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JPS57210647A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57210647A
JPS57210647A JP57077132A JP7713282A JPS57210647A JP S57210647 A JPS57210647 A JP S57210647A JP 57077132 A JP57077132 A JP 57077132A JP 7713282 A JP7713282 A JP 7713282A JP S57210647 A JPS57210647 A JP S57210647A
Authority
JP
Japan
Prior art keywords
parts
epoxy resin
undecen
diaza
bicyclo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57077132A
Other languages
Japanese (ja)
Inventor
Shunichi Hayashi
Matsuro Kanehara
Toku Nagasawa
Mikio Aizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP57077132A priority Critical patent/JPS57210647A/en
Publication of JPS57210647A publication Critical patent/JPS57210647A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve the moisture resistance of a semiconductor device at a high temperature by employing phenol novolak as a curing agent and sealing an element with epoxy resin containing 1.8-diaza-bicyclo(5.4.0)undecen-7 or the like as a curing accelerator. CONSTITUTION:A semiconductor element is sealed with an epoxy resin composition containing as a curing accelerator 1.8-diaza-bicyclo(5.4.0)undecen-7 or its derivatives in an epoxy resin composition with phenol novolak as a curing agent. For example, 100 parts of cresol novolak type epoxy resin, 50 parts of phenol novolak, 2.5 parts of 1.8-diaza-bicyclo(5.4.0)undecen-7, 2 parts of carbon black, 350 parts of amorphous silica powder, 1.8 part of silane coupling agent, and 2 parts of carnauva wax are kneaded with hot rolls at approx. 70-80 deg.C, the mixture is then cooled and pulverized, and the pulverized mixture is then used as sealing resin composition.
JP57077132A 1982-05-08 1982-05-08 Semiconductor device Pending JPS57210647A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57077132A JPS57210647A (en) 1982-05-08 1982-05-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57077132A JPS57210647A (en) 1982-05-08 1982-05-08 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP7770778A Division JPS555929A (en) 1978-06-26 1978-06-26 Semiconductor sealing epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57210647A true JPS57210647A (en) 1982-12-24

Family

ID=13625270

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57077132A Pending JPS57210647A (en) 1982-05-08 1982-05-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57210647A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320325A (en) * 1986-07-14 1988-01-28 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPH01278526A (en) * 1988-04-28 1989-11-08 Somar Corp Epoxy resin composition
JPH02187422A (en) * 1989-01-17 1990-07-23 Sumitomo Bakelite Co Ltd Epoxy resin composition
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6320325A (en) * 1986-07-14 1988-01-28 Toshiba Corp Epoxy resin composition and resin-sealed semiconductor device
JPH01278526A (en) * 1988-04-28 1989-11-08 Somar Corp Epoxy resin composition
JPH02187422A (en) * 1989-01-17 1990-07-23 Sumitomo Bakelite Co Ltd Epoxy resin composition
JPH0575776B2 (en) * 1989-01-17 1993-10-21 Sumitomo Bakelite Co
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device

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