JPS6490253A - Epoxy resin composition and its production - Google Patents
Epoxy resin composition and its productionInfo
- Publication number
- JPS6490253A JPS6490253A JP24643187A JP24643187A JPS6490253A JP S6490253 A JPS6490253 A JP S6490253A JP 24643187 A JP24643187 A JP 24643187A JP 24643187 A JP24643187 A JP 24643187A JP S6490253 A JPS6490253 A JP S6490253A
- Authority
- JP
- Japan
- Prior art keywords
- component
- epoxy resin
- coated
- water
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain the title composition for sealing electronic components, excellent in water resistance, adhesiveness, flow properties, etc., by mixing an epoxy resin with a curing agent, an inorganic filler coated with a specified water-repellent surface treatment and coated with a coupling agent. CONSTITUTION:The surface of an inorganic filler (a) (e.g., fused silica) particles are coated with 0.1-2.0wt.%, based on component (a), water-repellent surface treatment of the formula (wherein R1-5 are each H, a 1-6C alkyl phenyl, l>=0, 1<=m<=3, 0<=n<=z, and m+n=2), e.g., dimethylpolysiloxysilazane, and then coated with 0.1-2.0wt.%, based on component (A), coupling agent (e.g., gamma- glycidoxypropyl-trimethoxysilane) to obtain component (C) comprising compo nents (a), (b) and (c). An epoxy resin (A) (e.g., solid cresol novolac epoxy resin) is mixed with a curing agent (B) (e.g., phenol novolac resin) and component C containing component (a) in an amount of 30-90wt.% based on the obtained composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62246431A JPH0725992B2 (en) | 1987-09-30 | 1987-09-30 | Epoxy resin composition and method for producing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62246431A JPH0725992B2 (en) | 1987-09-30 | 1987-09-30 | Epoxy resin composition and method for producing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6490253A true JPS6490253A (en) | 1989-04-06 |
JPH0725992B2 JPH0725992B2 (en) | 1995-03-22 |
Family
ID=17148379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62246431A Expired - Lifetime JPH0725992B2 (en) | 1987-09-30 | 1987-09-30 | Epoxy resin composition and method for producing the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0725992B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005171199A (en) * | 2003-12-15 | 2005-06-30 | Toyota Motor Corp | Finely basic alumina powder, method for producing the same, and resin composition |
JP2005171208A (en) * | 2003-12-15 | 2005-06-30 | Toyota Motor Corp | Filler and resin composition |
JP2010211968A (en) * | 2009-03-06 | 2010-09-24 | Somar Corp | Insulation paint for electronic component and electronic component using this |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5834824A (en) * | 1981-08-26 | 1983-03-01 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its production |
JPS59227926A (en) * | 1983-06-09 | 1984-12-21 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
JPS61219A (en) * | 1984-06-13 | 1986-01-06 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS61264044A (en) * | 1985-05-17 | 1986-11-21 | Hitachi Chem Co Ltd | Epoxy resin composition |
JPS6356518A (en) * | 1986-08-27 | 1988-03-11 | Rishiyou Kogyo Kk | Epoxy resin composition |
JPS63156816A (en) * | 1986-12-22 | 1988-06-29 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor |
JPS63299149A (en) * | 1987-05-28 | 1988-12-06 | Nitto Electric Ind Co Ltd | Semiconductor device |
-
1987
- 1987-09-30 JP JP62246431A patent/JPH0725992B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5834824A (en) * | 1981-08-26 | 1983-03-01 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and its production |
JPS59227926A (en) * | 1983-06-09 | 1984-12-21 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
JPS61219A (en) * | 1984-06-13 | 1986-01-06 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS61264044A (en) * | 1985-05-17 | 1986-11-21 | Hitachi Chem Co Ltd | Epoxy resin composition |
JPS6356518A (en) * | 1986-08-27 | 1988-03-11 | Rishiyou Kogyo Kk | Epoxy resin composition |
JPS63156816A (en) * | 1986-12-22 | 1988-06-29 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing semiconductor |
JPS63299149A (en) * | 1987-05-28 | 1988-12-06 | Nitto Electric Ind Co Ltd | Semiconductor device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005171199A (en) * | 2003-12-15 | 2005-06-30 | Toyota Motor Corp | Finely basic alumina powder, method for producing the same, and resin composition |
JP2005171208A (en) * | 2003-12-15 | 2005-06-30 | Toyota Motor Corp | Filler and resin composition |
JP2010211968A (en) * | 2009-03-06 | 2010-09-24 | Somar Corp | Insulation paint for electronic component and electronic component using this |
Also Published As
Publication number | Publication date |
---|---|
JPH0725992B2 (en) | 1995-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS56136816A (en) | Epoxy resin composition | |
KR910008003A (en) | Curing agent composition, method for preparing the same and thermosetting epoxy resin composition | |
ATE42263T1 (en) | PROCESS FOR THE MANUFACTURE OF A REACTION RESIN-CEMENT-BUILDING MATERIAL MIXTURE. | |
JPS57184242A (en) | Molding material for sealing electronic part | |
JPS6490253A (en) | Epoxy resin composition and its production | |
JPS6429416A (en) | Epoxy resin composition | |
ES2000138A6 (en) | Epoxy-phosphate ceramic compositions and methods of preparation. | |
JPS5679170A (en) | Adhesive composition | |
JPS5723625A (en) | Epoxy resin composition and resin-sealed semiconductor device | |
JPS57105447A (en) | Epoxy resin composition | |
JPS54159450A (en) | Adhesive composition for construction | |
JPS56122145A (en) | Resin composition for sealing semiconductor device | |
JPS57137330A (en) | Rubber composition | |
JPS57180626A (en) | Thermosetting resin composition | |
JPS57108124A (en) | Two-component epoxy resin composition | |
JPS5790072A (en) | Resist ink composition for chemical plating | |
JPS5755921A (en) | Water-resistant epoxy resin composition | |
JPS5747323A (en) | Epoxy resin composition having improved resistance to hot water at high temperature | |
JPS5742760A (en) | Epoxy resin composition | |
JPS57192428A (en) | One-pack type epoxy resin composition | |
JPS5467000A (en) | Transparent thermosetting resin composition | |
JPS57137333A (en) | Rubber composition | |
JPS56126950A (en) | Method of sealing semiconductor element with resin | |
JPS57174314A (en) | Epoxy resin composition | |
JPS6451424A (en) | One-pack epoxy resin composition |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment |
Free format text: PAYMENT UNTIL: 20080322 Year of fee payment: 13 |