 (fr) * 1996-01-22 1997-07-31 Advantest Corporation Tete d'essai pour dispositif d'essai de semi-conducteurs
JPH10185990A (ja) * 1996-07-31 1998-07-14 Ando Electric Co Ltd Ｉｃテスタ用テストボード
US5949239A (en) * 1996-09-27 1999-09-07 Altera Corporation Test head apparatus for use in electronic device test equipment
US6078187A (en) * 1997-05-23 2000-06-20 Credence Systems Corporation Hemispherical test head for integrated circuit tester employing radially distributed circuit cards
US5986447A (en) * 1997-05-23 1999-11-16 Credence Systems Corporation Test head structure for integrated circuit tester
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
JPH11233575A (ja) * 1998-02-12 1999-08-27 Rohm Co Ltd 半導体デバイス測定用の回路基板
US6181148B1 (en) 1998-07-20 2001-01-30 International Business Machines Corporation Automated test head interface board locking and docking mechanism
US6330744B1 (en) * 1999-07-12 2001-12-18 Pjc Technologies, Inc. Customized electrical test probe head using uniform probe assemblies
US6462532B1 (en) 2000-01-07 2002-10-08 Third Millennium Test Solutions Automated testing equipment having a modular offset test head with split backplane
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
KR20030058367A (ko) * 2001-12-31 2003-07-07 (주) 쎄믹스 반도체 웨이퍼 프로버의 프로버 카드 교환 장치
JP4134940B2 (ja) * 2004-04-22 2008-08-20 トヨタ自動車株式会社 パフォーマンスボードの診断方法と診断装置
JP3875254B2 (ja) * 2005-05-30 2007-01-31 株式会社アドバンテスト 半導体試験装置及びインターフェースプレート
JP5021924B2 (ja) * 2005-09-27 2012-09-12 株式会社アドバンテスト パフォーマンスボード、試験装置及び試験方法
US7378860B2 (en) * 2006-09-22 2008-05-27 Verigy (Singapore) Pte. Ltd. Wafer test head architecture and method of use
US8248091B2 (en) * 2006-10-20 2012-08-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal array type probe card design for semiconductor device testing
JP4972418B2 (ja) * 2007-01-29 2012-07-11 株式会社アドバンテスト 試験装置およびプローブカード
US7610538B2 (en) * 2007-04-13 2009-10-27 Advantest Corporation Test apparatus and performance board for diagnosis
TW200846682A (en) * 2007-05-25 2008-12-01 King Yuan Electronics Co Ltd A probe card assembly with ZIF connectors, method of assembling, wafer testing system and wafer testing method introduced by the same
TW200846688A (en) * 2007-05-25 2008-12-01 King Yuan Electronics Co Ltd A testboard with ZIF connectors, method of assembling, integrated circuit testing system and testing method introduced by the same
JP5379685B2 (ja) 2007-06-29 2013-12-25 株式会社アドバンテスト 試験装置
US8424594B2 (en) * 2007-12-10 2013-04-23 Presto Engineering, Inc. Apparatus for thermal control in the analysis of electronic devices
TWI401449B (en) * 2008-12-03 2013-07-11 Semiconductor testing system
JP6496142B2 (ja) * 2014-12-26 2019-04-03 株式会社ヨコオ 交換用コンタクトユニット及び検査治具
JP6758229B2 (ja) 2017-03-16 2020-09-23 東京エレクトロン株式会社 検査装置の診断方法および検査システム
KR102599603B1 (ko) 2021-07-15 2023-11-07 한성현 분체포대 자동 개포장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3541440A (en) * 1967-08-22 1970-11-17 Rca Corp Use in an automatic testing system of a simulator of an article being tested for testing the testing system
US3599092A (en) * 1970-03-12 1971-08-10 Rca Corp Kinescope simulator used in checking an automatic testing system
US4918374A (en) * 1988-10-05 1990-04-17 Applied Precision, Inc. Method and apparatus for inspecting integrated circuit probe cards
US5104277A (en) * 1989-04-06 1992-04-14 Hewlett-Packard Company Method and apparatus for automatically changing printed circuit board test fixtures
US5068601A (en) * 1991-02-11 1991-11-26 Credence Systems Corporation Dual function cam-ring system for DUT board parallel electrical inter-connection and prober/handler docking
US5489843A (en) * 1991-07-23 1996-02-06 Vlsi Technology, Inc. Apparatus and method for testing the calibration of electronic package lead inspection system
US5448164A (en) * 1992-12-24 1995-09-05 Delco Electronics Corp. Electrical test apparatus and method of checking the apparatus

Also Published As

Publication number Publication date
JPH08306750A (ja) 1996-11-22
KR100208551B1 (ko) 1999-07-15
US5747994A (en) 1998-05-05
TW297930B (ko) 1997-02-11
DE19616810A1 (de) 1996-10-31
DE19616810C2 (de) 2001-03-01
JP3382059B2 (ja) 2003-03-04

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