JPH0272641A - Resin sealing apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the occurrence of breakdown of a hot plate in resin molding and to prevent the occurrence of resin burr in a lead frame by providing a backing plate between the hot plate and supporting pins, and forming the hot plate on the backing plate with a material having excellent heat conductivity. CONSTITUTION:A hot plate 11 has the upper end surface in contact with the lower end surface of a chase block 5. The hot plate 11 houses heaters 4. The entire hot plate 11 is formed with a metal material, e.g., copper alloy and the like, whose heat conductivity is high. A backing plate 12 comprising a material having rigidity higher than that of the hot plate 11 is provided between the hot plate and supporting pins 3. Since the hot plate 11 having the high heat conductivity is used, the chase block 5 can be uniformly heated in resin molding. Thus the occurrence of resin burr in a lead frame can be prevented, and the occurrence of the breakdown of the hot plate 11 can be also prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin sealing device for a semiconductor device that is resin-molded using a transfer molding press.

[Conventional technology]

Conventionally, a resin sealing apparatus for this type of semiconductor device has been constructed as shown in FIG. 2 (showing the lower template of the two upper and lower templates). This will be explained based on the figure. In the figure, what is indicated by reference numeral 1 is a heating plate 5 which is provided on a base 2 via a large number of support pins 3 and has a built-in heater 4.
7 is a chase block that is held on the hot platen 1 and has a cavity 6 that opens to the parting surface 5a; Mounting groove 7a that opens laterally
This is a spacer block with a An ejector mechanism 8 having an ejector turbine (not shown) that moves forward and backward within the cavity 6 is housed inside the spacer block 7 . Note that an upper template (not shown) is provided above the chase block 5.

In the resin sealing apparatus for semiconductor devices configured in this way, the resin tablet (not shown) in the pot (not shown) is pressurized by a plunger (not shown) during mold clamping, and the chase block 5 is A semiconductor element (not shown) on a lead frame (not shown) attached to the semiconductor device can be sealed with resin.

Note that during resin sealing, it is necessary to heat the chase block 5 to the resin molding temperature using the heater 4.

[Problem to be solved by the invention]

By the way, in conventional resin sealing equipment for semiconductor devices, since a metal material with low thermal conductivity is used for the heating plate 1, the chase block 5 is heated unevenly during resin molding and is warped. . That is, the heaters 4 are built into the heating plate 1 at a plurality of locations, and therefore the entire lower end surface of the chess block 5 is not uniformly heated during heating. As a result, a gap is formed between both parting surfaces 5a (only one is shown), and the chess block 5
There was a problem in that resin burrs were generated on the upper lead frame (not shown).

Therefore, it is conceivable to use a soft metal material such as a copper alloy for the hot platen 1, but in this case, there is a problem that the support pins 3 dig into the soft hot platen 1 and damage it. Furthermore, since the hot platen l made of a metal material such as a copper alloy has low rigidity, it warps and deforms as described above, forming a gap between both partings 5a (not shown), and causing a gap between the lead frames (not shown). There was also the inconvenience that resin burrs were generated.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a resin sealing device for semiconductor devices that can prevent the occurrence of damage to the hot platen and the occurrence of resin burrs on the lead frame during resin molding. .

[Means to solve the problem]

In the resin sealing device for a semiconductor device according to the present invention, a packing plate is interposed between a heating plate and a support pin, and the heating plate on the packing plate is formed of a material having good thermal conductivity.

[For production]

In the present invention, the packing plate can prevent the heating plate from warping during resin molding, and
The high conductivity of the hot plate can prevent the chase block from warping.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, the structure etc. of this invention will be explained in detail by the Example shown in the figure.

FIG. 1 is a sectional view showing a resin sealing device for a semiconductor device according to the present invention. In this figure, the same members as those in FIG. In the same figure, the reference numeral 11 denotes a heating plate having an upper end surface that is in contact with the lower end surface of the chase block 5, which houses the heater 4 and is made of a metal material with high thermal conductivity, such as a copper alloy. It is formed. 12 is a packing plate made of a material with higher rigidity than the heating plate 11;
It is interposed between the heating plate 1 and the support pin 3.

In the resin sealing apparatus for a semiconductor device constructed in this way, since the heating plate 11 having high thermal conductivity is used, the chain protector 5 can be uniformly heated during resin molding (sealing).

Therefore, in the present invention, since the chase block 5 can be prevented from being warped during resin sealing, the parting surfaces 5a (only one of which is shown) of the chase block 5 can be brought into close contact with each other.

Further, in the present invention, since the packing plate 12 is interposed between the heating plate 11 and the support pin 3, the heating plate 12
It is possible to prevent the support pin 3 from biting into the support pin 1 and the heating plate 11 from warping.

In addition, in this embodiment, the heating plate 11 is formed of one member, but the present invention is not limited to this, and even if the heating plate 11 is formed by dividing it, it is possible to use the same method as in the embodiment. It has the effect of In this case, one of the heating plates (not shown) that is in contact with the lower end surface of the chase block 5 is made of a metal material such as a copper alloy. And the other heating plate (
If a heater 4 (not shown) is built in and the heater 4 is surrounded by a material with high thermal conductivity, the heater heat can be transmitted from the hot platen 11 to the chase block 5 more effectively.

Further, in this embodiment, an example is shown in which the chase block 5 is two, but it goes without saying that the present invention is not limited to this.

〔Effect of the invention〕

As explained above, according to the present invention, a packing plate is interposed between the heating device and the support pin, and the heating device on the packing plate is made of a material with good thermal conductivity, so that the entire chase block is It is possible to heat uniformly, and it is possible to prevent the chase block from warping and deforming during resin sealing. Further, the packing plate can prevent warping of the heating device. Therefore, since each parting of the chase block can be brought into close contact with each other during resin sealing, generation of resin burrs on the lead frame can be prevented. Also,
Since the packing plate interposed between the support pin and the heating device can prevent the support pin from biting into the heating device, it is also possible to prevent the heating device from being damaged.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a resin sealing device for a semiconductor device according to the present invention, and FIG. 2 is a sectional view showing a conventional resin sealing device for a semiconductor device. 2...Base, 3...Support pin, 4...
・Heater, 5...Cheese Pro Tsuk, 11...
・Heating device, 12...Packing plate. Agent Masuo Oiwa

Claims (1)

[Claims] In a resin encapsulation device for a semiconductor device, which includes a heating platen provided on a base via a support pin and having a built-in heater, and a chase block held on the heating platen and having a cavity, the heating platen and the support pin are connected to each other. 1. A resin sealing device for a semiconductor device, characterized in that a packing plate is interposed between the packing plates, and the heating plate on the packing plate is made of a material having good thermal conductivity.