JPS56149454A - Preparation of epoxy resin molding compound - Google Patents
Preparation of epoxy resin molding compoundInfo
- Publication number
- JPS56149454A JPS56149454A JP5343080A JP5343080A JPS56149454A JP S56149454 A JPS56149454 A JP S56149454A JP 5343080 A JP5343080 A JP 5343080A JP 5343080 A JP5343080 A JP 5343080A JP S56149454 A JPS56149454 A JP S56149454A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding compound
- filler
- temp
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 238000000465 moulding Methods 0.000 title abstract 4
- 150000001875 compounds Chemical class 0.000 title abstract 3
- 238000002360 preparation method Methods 0.000 title 1
- 239000000945 filler Substances 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 1
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To prepare the titled molding compound with excellent moldability, electrical characteristics and heat resistance, suitable for sealing a semiconductor device, by melting and mixing an epoxy resin, a curing agent and a filler at a specified temp. and crushing the resulting mixture followed by mixing with another component.
CONSTITUTION: A filler (e.g., silica or CaCO3) and an epoxy resin, or a filler, an epoxy resin and a curing agent (e.g., a bisphenol epoxy resin), are molten and mixed at a temp. at least 10°C higher than the solftening temp. or m.p. for 20min or more, and then crushed. The crushed product is mixed with another component of another molding compound.
EFFECT: The molding component is capable of being molded in direct contact with a semiconductor device, and has little influence on a rated value during semiconductor operation and good moldability.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343080A JPS56149454A (en) | 1980-04-21 | 1980-04-21 | Preparation of epoxy resin molding compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5343080A JPS56149454A (en) | 1980-04-21 | 1980-04-21 | Preparation of epoxy resin molding compound |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56149454A true JPS56149454A (en) | 1981-11-19 |
| JPS626587B2 JPS626587B2 (en) | 1987-02-12 |
Family
ID=12942618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5343080A Granted JPS56149454A (en) | 1980-04-21 | 1980-04-21 | Preparation of epoxy resin molding compound |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56149454A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0885752A (en) * | 1994-07-19 | 1996-04-02 | Sumitomo Chem Co Ltd | Epoxy resin composition and resin-encapsulated semiconductor device |
| JPH115890A (en) * | 1997-06-18 | 1999-01-12 | Hitachi Chem Co Ltd | Epoxy resin composition |
| US6733901B2 (en) | 2001-05-02 | 2004-05-11 | Sumitomo Bakelite Company Limited | Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device |
| WO2019106812A1 (en) * | 2017-11-30 | 2019-06-06 | 日立化成株式会社 | Compound powder |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313024Y2 (en) * | 1986-05-23 | 1991-03-26 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441956A (en) * | 1977-09-08 | 1979-04-03 | Asahi Chem Ind Co Ltd | Epoxy resin composition |
-
1980
- 1980-04-21 JP JP5343080A patent/JPS56149454A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5441956A (en) * | 1977-09-08 | 1979-04-03 | Asahi Chem Ind Co Ltd | Epoxy resin composition |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0885752A (en) * | 1994-07-19 | 1996-04-02 | Sumitomo Chem Co Ltd | Epoxy resin composition and resin-encapsulated semiconductor device |
| JPH115890A (en) * | 1997-06-18 | 1999-01-12 | Hitachi Chem Co Ltd | Epoxy resin composition |
| US6733901B2 (en) | 2001-05-02 | 2004-05-11 | Sumitomo Bakelite Company Limited | Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device |
| WO2019106812A1 (en) * | 2017-11-30 | 2019-06-06 | 日立化成株式会社 | Compound powder |
| JPWO2019106812A1 (en) * | 2017-11-30 | 2020-11-26 | 昭和電工マテリアルズ株式会社 | Compound powder |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS626587B2 (en) | 1987-02-12 |
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