JP2571719Y2 - Work removal device for semiconductor molding - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a work take-out apparatus for taking out a finished work from a molding die for molding a semiconductor.

[0002]

2. Description of the Related Art In semiconductor molding, a work, which has been molded by a molding die, is automatically taken out of the die by a take-out device. The shape of the work taken out of the mold will be described with reference to FIG.

A workpiece 10 taken out of a mold usually has a shape in which a plurality of product parts 11 are interconnected by a cull runner part 12 with respect to the structure of a molding die. The product part 11 is, for example, each leg 11 of the lead frame 11a.
The semiconductor element mounted on b is molded with resin 11c. Specifically, the cull runner portion 12 includes a cull 12a remaining in a resin injection portion of a molding die and a runner 12b remaining in a resin flow path extending outward from the resin injection portion.
And

In such a work 10, if the cull runner portion 12 is not sufficiently cooled, the product portion 11 called a gate break and the cull runner portion 12 cannot be separated properly.

Therefore, the conventional work take-out device is
After removing the work 10 from the molding die, the work 10 is cooled until the cal runner portion 12 is sufficiently cooled and solidified.
Is maintained. Alternatively, the work 10 taken out of the mold is temporarily put on a work table before being conveyed to the gate breaking step, and the cull runner 12
Is allowed to cool naturally.

[0006]

However, in any case, since the work is naturally cooled, the time required for cooling is prolonged, and the efficiency of the molding operation is reduced. Further, since the molded resin is gradually cooled, bending or distortion of the resin occurs during the cooling, and the product part and the cal runner part may be separated carelessly. A product part separated by bending or distortion has a high defect rate.

It is an object of the present invention to provide a work take-out apparatus for rapidly cooling a work taken out of a molding die in a short time in order to solve these problems.

[0008]

Extraction present invention work [Summary of Apparatus with a work from the molding die for molding the semiconductor
The take-out device body for taking out
The product part of the workpiece taken out of the molding die
In order to cool the cal runner,
Cooling with good thermal conductivity placed in the work transfer area
And the cooling body has a cover for the work.
The contact cooling part formed in the shape corresponding to the
The take-out device body is provided with a molding die.
Connect the cal runner part of the work taken out from the cooling
It is characterized in that it is pressed against the contact cooling part .

[0009]

[Function] The cal runner part of the work taken out of the molding die is pressed against the contact cooling part of a cooling body with good thermal conductivity.
And the contact cooling section corresponds to the cull runner section.
The runner section is forcibly cooled sufficiently in a short time,
Distortion is prevented.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a front view showing a schematic configuration of an example of a work take-out apparatus embodying the present invention, and FIG. 3 is a perspective view showing a detailed structure of a cooling body.

The present work take-out device includes a take-out device main body 20 for taking out the work 10 from the molding die, and a cooling body 30 arranged in a work transfer area of the take-out device main body 20.

The take-out device body 20 includes a flat frame 21 and a work hand 2 that clamps the product portion 11 of the work 10 and holds the work 10 below the frame 21.
2 and a pressing mechanism 23 for pressing the runner 12b of the work 10 held by the work hand 22 downward. The pressing mechanism 23 includes a cylinder 23a attached downward on the upper surface of the frame 21, and a pressing head 23b attached to the tip of a piston rod extending downward from the cylinder 23a.

The cooling body 30 is made of a metal having good thermal conductivity such as aluminum, for example, and has a structure in which a contact cooling unit 32 is provided in a box-shaped frame 31 also serving as a heat radiating plate. The contact cooling section 32 is formed in a shape corresponding to the cull runner section 12 of the work 10, and when the cull runner section 12 is shown in FIG. 1, the cull 12 a and the cull 12 a are formed.
Cooling unit 3 corresponding to runner 12b extending to both sides from
2a, and a runner cooling section 32b extending back and forth from both sides of the cull cooling section 32a.

The pressing head 23 b of the pressing mechanism 23 in the take-out device 20 is also similar to the contact cooling unit 32.
The shape corresponds to the shape of the runner 12b of the work 10.

The take-out device main body 20 takes out the work 10 from the molding die and places the work 10 directly above the cooling body 30.
The workpiece 10 is lowered until the workpiece 10 comes into contact with the contact cooling section 32. When the cull runner section 12 of the work 10 comes into contact with the contact cooling section 32 of the cooling body 30, the press mechanism 23 presses the runner 12b of the work 10 downward. This allows
The cal runner portion 12 of the work 10 comes into close contact with the contact cooling portion 32 of the cooling body 30 and the contact cooling portion 32 forcibly removes heat. As a result, the time required for cooling the work 10 is reduced. Further, since the cull runner section 12 of the work 10 is rapidly cooled and the cull runner section 12 being cooled is supported by the contact cooling section 32 of the cooling body 30, the bending and distortion of the cull runner section 12 are reduced. Inadvertent separation of the product portion 11 and the cal runner portion 12 due to bending or distortion is prevented.

When the cal runner portion 12 of the work 10 is sufficiently cooled, the work 10
Is lifted, and the pressing head 2 of the pressing mechanism 23 is
3b falls further. As a result, the cull runner section 12 is separated and removed from the product section 11 of the work 10. This step is called a gate break as described above.

The above embodiment employs a pressing mechanism 23 used for a gate break of the work
The cull runner 12 is pressed against the cooling body 30. However, in a take-out apparatus body having no pressing mechanism, the cull runner 12 may be pressed against the cooling body 30 by utilizing the descending operation.

[0018]

[Effects of the Invention] As described above, the work take-out device of the present invention uses the cull of the work taken out of the molding die.
By forcibly cooling the runner section by bringing the runner section into contact with the cooling body, the cooling of the cull runner section is promoted, so that the time required for the cooling can be shortened and the efficiency of the molding operation can be improved. Moreover, in addition to promoting the cooling, the cull runner portion for cooling is supported by the cooling body, so that the cull runner portion is prevented from being bent or distorted. Therefore, unnecessary gate break due to bending or distortion is prevented, and there is an effect that the product defect rate is reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a semiconductor molded product.

FIG. 2 is a front view showing a schematic configuration of an example of a work take-out apparatus embodying the present invention;

FIG. 3 is a perspective view showing a detailed structure of a cooling body.

[Explanation of symbols]

 Reference Signs List 10 work (semiconductor molded product) 11 product part 12 cull / runner part 20 take-out device main body 30 cooling body

Claims (1)

(57) [Scope of request for utility model registration] 1. From a molding die for molding a semiconductor
The main unit and the main unit
The product part of the workpiece taken out of the molding die by
Take-out device to cool the cull runner
Good thermal conductivity located in the work transfer area of the main unit
And a cooling body.
Contact cooling formed in a shape corresponding to the
And the take-out device body is formed by molding.
Cooling the cal runner part of the work taken out of the mold
A work removal device for semiconductor molding, wherein the device is pressed against a contact cooling part of a body .