JPS5723625A - Epoxy resin composition and resin-sealed semiconductor device - Google Patents
Epoxy resin composition and resin-sealed semiconductor deviceInfo
- Publication number
- JPS5723625A JPS5723625A JP9691380A JP9691380A JPS5723625A JP S5723625 A JPS5723625 A JP S5723625A JP 9691380 A JP9691380 A JP 9691380A JP 9691380 A JP9691380 A JP 9691380A JP S5723625 A JPS5723625 A JP S5723625A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pref
- epoxy
- group
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 abstract 5
- 239000011347 resin Substances 0.000 abstract 5
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- 229920003986 novolac Polymers 0.000 abstract 2
- 229920001296 polysiloxane Polymers 0.000 abstract 2
- 125000005372 silanol group Chemical group 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 150000002460 imidazoles Chemical class 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 239000005011 phenolic resin Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To prepare the titled composition having excellent moisture resistance and processability such as marking characteristics, and suitable for the sealing of semiconductor devices, by adding a silanol-group containing silicone compound together with a specific curing agent, a specific cure accelerator, and an inorganic filler, to the base resin.
CONSTITUTION: A resin component obtained by compounding (A) an epoxy resin (esp. an epoxy-novolak resin having an epoxy equivalent of 170W300) with (B) a phenolic resin curing agent or an acid anhydride curing agent (pref. phenolic novolak resin) wherein the ratio of the pholic OH group to the epoxy group of the component (A) is pref. 0.8W1.2 is mixed with (C) pref. 0.1W5wt% of a cure accelerator selected from imidazoles and tert-amines, (D) 0.05W5wt% of a silanol- group-containing silicone compound, and (E) pref. 150W400pts.wt., based on 100pts.wt. of the resin component, of an inorganic filler (perf. quartz glass powder, etc.).
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9691380A JPS5723625A (en) | 1980-07-17 | 1980-07-17 | Epoxy resin composition and resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9691380A JPS5723625A (en) | 1980-07-17 | 1980-07-17 | Epoxy resin composition and resin-sealed semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5723625A true JPS5723625A (en) | 1982-02-06 |
Family
ID=14177594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9691380A Pending JPS5723625A (en) | 1980-07-17 | 1980-07-17 | Epoxy resin composition and resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5723625A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172541A (en) * | 1983-03-23 | 1984-09-29 | Sumitomo Bakelite Co Ltd | Mold-releasable resin composition |
| JPS61166823A (en) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | Resin composition for sealing |
| JPH01242616A (en) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPH01287131A (en) * | 1988-03-23 | 1989-11-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing and curing accelerator |
| JPH0820628A (en) * | 1994-07-07 | 1996-01-23 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
| EP1184419A3 (en) * | 2000-08-24 | 2003-04-02 | Nitto Denko Corporation | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| JP2013194198A (en) * | 2012-03-22 | 2013-09-30 | Hitachi Chemical Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
| JP2016138287A (en) * | 2016-04-22 | 2016-08-04 | 日立化成株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
-
1980
- 1980-07-17 JP JP9691380A patent/JPS5723625A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59172541A (en) * | 1983-03-23 | 1984-09-29 | Sumitomo Bakelite Co Ltd | Mold-releasable resin composition |
| JPS6236050B2 (en) * | 1983-03-23 | 1987-08-05 | Sumitomo Bakelite Co | |
| JPS61166823A (en) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | Resin composition for sealing |
| JPH01242616A (en) * | 1988-03-23 | 1989-09-27 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPH01287131A (en) * | 1988-03-23 | 1989-11-17 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing and curing accelerator |
| JPH0820628A (en) * | 1994-07-07 | 1996-01-23 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
| EP1184419A3 (en) * | 2000-08-24 | 2003-04-02 | Nitto Denko Corporation | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| SG128412A1 (en) * | 2000-08-24 | 2007-01-30 | Nitto Denko Corp | Resin composition for sealing semiconductor, semiconductor device using the same semiconductor waferand mounted structure of semiconductor device |
| JP2013194198A (en) * | 2012-03-22 | 2013-09-30 | Hitachi Chemical Co Ltd | Epoxy resin composition for sealing semiconductor and semiconductor device using the same |
| JP2016138287A (en) * | 2016-04-22 | 2016-08-04 | 日立化成株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS56136816A (en) | Epoxy resin composition | |
| EP1184419A3 (en) | Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device | |
| JPS5723625A (en) | Epoxy resin composition and resin-sealed semiconductor device | |
| JPS57212225A (en) | Epoxy resin composition for encapsulation of semiconductor | |
| DE3272268D1 (en) | Electrically insulating encapsulating substance for semiconductor devices | |
| JPS5690827A (en) | Heat-resistant resin composition | |
| JPS572329A (en) | Epoxy resin type composition and semiconductor device of resin sealing type | |
| JPS56122145A (en) | Resin composition for sealing semiconductor device | |
| JPS5359798A (en) | Epoxy resin composition of excellent warm-water resistance | |
| JPS5679170A (en) | Adhesive composition | |
| JPS5356294A (en) | Thermosetting resin composition | |
| JPS5740963A (en) | Resin-sealed semiconductor device | |
| JPS5740524A (en) | Epoxy resin composition | |
| JPS51135999A (en) | Epoxy res in composition | |
| JPS555929A (en) | Semiconductor sealing epoxy resin composition | |
| JPS52135673A (en) | Resin composition for semiconductor sealing | |
| JPS57100128A (en) | Epoxy resin composition | |
| JPS56135521A (en) | Rapid curing epoxy resin composition | |
| JPS578220A (en) | Epoxy resin composition and resin-sealed semiconductor device | |
| JPS5525461A (en) | Resin composition for encapsulation of semiconductor | |
| JPS57115853A (en) | Resin-sealed semiconductor device | |
| JPS57137333A (en) | Rubber composition | |
| JPS5740523A (en) | Epoxy resin composition | |
| JPS5266600A (en) | Epoxy resin compositions | |
| JPS53111398A (en) | Epoxy resin composition |