JPS61241109A - Molding die - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technology that is commonly used and effective for improving the performance of molding dies.

[Background technology]

A mold used to form a pancage of a so-called resin-sealed semiconductor device is composed of a pair of an upper mold cavity unit and a lower mold cavity unit. An upper mold cavity is formed in the mold, and a lower mold cavity is formed in the lower mold.

Only when these upper and lower mold cavities are accurately combined to form one cavity can a highly reliable semiconductor device package be formed.

By the way, in a normal mold, a so-called cavity block in which the above-mentioned upper mold or lower mold cavity is formed is mechanically joined to a template with openings facing each other.

This mold plate also incorporates a heater for heating the cavity block, and also has guides that control the vertical movement of the mold.

Because such a template is used, the transfer molding machine itself equipped with a cough mold becomes large, and the guides formed on the template align the upper and lower mold cavities. , it is difficult to perform accurate alignment. Furthermore, since the cavity block is heated indirectly, the heating of the mold resin during molding tends to be uneven. The inventors have discovered that the above problems exist.

In addition, regarding the mold, November 25, 1961
It is explained in "Integrated Circuit Handbook" published by Maruzen Co., Ltd., complete edition by the editors of Integrated Circuit Handbook, pages 420 to 424.

[Purpose of the invention]

An object of the present invention is to provide a technique that can downsize a mold device.

Another object of the present invention is to provide a technique that enables accurate alignment of an upper mold cavity and a lower mold cavity.

Furthermore, another object of the present invention is to provide a technique that enables efficient and uniform heating of a cavity.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, by providing a guide and incorporating a cavity heating heater into the cavity unit in which the cavity is formed, it is possible to eliminate the use of a mold plate, thereby making it possible to downsize a transfer molding machine equipped with the mold. It is possible.

Additionally, since the guide is formed directly on the cavity unit where the cavity is formed, it is possible to more accurately align the upper and lower mold cavities compared to when the guide is formed on the template. .

Furthermore, since the heater is built into the cavity unit, the cavity can be directly heated, thereby making it possible to heat uniformly.

〔Example〕

FIG. 1 is a partial sectional view showing a part of a transfer molding machine equipped with a mold according to an embodiment of the present invention.

In the transfer molding machine of this embodiment, an upper mold cavity unit 1 constituting an upper mold and a lower mold cavity unit 2 constituting a lower mold are installed in a vertically movable state. Its vertical movement is controlled by a guide post 4 which is fixed to the upper mold cavity unit 1 and fitted into a bush 3 which is a guide pole formed in the lower mold cavity unit.

A heat insulating board 5 is attached above the upper mold cavity unit 1, and a contact plate 7 is attached above the heat insulating board 5 via a spacer block 6 attached to the heat insulating board 5. As for the lower mold cavity unit 2, a heat insulating substrate 5a, a spacer block 6a#, and a contact plate 7a are attached in the same order below.

In the mold apparatus of this embodiment, the upper mold cavity unit 1 includes an upper mold cavity block 8 and a cavity holder 9.
The lower mold cavity unit 2 includes left and right lower mold cavity blocks 8a, a runner block lO located between them, and a cavity holder 9 for fixing these.
It is composed of a.

Further, in the upper mold cavity unit 1 and the lower mold cavity unit, two heaters for heating the left and right cavities are inserted in each of the cavity holders 9° 9a in the vertical direction in the figure.

Incidentally, the upper mold cavity block 8 and the lower mold cavity block 8a are formed with an upper mold cavity 11 and a lower mold cavity 11a, which are made up of recesses of corresponding shapes.

The mold apparatus of this embodiment is used in the following manner. That is, the lead frame is positioned between the upper mold cavity 11 and the lower mold cavity 11a heated to a predetermined temperature, and the upper contact plate 7 and the lower contact plate 7a are pressed by a press (not shown). Due to the iris cavity 11
and lla. In this state, from the runner 10a of the runner block 10, the lower mold cavity block 8
A molding resin is injected into the cavity formed by the upper mold cavity 11 and the lower mold cavity lla through the gate 12 of a. After injection, the resin for molding is held for a predetermined time to undergo a curing reaction. After the curing reaction is performed, the pressing by the press is released, and the upper mold cavity unit 1 and the lower mold cavity unit 2 are reassembled as shown in FIG. Separate state shown. At this time, the molded lead frame is pushed out from the upper mold cavity 11 and the lower mold cavity 11a by an eject pin (not shown) that is linked to the vertical movement of both cavity units 1 and 2, and the mold forming process of the package is performed. is completed.

As described above, in the mold apparatus of this embodiment, the guides consisting of the guide post 4 and the bushing 3, the cavity blocks 8 and 8a, and the heater 13 for heating the cavity are installed in the cavity units 1 and 2 of the mold and the lower mold. It is formed. That is, the above-mentioned guide and cavity blocks 8, 8a are attached to the cavity holders 9 and 9a of the upper and lower mold cavity units 1 and 2.
And the heater 13 is directly built in.

Therefore, the device itself is miniaturized. Furthermore, since the positioning of the opening of the upper mold cavity 11 and the opening of the lower mold cavity lla is controlled by the guides formed directly on the cavity holders 9 and 9a, it can be performed extremely accurately. It is something. Further, since the cavity heating heater is attached to the cavity holders 9 and 9a close to the cavity block 8.8a, the cavity can be heated efficiently and uniformly.

〔effect〕

(1) By providing a guide directly to the cavity unit in the mold die and loading a heater for heating the cavity, the template plate can be eliminated, so the transfer molding machine equipped with the mold can be downsized. It can be achieved.

(2) Since the guide is formed directly on the cavity unit in which the cavity is formed, it is possible to more accurately align the upper and lower mold cavities compared to the case where the guide is formed on the template. achieved.

(3) Since the cavity unit is equipped with a heater, the cavity can be directly heated, which makes it possible to efficiently and uniformly heat the molding resin.

(4), above +11. (21 and (3)) makes it possible to provide a compact and high-performance transfer molding machine.

(5) By making the cavity unit a separate structure and forming the guide and heater in the cavity holder, the runner block or cavity block can be easily replaced.

Although the invention made by the present inventor has been specifically explained based on Examples above, it should be noted that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Not even.

For example, the upper and lower mold cavity units of the mold are shown in which the cavity block or runner block and the cavity holder are separable, but
It goes without saying that it may be of an integral structure in which the cavity unit is directly carved to form a cavity or a lunch, or that only one side may be of an integral structure.

Further, although the guide has been described as being composed of a guide post and a bush, the present invention is not limited to this.

Furthermore, the structure of the mold or the specific structure of the transfer molding machine equipped with the mold is not limited to that shown in the above embodiments.

[Brief explanation of drawings]

FIG. 1 is a partial sectional view showing a part of a transfer molding machine equipped with a mold according to an embodiment of the present invention. l... Upper cavity unit, 2... Lower cavity unit, 3... Bush, 4... Guide post, 5, 5a... Heat insulation board, 6° 6a... Spacer block, 7 ,7a...Packing plate,8...Upper mold cavity block,8a...Lower mold cavity block,9,
9a...Cavity holder, 10...Runner block, 10a゛°゛runner, 11...Upper mold cavity,
11a... lower mold cavity, 12... gate, 13
···heater. Figure 1 ct

Claims (1)

[Scope of Claims] 1. A molding die formed from an upper mold cavity unit and a lower mold cavity unit, wherein a guide and a heater are formed in the upper mold cavity unit and the lower mold cavity unit. 2. The mold according to claim 1, wherein the lower mold cavity unit is composed of a cavity block, a runner block, and a cavity holder. 3. The mold according to claim 2, wherein the guide and heater are formed in the cavity holder.