CN217955814U

CN217955814U - Chip sintering machine

Info

Publication number: CN217955814U
Application number: CN202222194132.5U
Authority: CN
Inventors: 谭立侨
Original assignee: Guangdong Pinjialing Intelligent Technology Co ltd
Current assignee: Guangdong Pinjialing Intelligent Technology Co ltd
Priority date: 2022-08-20
Filing date: 2022-08-20
Publication date: 2022-12-02
Anticipated expiration: 2032-08-20

Abstract

The utility model discloses a chip sintering machine, this chip sintering machine aim at solving among the prior art equipment can't realize providing the problem of condition for needs concurrent heating and pressurized semiconductor encapsulation welding. This chip sintering machine includes frame, servo motor and sintering device, and wherein sintering device includes vacuum cavity, last mould group, bed die group and lower vacuum cavity, is equipped with mould group in last vacuum cavity, and goes up the vacuum cavity below and be equipped with lower vacuum cavity, is equipped with bed die group in lower vacuum cavity, goes up mould group and corresponds with bed die group is perpendicular, compares with current sintering technique, the utility model provides a sintering environment makes the sintering heat more concentrated to high temperature, high pressure, vacuum environment, effectively shortens the sintering time, improves welding quality and the control to the precision.

Description

Chip sintering machine

Technical Field

The utility model relates to a semiconductor device encapsulation technical field specifically is a chip sintering machine.

Background

With the development of science and technology, semiconductor devices and components are widely used in engineering and commerce, and the demand of high-power semiconductor devices is rapidly increased. The high-power semiconductor device is generally obtained by sintering a semiconductor chip and a copper plate, because the sintering process needs solder assistance, the high-power semiconductor device has very strict requirements on the solder, a solder in the current market is a nano silver paste solder, which is the key point of the development in the industry in recent years, the thermal conductivity of the solder is more than 3 times of that of the traditional solder, but the nano silver paste is used for welding, so the high-power semiconductor device has the following problems:

the welding flux used in the traditional semiconductor packaging welding does not need pressurization, only needs heating, and the nano silver paste is required to meet the requirements of heating and pressurizing for simultaneous welding, so that the temperature uniformity in a certain heating time is ensured, the traditional process and huge equipment cannot provide conditions for the semiconductor packaging welding which needs simultaneous heating and pressurizing, and the quality of a final product is easily influenced.

SUMMERY OF THE UTILITY MODEL

(1) Technical problem to be solved

To the not enough of prior art, the utility model aims to provide a chip sintering machine, this sintering machine aims at solving the unable problem that realizes providing the condition for needs simultaneous heating and pressurized semiconductor encapsulation welding of prior art.

(2) Technical scheme

In order to solve the technical problem, the utility model provides a chip sintering machine, which comprises a frame, a servo motor and a sintering device, wherein the frame comprises an upper machine plate, guide pillars penetrating through the periphery of the upper machine plate, a driving cylinder arranged above the upper machine plate and a lower machine plate, and the lower end surface of the upper machine plate is provided with the sintering device;

the sintering device comprises an upper vacuum cavity, an upper die set, a lower die set and a lower vacuum cavity, wherein the upper vacuum cavity is formed in the lower end face of an upper machine plate, the upper die set is arranged in the upper vacuum cavity, the lower vacuum cavity is formed above a lower machine plate, the lower die set is arranged in the lower vacuum cavity, the upper die set vertically corresponds to the lower die set, the upper vacuum cavity vertically corresponds to the lower vacuum cavity in position and is equal in size, the upper vacuum cavity drives the upper machine plate to move downwards along a guide pillar to form a closed cavity with the lower vacuum cavity through a driving cylinder, and a servo motor applies specific pressure to the upper die set to enable a sintering part to be attached, and meanwhile, sintering heat is concentrated.

Further, the upper die set comprises a first fixing plate, a first heat insulation plate, a first water-cooling template, a first heating template and a first pressing template; the lower die set comprises a second fixing plate, a second heat insulation plate, a second water-cooling template, a second heating template, a second pressing template and a template quick lock; the first heating template and the second heating template release heat in the closed cavity, the sintering temperature of the nano silver paste solder at the contact part of the semiconductor chip and the copper plate is rapidly increased, the nano silver paste solder is sintered and molded, after sintering is completed, the first water-cooling template and the second water-cooling template rapidly cool the cavity to indoor temperature, and the first heat insulation plate 32 and the second heat insulation plate 42 can prevent high heat from being transferred to the electric cylinder connector 61 in the sintering process, so that a protection effect is achieved.

Further, a first air nozzle communicated with the upper vacuum cavity is arranged on the upper vacuum cavity, a second air nozzle communicated with the lower vacuum cavity is arranged on the lower vacuum cavity, the first air nozzle and the second air nozzle are communicated with the vacuum pump at the same time, when the driving cylinder drives the upper machine plate and the upper vacuum cavity to move downwards along the guide pillar to be combined with the lower vacuum cavity, a sealed cavity is formed inside, the protrusion of the upper vacuum cavity is inserted into the groove, the vacuum pump sucks air in the sealed cavity through the first air nozzle and the second air nozzle, the sealed cavity is in a vacuum state or a state close to the vacuum state, sintering heat is concentrated, sintering time is effectively shortened, and welding quality is improved.

Furthermore, a circle of first groove is formed in the lower end face of the upper plate, a first bulge is formed in the upper end face of the upper vacuum cavity, a first sealing ring is placed in the first groove, the first groove vertically corresponds to the first bulge, a second bulge is formed in the periphery of the lower end face of the upper vacuum cavity, a second groove is formed in the periphery of the upper end face of the lower vacuum cavity, the second groove corresponds to the second bulge in the vertical direction, a second sealing ring is placed in the second groove, a third bulge is formed in the lower end face of the lower vacuum cavity, a third groove is formed in the upper end face of the lower plate, a third sealing ring is placed in the third groove, the first sealing ring enables the upper vacuum cavity and the lower vacuum cavity to be better sealed after the upper vacuum cavity and the lower vacuum cavity are combined, the upper position and the lower position of the sealed cavity are isolated from the outside through the second sealing ring and the third sealing ring, the sealing performance of the cavity is guaranteed, and the vacuum effect in the cavity after air exhaust is enhanced.

The utility model has the advantages that:

1. when the upper vacuum cavity moves downwards along the guide pillar and is combined with the lower vacuum cavity, a closed cavity is formed inside the upper vacuum cavity, air in the closed cavity is pumped away, the closed cavity is in a vacuum state, the servo motor can apply specific pressure to the upper die set, the sintering part is attached, sintering heat is concentrated, sintering time is effectively shortened, and welding quality is improved.

2. The temperature in the closed cavity can be measured more accurately, and the monitoring precision is obviously improved.

3. The first heating template of the upper die set and the second heating template of the lower die set are heated at high temperature at the same time to ensure uniform heating, and after sintering is completed, the first water-cooling template of the upper die set and the second water-cooling template of the lower die set simultaneously and rapidly perform water-cooling circulation to cool to indoor temperature, so that the production efficiency is improved.

4. The matching of sintering pressure, sintering temperature and sintering time can be adjusted according to the characteristics of the sintering material, and the production efficiency and the production quality are ensured.

Other features and advantages of the present invention will be described in detail in the detailed description which follows.

Drawings

Fig. 1 is a front view of the sintering machine of the present invention.

Fig. 2 is a perspective view of the upper mold unit of the present invention.

Fig. 3 is a perspective view of the lower die set of the present invention.

Fig. 4 is a sectional view of the sintering apparatus of the present invention.

Fig. 5 is a cross-sectional view of the sintering machine of the present invention.

Fig. 6 is an enlarged view of a portion a of fig. 3 according to the present invention.

The parts in the drawings are numbered as follows: 1-a frame; 11-mounting the machine plate; 12-a guide post; 13-lower plate; 14-a driving cylinder; 2-upper vacuum cavity; 21-air nozzle I; 22-a bump; 3-upper die set; 31-fixing the plate I; 32-a first heat insulation plate; 33-water-cooling the first template; 34-heating the template I; 35-pressing the first template; 4-a lower die set; 41-fixing plate II; 42-a second heat insulation plate; 43-water-cooling template II; 44-heating the template II; 45-pressing a template II; 451-T-shaped grooves; 46-template quick locking; 461-locking piece; 462 locking pin; 5-lower vacuum cavity; 51-air nozzle II; 52-a groove; 53-sealing ring; 6-a servo motor; 61-electric cylinder connector; 62-cooling the cylinder I; and 63-cooling the second cylinder.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Please refer to fig. 1 to 6;

as shown in fig. 1-3 (fig. 1 is a front view of a sintering machine, i.e., a front view of the sintering machine, fig. 2 is a perspective view of an upper mold set 3, and fig. 3 is a perspective view of a lower mold set 4), a chip sintering machine comprises a frame 1, a servo motor 6 and a sintering device, wherein the frame 1 comprises an upper machine plate 11, guide posts 12 penetrating the periphery of the upper machine plate 11, a driving cylinder 14 arranged above the upper machine plate 11 and a lower machine plate 13, and the sintering device is arranged between the upper machine plate 11 and the lower machine plate 13;

the sintering device comprises an upper vacuum cavity 2, an upper die set 3, a lower die set 4 and a lower vacuum cavity 5, wherein the upper vacuum cavity 2 is arranged on the lower end face of an upper die plate 11, the upper die set 3 is arranged in the upper vacuum cavity 2, the lower vacuum cavity 5 is arranged on the upper end face of a lower die plate 13, the lower die set 4 is arranged in the lower vacuum cavity 5, the upper die set 3 vertically corresponds to the lower die set 4, the upper vacuum cavity 2 vertically corresponds to the lower vacuum cavity 5 in position and is equal in size, and the upper vacuum cavity 2 drives the upper die plate 11 to move downwards along a guide pillar 12 through a driving cylinder 14 to form a closed cavity with the lower vacuum cavity 5.

The upper mold set 3 includes a first fixing plate 31, a first heat insulation plate 32, a first water-cooling mold plate 33, a first heating mold plate 34 and a first pressing mold plate 35 (as shown in fig. 3); the lower die set 3 comprises a second fixing plate 41, a second heat insulation plate 42, a second water-cooling template 43, a second heating template 44, a second pressing template 45 and a template quick lock 46 (as shown in FIG. 4); firstly, a semiconductor chip and a copper plate which need to be combined are placed on a second pressing template 45, the semiconductor chip and the copper plate can be quickly locked through a template quick lock 46, then the first heating template 34 and the second heating template 44 release heat in a closed cavity, the sintering temperature of the nano silver paste solder at the contact part of the semiconductor chip and the copper plate is quickly increased, the nano silver paste solder is sintered and formed, and after the sintering is finished, the first water-cooling template 33 and the second water-cooling template 43 simultaneously quickly cool the cavity to indoor temperature.

Further, the first heating template 34 and the second heating template 44 are heated simultaneously (in this embodiment, the first heating template 34 and the second heating template 44 are provided with electric heating pipes in the metal plate), so that the sintering part can be heated up quickly in all directions, the sintering efficiency is improved, the sintering part needs to be cooled to ensure the quality after being sintered, the closed cavity can be cooled down quickly to the indoor temperature through the first water-cooling template 33 and the second water-cooling template 43 (in this embodiment, the first water-cooling template 33 and the second water-cooling template 43 use a processing water circulation channel in the metal plate, and the temperature is reduced through external circulating water), and the situation that the residual heat in the closed cavity is too high and the residual heat released in the cavity is burned to workers when the upper vacuum cavity 2 and the lower vacuum cavity 5 are opened is avoided.

Further, the first heat insulation plate 32 and the second heat insulation plate 42 can prevent high heat from being transferred to the electric cylinder connector 61 in the sintering process, and therefore the protection effect is achieved.

Furthermore, the lower end face of the first press-fit template 35 and the upper end face of the second press-fit template 45 are parallel in the horizontal direction, and the parallelism is ensured in the contact press-fit process of the whole back face of the semiconductor chip and the copper plate, so that the thickness and the density of a sintered layer after pressure sintering are more uniform, and the welding face is complete.

As shown in fig. 1, an electric cylinder connector 61 penetrating through the upper machine plate 11 is arranged above the upper die set 3, a servo motor 6 is arranged above the electric cylinder connector 61, the upper end of the electric cylinder connector 61 is connected with the servo motor 6, the lower end of the electric cylinder connector 61 is connected with a first fixing plate 31, namely, the upper end surface of the first fixing plate 31 is fixedly provided with the electric cylinder connector 61 penetrating through the upper machine plate 11, the upper end of the electric cylinder connector 61 is connected with the servo motor 6, the servo motor 6 can drive the electric cylinder connector 61 and the upper die set 2 to move up and down, when the electric cylinder connector 61 and the lower vacuum chamber 5 are in an integrated state, the servo motor 6 drives the electric cylinder connector 61 to drive the upper die set 3 to move down, so that when a first pressing template 31 on the upper die set 3 is in contact with a semiconductor chip, the servo motor 6 applies pressure to the upper die set 3, and after sintering, the electric cylinder connector 61 drives the upper die set 3 to move up, and then the upper machine plate 11 and the upper vacuum chamber 2 move up along a guide pillar 12 to separate the upper vacuum chamber 2 from the lower vacuum chamber 5, and take out a product.

Furthermore, a pressure sensor (not shown) is arranged on the servo motor 6, and the pressure applied by the servo motor 6 to the sintering part can be transmitted to the pressure sensor, so that the pressure can be controlled and monitored at any time.

As shown in fig. 4 (fig. 4 is a left side view of the sintering machine), a circle of first groove 111 is arranged on the lower end surface of the upper vacuum chamber 11, a first protrusion 22 vertically corresponding to the first groove 111 is arranged on the upper end surface of the upper vacuum chamber 2, a first sealing ring 112 is placed in the first groove 111, so that the sealing effect of the joint between the upper vacuum chamber 11 and the upper vacuum chamber 2 is enhanced, a second protrusion 23 is arranged on the lower end surface of the upper vacuum chamber 2, a second groove 52 clamped with the second protrusion 23 is arranged on the upper end surface of the lower vacuum chamber 5, a second sealing ring 53 is placed in the second groove 52, when the upper vacuum chamber 2 moves downwards to completely fit the periphery of the lower end surface of the upper vacuum chamber 2 and the upper end surface of the lower vacuum chamber 5, the protrusion 23 is just inserted into the groove 52 to press the sealing ring 53, and the sealing ring 53 with plasticity can fill the gap between the protrusion 22 and the groove 52, so that the sealing effect of the upper vacuum chamber 2 and the lower vacuum chamber 5 after being closed is better.

Furthermore, the terminal surface is equipped with third arch 54 under the vacuum cavity down, the up end of lower quick-witted board 13 is equipped with third recess 131, place third sealing washer 132 in the third recess 131, strengthen the sealed effect of junction between lower quick-witted board 13 and the lower vacuum cavity 5, isolated with external, guarantee the cavity leakproofness more, strengthen the vacuum effect in the cavity after bleeding.

Further, an air nozzle first 21 communicated with the upper vacuum cavity 2 is arranged on the upper vacuum cavity 2, an air nozzle second 51 communicated with the lower vacuum cavity 5 is arranged on the lower vacuum cavity 5, the air nozzle first 21 and the air nozzle second 51 are simultaneously communicated with a vacuum pump, when the driving cylinder 14 drives the upper machine plate 11 and the upper vacuum cavity 2 to move downwards along the guide post 12 to be combined with the lower vacuum cavity 5, a closed cavity is formed inside, at the moment, the protrusion 22 of the upper vacuum cavity 2 is inserted into the groove 52, the vacuum pump pumps air in the closed cavity away through the air nozzle first 21 and the air nozzle second 51, the closed cavity is in a vacuum state or close to the vacuum state, sintering heat is concentrated, sintering time is effectively shortened, and welding quality is improved.

As shown in fig. 5 (fig. 5 is a side view of the sintering machine), since a part of heat in the closed cavity is transferred to the electric cylinder connector 61 through the upper mold set 3 and transferred to the lower connecting portion through the lower mold set 4 during the heating process, so that the temperature of the electric cylinder connector 61 is too high, and the service life is reduced, a first cooling cylinder 62 through which the electric cylinder connector 61 passes is arranged on the first fixing plate 31, a second cooling cylinder 63 is arranged below the second fixing plate 41, and water circulation pipes are arranged inside the first cooling cylinder 62 and the second cooling cylinder 63, so that the temperature of the electric cylinder connector 61 and the connecting portion is reduced by cooling with external circulating water, and the circulating water is operated all the time, so that the temperature of the electric cylinder connector 61 and the connecting portion is reduced, and the electric cylinder connector 61 is protected.

As shown in fig. 6 (fig. 6 is an enlarged view of a part a of fig. 4), a T-shaped slot 451 is formed on the second die plate 45, the die plate quick lock 46 includes a lock block 461 and a lock pin 462 penetrating through the lock block 461, a lower end of the lock pin 462 is engaged with the T-shaped slot 451, so that the die plate quick lock 46 cannot move up and down, the lock pin 462 can move along the T-shaped slot 451 at the same time, the number of the die plate quick locks 46 is four, when a semiconductor chip and a copper plate are placed on the second die plate 45, the lock pin 462 can move along the T-shaped slot 451, meanwhile, the lock blocks 461 at the periphery move towards the second die plate 45, so as to lock the semiconductor chip and the copper plate placed on the second die plate 45, thereby avoiding displacement caused by excessive pressure during the pressing process, causing outward radiation, and the position of the die plate quick lock 46 can be adjusted at any time according to different specifications of the semiconductor chip and the copper plate, so that the locking has strong flexibility.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may include only a single embodiment, and such description is for clarity only, and those skilled in the art will be able to make the description as a whole, and the embodiments may be appropriately combined to form other embodiments as will be apparent to those skilled in the art.

Claims

1. The utility model provides a chip sintering machine, includes frame (1), servo motor (6) and sintering device, its characterized in that: the machine frame (1) comprises an upper machine plate (11), guide columns (12) penetrating through the periphery of the upper machine plate (11), a driving cylinder (14) arranged above the upper machine plate (11) and a lower machine plate (13), wherein a sintering device is arranged on the lower end face of the upper machine plate (11);

the sintering device comprises an upper vacuum cavity (2), an upper die set (3), a lower die set (4) and a lower vacuum cavity (5), wherein the upper vacuum cavity (2) is arranged on the lower end face of an upper plate (11), the upper die set (3) is arranged in the upper vacuum cavity (2), the lower vacuum cavity (5) is arranged above a lower plate (13), the lower die set (4) is arranged in the lower vacuum cavity (5), the upper die set (3) vertically corresponds to the lower die set (4), and the upper vacuum cavity (2) vertically corresponds to the lower vacuum cavity (5) in position and is equal in size.

2. The die bonder of claim 1, wherein: the upper die set (3) comprises a first fixing plate (31), a first heat insulation plate (32) is arranged below the first fixing plate (31), a first water-cooling template (33) is arranged below the first heat insulation plate (32), a first heating template (34) is arranged below the first water-cooling template (33), and a first pressing template (35) is arranged below the first heating template (34).

3. The die bonder of claim 1, wherein: the lower die set (4) comprises a second fixing plate (41), a second heat insulation plate (42) is arranged above the second fixing plate (41), a second water-cooling template (43) is arranged above the second heat insulation plate (42), a second heating template (44) is arranged above the second water-cooling template (43), a second pressing template (45) is arranged above the second heating template (44), a second template quick lock (46) is arranged above the second pressing template (45), and a second cooling cylinder (63) is arranged below the second fixing plate (41).

4. The die bonder of claim 1, wherein: one side of the upper vacuum cavity (2) is provided with a first air nozzle (21), and one side of the lower vacuum cavity (5) is provided with a second air nozzle (51).

5. A chip sintering machine according to claim 1 or 2, characterized in that: go up mould group (3) top and be equipped with electric jar connector (61) of passing last matrix board (11), electric jar connector (61) top is equipped with servo motor (6), servo motor (6) are connected to electric jar connector (61) upper end, fixed plate (31) are connected to electric jar connector (61) lower extreme.

6. The die bonder of claim 2, wherein: and a first cooling cylinder (62) through which the electric cylinder connector (61) penetrates is arranged on the first fixing plate (31).

7. A chip sintering machine according to claim 3, characterized in that: and a T-shaped groove (451) is formed in the second press-fit template (45), the template quick lock (46) comprises a lock block (461) and a lock nail (462) penetrating through the lock block (461), the lower end of the lock nail (462) is clamped with the T-shaped groove (451), and meanwhile, the lock nail (462) can move along the T-shaped groove (451).

8. The die bonder of claim 4, wherein: go up quick-witted board (11) lower terminal surface and be equipped with round first recess (111), it is equipped with first arch (22) to go up vacuum cavity (2) up end, place first sealing washer (112) in first recess (111), first recess (111) correspond with first arch (22) position is perpendicular, it is equipped with protruding (23) of second all around to go up vacuum cavity (2) lower terminal surface, be equipped with second recess (52) all around vacuum cavity (5) up end down, second recess (52) position with protruding (23) position vertical direction of second corresponds, second sealing washer (53) have been placed in second recess (52) the terminal surface is equipped with third arch (54) down under the vacuum cavity, lower quick-witted board (13) up end is equipped with third recess (131), third sealing washer (132) have been placed in third recess (131).