JPS6469661A - High-thermal conductivity rubber/plastic composition - Google Patents
High-thermal conductivity rubber/plastic compositionInfo
- Publication number
- JPS6469661A JPS6469661A JP22517087A JP22517087A JPS6469661A JP S6469661 A JPS6469661 A JP S6469661A JP 22517087 A JP22517087 A JP 22517087A JP 22517087 A JP22517087 A JP 22517087A JP S6469661 A JPS6469661 A JP S6469661A
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- rubber
- thermal conductivity
- plastic composition
- particle diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001971 elastomer Polymers 0.000 title abstract 4
- 239000000203 mixture Substances 0.000 title abstract 4
- 239000004033 plastic Substances 0.000 title abstract 4
- 239000002245 particle Substances 0.000 abstract 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 6
- 239000000945 filler Substances 0.000 abstract 3
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 239000010431 corundum Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 150000002366 halogen compounds Chemical class 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- 239000004945 silicone rubber Substances 0.000 abstract 1
- 229920006337 unsaturated polyester resin Polymers 0.000 abstract 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE:To provide a rubber/plastic composition having low viscosity, good workability and high thermal conductivity and suited as an adhesive or the like, by using an alumina filler comprising two specified kinds of alumina particles differing in mean particle diameter, shape, etc. CONSTITUTION:An alumina filler comprising 10-30wt.% alumina particles of a mean particle diameter <=5mum and the balance of spherical corundum particles having a mean particle diameter of a single particle of >=10mum and having a cutting edge-free shape is prepared. A rubber (e.g., silicone rubber) and a plastic (e.g., epoxy resin or unsaturated polyester resin) are filled with this alumina filler to produce a high-thermal conductivity rubber/plastic composition. Said spherical corundum particles can be obtained by adding a small amount of a halogen compound or a crystal growth agent to a ground product of, e.g., electromelting alumina and heating the mixture to about 1,000-1,550 deg.C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62225170A JPH0674350B2 (en) | 1987-09-10 | 1987-09-10 | High thermal conductivity rubber / plastic composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62225170A JPH0674350B2 (en) | 1987-09-10 | 1987-09-10 | High thermal conductivity rubber / plastic composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6469661A true JPS6469661A (en) | 1989-03-15 |
| JPH0674350B2 JPH0674350B2 (en) | 1994-09-21 |
Family
ID=16825042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62225170A Expired - Lifetime JPH0674350B2 (en) | 1987-09-10 | 1987-09-10 | High thermal conductivity rubber / plastic composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0674350B2 (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02286768A (en) * | 1989-04-28 | 1990-11-26 | Denki Kagaku Kogyo Kk | Insulating adhesive composition for circuit board and use thereof |
| JPH05202277A (en) * | 1991-09-11 | 1993-08-10 | Mitsubishi Electric Corp | Highly thermally conductive and lowly shrinking, wet-type unsaturated polyester resin composition, and circuit breaker made therefrom |
| JPH08319425A (en) * | 1995-05-25 | 1996-12-03 | Toray Dow Corning Silicone Co Ltd | Heat-conductive silicone rubber composition |
| JPH08325457A (en) * | 1995-05-29 | 1996-12-10 | Toray Dow Corning Silicone Co Ltd | Thermally conductive silicone rubber composition |
| US6169142B1 (en) | 1998-06-17 | 2001-01-02 | Shin Etsu Chemical Co., Ltd. | Thermal conductive silicone rubber compositions and method of making |
| US6306957B1 (en) | 1999-03-11 | 2001-10-23 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone rubber compositions and making method |
| JP2002280498A (en) * | 2001-03-15 | 2002-09-27 | Denki Kagaku Kogyo Kk | Heat radiation spacer |
| US6828369B2 (en) * | 2002-03-05 | 2004-12-07 | Polymatech Co., Ltd | Sheet for conducting heat |
| US6844393B2 (en) | 2002-01-25 | 2005-01-18 | Shin-Etsu Chemical Co., Ltd. | Heat-conductive silicone rubber composition |
| JP2007008730A (en) * | 2005-06-28 | 2007-01-18 | Denki Kagaku Kogyo Kk | Spherical alumina powder, production method and use thereof |
| JP2007290876A (en) * | 2006-04-21 | 2007-11-08 | Denki Kagaku Kogyo Kk | Spherical alumina powder, production method and use thereof |
| US7547743B2 (en) | 2004-05-13 | 2009-06-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone rubber composition and molded article |
| US8119758B2 (en) | 2006-08-30 | 2012-02-21 | Shin-Etsu Chemical Co., Ltd. | Heat-conductive silicone composition and cured product thereof |
| WO2014185296A1 (en) | 2013-05-16 | 2014-11-20 | 信越化学工業株式会社 | Thermally conductive silicone adhesive composition for reactor and reactor |
| JP5775692B2 (en) * | 2008-04-30 | 2015-09-09 | 電気化学工業株式会社 | Method for producing alumina powder |
| WO2020084860A1 (en) | 2018-10-26 | 2020-04-30 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| WO2021095507A1 (en) | 2019-11-14 | 2021-05-20 | 信越化学工業株式会社 | Thermally conductive silicone composition, and thermally conductive silicone sheet |
| WO2021131681A1 (en) | 2019-12-26 | 2021-07-01 | 信越化学工業株式会社 | Thermally conductive silicone resin composition |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7141770B1 (en) | 2021-10-25 | 2022-09-26 | 伊澤タオル株式会社 | Towel cloth and its manufacturing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251466A (en) * | 1987-04-06 | 1988-10-18 | Shin Etsu Chem Co Ltd | Thermal conductive liquid silicone rubber composition |
-
1987
- 1987-09-10 JP JP62225170A patent/JPH0674350B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63251466A (en) * | 1987-04-06 | 1988-10-18 | Shin Etsu Chem Co Ltd | Thermal conductive liquid silicone rubber composition |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02286768A (en) * | 1989-04-28 | 1990-11-26 | Denki Kagaku Kogyo Kk | Insulating adhesive composition for circuit board and use thereof |
| JPH05202277A (en) * | 1991-09-11 | 1993-08-10 | Mitsubishi Electric Corp | Highly thermally conductive and lowly shrinking, wet-type unsaturated polyester resin composition, and circuit breaker made therefrom |
| JPH08319425A (en) * | 1995-05-25 | 1996-12-03 | Toray Dow Corning Silicone Co Ltd | Heat-conductive silicone rubber composition |
| JPH08325457A (en) * | 1995-05-29 | 1996-12-10 | Toray Dow Corning Silicone Co Ltd | Thermally conductive silicone rubber composition |
| US6169142B1 (en) | 1998-06-17 | 2001-01-02 | Shin Etsu Chemical Co., Ltd. | Thermal conductive silicone rubber compositions and method of making |
| US6306957B1 (en) | 1999-03-11 | 2001-10-23 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone rubber compositions and making method |
| JP2002280498A (en) * | 2001-03-15 | 2002-09-27 | Denki Kagaku Kogyo Kk | Heat radiation spacer |
| US6844393B2 (en) | 2002-01-25 | 2005-01-18 | Shin-Etsu Chemical Co., Ltd. | Heat-conductive silicone rubber composition |
| US6828369B2 (en) * | 2002-03-05 | 2004-12-07 | Polymatech Co., Ltd | Sheet for conducting heat |
| US7547743B2 (en) | 2004-05-13 | 2009-06-16 | Shin-Etsu Chemical Co., Ltd. | Heat conductive silicone rubber composition and molded article |
| JP2007008730A (en) * | 2005-06-28 | 2007-01-18 | Denki Kagaku Kogyo Kk | Spherical alumina powder, production method and use thereof |
| JP2007290876A (en) * | 2006-04-21 | 2007-11-08 | Denki Kagaku Kogyo Kk | Spherical alumina powder, production method and use thereof |
| US8119758B2 (en) | 2006-08-30 | 2012-02-21 | Shin-Etsu Chemical Co., Ltd. | Heat-conductive silicone composition and cured product thereof |
| JP5775692B2 (en) * | 2008-04-30 | 2015-09-09 | 電気化学工業株式会社 | Method for producing alumina powder |
| WO2014185296A1 (en) | 2013-05-16 | 2014-11-20 | 信越化学工業株式会社 | Thermally conductive silicone adhesive composition for reactor and reactor |
| US9424977B2 (en) | 2013-05-16 | 2016-08-23 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone adhesive composition for reactor and reactor |
| WO2020084860A1 (en) | 2018-10-26 | 2020-04-30 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| KR20210080376A (en) | 2018-10-26 | 2021-06-30 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition and cured product thereof |
| WO2021095507A1 (en) | 2019-11-14 | 2021-05-20 | 信越化学工業株式会社 | Thermally conductive silicone composition, and thermally conductive silicone sheet |
| KR20220101651A (en) | 2019-11-14 | 2022-07-19 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone composition and thermally conductive silicone sheet |
| WO2021131681A1 (en) | 2019-12-26 | 2021-07-01 | 信越化学工業株式会社 | Thermally conductive silicone resin composition |
| KR20220123385A (en) | 2019-12-26 | 2022-09-06 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Thermally conductive silicone resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0674350B2 (en) | 1994-09-21 |
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