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JPS6411355A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS6411355A
JPS6411355A JP16679987A JP16679987A JPS6411355A JP S6411355 A JPS6411355 A JP S6411355A JP 16679987 A JP16679987 A JP 16679987A JP 16679987 A JP16679987 A JP 16679987A JP S6411355 A JPS6411355 A JP S6411355A
Authority
JP
Japan
Prior art keywords
grain
molding material
grain diameter
resistance
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16679987A
Other languages
Japanese (ja)
Other versions
JP2633856B2 (en
Inventor
Masaji Ogata
Masanori Segawa
Hidetoshi Abe
Hiroyuki Hozoji
Shigeo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62166799A priority Critical patent/JP2633856B2/en
Publication of JPS6411355A publication Critical patent/JPS6411355A/en
Application granted granted Critical
Publication of JP2633856B2 publication Critical patent/JP2633856B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To enhance the resistance to a crack, the resistance to heat of a solder and the reliability of moistureproofness by a method wherein this device is sealed by using a thermoset molding material where a large quantity of spherical molten silica whose grain diameter, grain-size distribution and specific surface area are specified is mixed. CONSTITUTION:A spherical filler which is used as a molding material for sealing a semiconductor is prepared by mixing an epoxy resin or a polyimide or polyaminobismaleimide thermoset resin with more than 80wt.% of spherical molten silica having the following characteristics: its average grain diameter is within a range of 5-15mum; its maximum grain diameter is less than 100mum; if its grain-size distribution is expressed by using an RRS grain-size diagram., at least more than 60wt.% of an intermediate grain diameter excluding a coarse grain part and a fine grain part displays the linearity and its gradient n is less than 1.0; its average specific surface area is less than 4m<2>/g. The fluidity, the hardening performance and the molding workability of this molding material are excellent; a resin seal semiconductor manufactured by using this molding material displays the good reliability regarding the resistance to a thermal shock, the moistureproofness or the like.
JP62166799A 1987-07-06 1987-07-06 Resin-sealed semiconductor device Expired - Fee Related JP2633856B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62166799A JP2633856B2 (en) 1987-07-06 1987-07-06 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62166799A JP2633856B2 (en) 1987-07-06 1987-07-06 Resin-sealed semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP26403296A Division JP2760348B2 (en) 1996-10-04 1996-10-04 Thermosetting resin molding material

Publications (2)

Publication Number Publication Date
JPS6411355A true JPS6411355A (en) 1989-01-13
JP2633856B2 JP2633856B2 (en) 1997-07-23

Family

ID=15837896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62166799A Expired - Fee Related JP2633856B2 (en) 1987-07-06 1987-07-06 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JP2633856B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397401A (en) * 1992-06-29 1995-03-14 Canon Kabushiki Kaisha Semiconductor apparatus covered with a sealing resin composition
JPH0774290A (en) * 1993-09-03 1995-03-17 Rohm Co Ltd Packaging material for electronic device
JP2001151866A (en) * 1999-11-30 2001-06-05 Hitachi Chem Co Ltd Epoxy resin molding compound for sealing use and electronic part device
JP2002275353A (en) * 2001-03-21 2002-09-25 Toray Ind Inc Epoxy resin composition for sealing semiconductor, and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113642A (en) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing use
JPS6296569A (en) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk Semiconductor sealing resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113642A (en) * 1984-11-09 1986-05-31 Sumitomo Bakelite Co Ltd Epoxy resin composition for semiconductor sealing use
JPS6296569A (en) * 1985-10-24 1987-05-06 Denki Kagaku Kogyo Kk Semiconductor sealing resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397401A (en) * 1992-06-29 1995-03-14 Canon Kabushiki Kaisha Semiconductor apparatus covered with a sealing resin composition
JPH0774290A (en) * 1993-09-03 1995-03-17 Rohm Co Ltd Packaging material for electronic device
US5698904A (en) * 1993-09-03 1997-12-16 Rohm Co., Ltd. Packaging material for electronic components
JP2001151866A (en) * 1999-11-30 2001-06-05 Hitachi Chem Co Ltd Epoxy resin molding compound for sealing use and electronic part device
JP2002275353A (en) * 2001-03-21 2002-09-25 Toray Ind Inc Epoxy resin composition for sealing semiconductor, and semiconductor device

Also Published As

Publication number Publication date
JP2633856B2 (en) 1997-07-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees