JPS57103814U - - Google Patents
Info
- Publication number
- JPS57103814U JPS57103814U JP18111180U JP18111180U JPS57103814U JP S57103814 U JPS57103814 U JP S57103814U JP 18111180 U JP18111180 U JP 18111180U JP 18111180 U JP18111180 U JP 18111180U JP S57103814 U JPS57103814 U JP S57103814U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18111180U JPS5842101Y2 (en) | 1980-12-17 | 1980-12-17 | Floating structure of lower runner plate in mold die |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18111180U JPS5842101Y2 (en) | 1980-12-17 | 1980-12-17 | Floating structure of lower runner plate in mold die |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57103814U true JPS57103814U (en) | 1982-06-26 |
JPS5842101Y2 JPS5842101Y2 (en) | 1983-09-22 |
Family
ID=29978298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18111180U Expired JPS5842101Y2 (en) | 1980-12-17 | 1980-12-17 | Floating structure of lower runner plate in mold die |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5842101Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6226827A (en) * | 1985-07-27 | 1987-02-04 | Mitsubishi Electric Corp | Resin sealing device for semiconductor element |
-
1980
- 1980-12-17 JP JP18111180U patent/JPS5842101Y2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6226827A (en) * | 1985-07-27 | 1987-02-04 | Mitsubishi Electric Corp | Resin sealing device for semiconductor element |
Also Published As
Publication number | Publication date |
---|---|
JPS5842101Y2 (en) | 1983-09-22 |