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KR20050118302A - 반도체 웨이퍼 가공용 베이스 필름 - Google Patents

반도체 웨이퍼 가공용 베이스 필름 Download PDF

Info

Publication number
KR20050118302A
KR20050118302A KR1020057018820A KR20057018820A KR20050118302A KR 20050118302 A KR20050118302 A KR 20050118302A KR 1020057018820 A KR1020057018820 A KR 1020057018820A KR 20057018820 A KR20057018820 A KR 20057018820A KR 20050118302 A KR20050118302 A KR 20050118302A
Authority
KR
South Korea
Prior art keywords
film
semiconductor wafer
base film
less
wafer processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020057018820A
Other languages
English (en)
Korean (ko)
Inventor
고지 후루야
Original Assignee
데이진 듀폰 필름 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 데이진 듀폰 필름 가부시키가이샤 filed Critical 데이진 듀폰 필름 가부시키가이샤
Publication of KR20050118302A publication Critical patent/KR20050118302A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020057018820A 2003-04-08 2004-04-06 반도체 웨이퍼 가공용 베이스 필름 Ceased KR20050118302A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003103908 2003-04-08
JPJP-P-2003-00103908 2003-04-08

Publications (1)

Publication Number Publication Date
KR20050118302A true KR20050118302A (ko) 2005-12-16

Family

ID=33156837

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057018820A Ceased KR20050118302A (ko) 2003-04-08 2004-04-06 반도체 웨이퍼 가공용 베이스 필름

Country Status (5)

Country Link
JP (1) JPWO2004090962A1 (zh)
KR (1) KR20050118302A (zh)
CN (1) CN1771585A (zh)
TW (1) TW200426934A (zh)
WO (1) WO2004090962A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100944274B1 (ko) * 2008-11-28 2010-02-25 스템코 주식회사 연성 회로 기판 및 그 제조 방법, 상기 연성 회로 기판을 포함하는 반도체 패키지 및 그 제조 방법
WO2009131363A3 (ko) * 2008-04-21 2010-03-11 (주)Lg화학 점착 필름 및 이를 사용한 백그라인딩 방법
KR101494682B1 (ko) * 2006-04-03 2015-02-23 군제 가부시키가이샤 반도체 웨이퍼의 백그라인드 공정에 이용하는 표면 보호 테이프 및 표면 보호 테이프용 기판 필름
KR20170131504A (ko) * 2015-03-24 2017-11-29 후루카와 덴키 고교 가부시키가이샤 반도체 가공용 테이프

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666565B2 (ja) * 2003-10-06 2011-04-06 日東電工株式会社 半導体ウエハ加工用保護シート及び半導体ウエハの裏面研削方法
JP4622360B2 (ja) * 2004-07-23 2011-02-02 東レ株式会社 積層ポリエステルフィルム
JP2006316218A (ja) * 2005-05-16 2006-11-24 Teijin Dupont Films Japan Ltd 二軸配向ポリエステルフィルム
JP4907965B2 (ja) * 2005-11-25 2012-04-04 浜松ホトニクス株式会社 レーザ加工方法
JP5030461B2 (ja) * 2006-04-03 2012-09-19 グンゼ株式会社 半導体ウェハの裏面研削に用いる表面保護テープ用基材フィルム
JP2008047558A (ja) * 2006-08-10 2008-02-28 Nitto Denko Corp 反り抑制ウエハ研削用粘着シート
JP5080039B2 (ja) * 2006-08-21 2012-11-21 帝人デュポンフィルム株式会社 自動車駆動モーター用二軸配向ポリエステルフィルム
JP5008999B2 (ja) * 2007-02-06 2012-08-22 リンテック株式会社 ダイシングテープおよび半導体装置の製造方法
JP5014909B2 (ja) * 2007-07-24 2012-08-29 リンテック株式会社 印刷用積層シート
JP5249796B2 (ja) * 2009-01-19 2013-07-31 帝人デュポンフィルム株式会社 フレキシブルプリント回路基板補強用フィルム、フレキシブルプリント回路基板補強板およびフレキシブルプリント回路基板積層体
TWI418604B (zh) * 2010-11-17 2013-12-11 Furukawa Electric Co Ltd Semiconductor wafer processing tape
JP2015189960A (ja) * 2014-03-29 2015-11-02 三菱樹脂株式会社 ポリエステルフィルム
JP6295135B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP2017005072A (ja) * 2015-06-09 2017-01-05 日東電工株式会社 半導体ウエハ保護用粘着シート
JP6109356B1 (ja) * 2015-11-07 2017-04-05 三菱樹脂株式会社 積層ポリエステルフィルム
JP7100957B2 (ja) * 2015-12-15 2022-07-14 積水化学工業株式会社 半導体保護テープ
JP1574161S (zh) * 2016-08-31 2017-04-17
SG11201906507PA (en) * 2018-03-28 2019-11-28 Furukawa Electric Co Ltd Tape for semiconductor processing
JP7400263B2 (ja) * 2018-08-23 2023-12-19 東レ株式会社 フィルム、及びフィルムの製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3169407B2 (ja) * 1991-12-24 2001-05-28 三井化学株式会社 半導体ウェハ裏面の金属蒸着方法
JPH10214801A (ja) * 1997-01-31 1998-08-11 Teijin Ltd ダイシングテープ
JP2002270560A (ja) * 2001-03-07 2002-09-20 Lintec Corp ウエハの加工方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101494682B1 (ko) * 2006-04-03 2015-02-23 군제 가부시키가이샤 반도체 웨이퍼의 백그라인드 공정에 이용하는 표면 보호 테이프 및 표면 보호 테이프용 기판 필름
WO2009131363A3 (ko) * 2008-04-21 2010-03-11 (주)Lg화학 점착 필름 및 이를 사용한 백그라인딩 방법
KR100944274B1 (ko) * 2008-11-28 2010-02-25 스템코 주식회사 연성 회로 기판 및 그 제조 방법, 상기 연성 회로 기판을 포함하는 반도체 패키지 및 그 제조 방법
KR20170131504A (ko) * 2015-03-24 2017-11-29 후루카와 덴키 고교 가부시키가이샤 반도체 가공용 테이프

Also Published As

Publication number Publication date
TW200426934A (en) 2004-12-01
TWI294646B (zh) 2008-03-11
WO2004090962A1 (ja) 2004-10-21
JPWO2004090962A1 (ja) 2006-07-06
CN1771585A (zh) 2006-05-10

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Patent event date: 20051001

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