JPS6226827A - Resin sealing device for semiconductor element - Google Patents

Abstract

PURPOSE:To prevent a gap from occurring on the parting plane of metal die as well as a resin from flowing out die to the gap in case of press clamping pressurization by a method wherein the height of spacer blocks is preliminarily set up lower than the height of posts to restrain any deformation in a metal die in case of pressurization from happening. CONSTITUTION:The posts 50 are made higher than spacer blocks 4 and another post 60 is made higher than the posts 50. The heights of each post 50, 60 are calculated by the counter-force of each fulcrum and the spring constant of each fulcrum in case of press clamping pressurization assuming these dimensional differences delta1, delta2 to be continuous beam of surface plate using spacer blocks 4, each post 50, 60 as fulcrums. One condition of calculation is that the height of spacer blocks 4 and each post 50, 60 after bending in case of press clamping pressurization is decided to make an even plane. Through these procedures, specific plane can be maintained not to make a gap on parting plane 2 of chase blocks 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an improvement in a resin sealing device for a semiconductor element, which seals and molds a semiconductor element using a synthetic resin.

[Conventional technology]

Conventionally, there has been an apparatus shown in FIG. 3 that seals and molds a semiconductor element with synthetic resin after mounting it on a lead frame. (11 is a plurality of grooves (not shown) having the same dimensions as the plate thickness of the lead frame (not shown), a cavity part (not shown) for sealing the semiconductor element (not shown), etc. A chase block is formed at the same height as a chamber block (not shown) having a well-known pot part (not shown) and a runner part (not shown) into which synthetic resin is injected. It makes up the type.

(21) The chamber block, chase block f
A surface plate for holding the chamber block.

Chase block +11 bolts are tightened and fixed. (3) Champa Pronk (not shown).

Chase block +ll'i A heater for heating and keeping warm, and is not inserted into the surface plate (2). (4) is a spacer block that supports the surface plate (2) on the base (7), and the entire sealing device is mounted on a known press slide frame (
Guide groove (4a) of mounting bracket (8) to be fixed to 91?
Usually, a plurality of sealing devices are provided around the outer periphery of the sealing device. +51 and +61 are based on the surface plate (2) (
7) A plurality of posts supporting the spacer block (41) are formed inside the spacer block (41) and have the same height as the front two spacer blocks (4).+71
L6 the surface plate (2) the spacer block (4),
It is a base for supporting via posts +51 and +61, and the heat of the heater (3) is transferred to the press slide frame (
It has a built-in heat insulating plate to prevent transmission to 91.

(10 is the upper mold of the sealing device, which has roughly the same structure as the lower mold mentioned above. α) is the platen of the press, (a)
is the parting surface of the self-chase block fir.

When the mold clamping pressure of the press is applied during soil molding in the structure as described above, the distributed load on the chase block (1)'s groove surface, etc. Action 1=, the load is received by the surface plate (2),
6), the base (7) receives the pressure, and the final 1r breath slide frame (91) stands to support it.By the way, the spacer block (41 and the boss l-tel, the height of tel Although they are made with the same dimensions, when the press mold is clamped, the spacer block (4
) and posts +51 and +61 are different, so the amount of deflection is different, and the center post (6) is deformed the most, so the center of the surface plate is deflected, and multiple chase blocks (1) The flatness of the parting surface (2) collapses,
As shown in FIG. 5, the parting surface has a gap of δ2° at the post (6) and δ1 at the post (6).

[Problem that the invention seeks to solve]

Since conventional equipment is configured as described above, resin may flow out from the gap onto the lead frame during molding, resulting in defective products, resulting in a decrease in the yield rate of sealed products, and , a bar to remove the leaked resin in the subsequent process) Not only is F&D work required, but the surface plate is plastically deformed due to repeated press mold clamping pressure. There was also the problem that the life of the device itself was significantly reduced.

The present invention has been made to solve all of the above-mentioned problems, and can prevent gaps from forming on the parting surfaces of the lower mold and upper mold due to mold clamping pressure, and can improve the lead frame. The overall object of the present invention is to obtain a resin sealing device for a semiconductor element that can prevent resin from flowing upward.

[Means for solving problems]

The resin sealing device for semiconductor manufacturing equipment according to the present invention is set in advance to be smaller than the height of the spacer block and the height of the post to suppress deformation of the mold during pressurization.

[Effect]

In the resin encapsulation device for semiconductor elements according to the present invention, when the mold is deformed during the press mold clamping action during sealing molding, the height of the spacer block and the post is made to differ in advance by the amount of deformation, and the height of the mold is changed by the amount of deformation. Deformation is suppressed.

[Example of practical application of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, the ring is a post that supports the center of the surface plate (2) on the base (7), and (7) is a post that similarly supports the surface plate (2) on both sides of this boss 14. In addition, regarding the height relationship of the spacer block (4) and each post (a), tea, the post field is higher than the spacer block (4), and the post wheel is higher than this post l, and its dimensions are The difference is indicated by δ2 as in FIG. These dimensional differences δl and δ2 are considered as a continuous beam with the spacer block (4), each boss m, -i as a fulcrum, and the surface plate as a beam.
Reaction force of each fulcrum and spring constant of each fulcrum (spacer block (4)) when press mold clamping pressure is applied.

The height of each post and field is determined by calculating from each post (total) and (spring constant of a). The calculation conditions at that time are to determine the heights so that the heights of the spacer block (4) and each post fc4 and tel after deflection are on the same plane when the press mold clamping pressure is applied. By kneading, a gap is created on the parting (2) surface of the chase block (4) as shown in Figure 2, and a constant plane can be maintained.

Here, the following +11 formula is available as a general formula for calculating the heights of the boss (2) and ω.

tn: Height of nth post Rn:〃 Reaction force An:〃 Cross-sectional area E: Young's modulus of post and spacer block t1 Height of spacer block R1:〃 Reaction force A1:〃 Cross-sectional area 11) Calculated using formula 11) , press mold clamping pressure, surface plate size t
The postman is about 0 or about 30-100μ higher than the spacer block (4).

Further, in the above example, the lower mold of the sea bream sealing device was explained in detail, but it goes without saying that the upper mold CC can also be used in the same way.

C Effects of the Invention As described above, the present invention sets the height of the spacer block to be smaller than the height of the post in advance to suppress the deformation of the mold during pressurization, so that the press mold clamping effect is reduced. Time? This prevents gaps from forming on the parting surface of the mold.
In addition to being able to maintain a highly accurate flat state, the fx+7 prevents the resin from flowing out due to gaps on the parting surface, which is the case in the past. This has the effect of suppressing distortion and improving the life of the surface plate.

[Brief explanation of drawings]

The first flash is a partial cross-sectional view showing an example of this invention, and Figure 2 is a deflection curve of the parting surface during press mold clamping action of an example of this invention. Figure 3, I! FIG. 4 is a sectional view showing a conventional device, and FIG. 5 is a deflection curve diagram of the parting surface during the conventional press mold clamping operation at g position. In the figure, (11 is a chase block, (2) is a surface plate, (4 is a
) is a spacer block, (a), '61 Lri boss,
(7) is the base. In addition, in each figure, the same reference numeral indicates the same or equivalent part.

Claims (1)

[Claims] A sealing device that seals and molds a semiconductor element with synthetic resin after mounting it on a lead frame includes a surface plate that fixes a mold, a pair of special sub-blocks that support the outside of the flat part of this surface plate, and A post that supports the surface plate inside the spacer block, a base that supports the post and the pair of spacer blocks, and the height of the pair of spacer blocks is set smaller than the height of the post. A resin sealing device for a semiconductor element, characterized in that deformation of the mold is suppressed during pressurization.