JPS63119538A - Semiconductor sealing equipment - Google Patents

Abstract

PURPOSE:To prevent outflow of resin on a lead frame and to improve the yield rate of a devices, by inserting a plurality of heaters in at least one surface plate of upper and lower surface plates in proximity of the opposite side of a mounting surface. CONSTITUTION:Top and bottom forces 1 are supported by upper and lower surface plates 2. Resin is injected between the top and bottom forces 1, and a semiconductor element seal with the resin. In this semiconductor sealing equipment, a plurality of heaters 30 are inserted in at least one surface plate of the upper and lower surface plates 2 in proximity of the opposite side of the mounting surface of the top or bottom forces 1. In this way, deformation at the time of compression of the surface plates and thermal deformation can be offset. Therefore, the flatness of a parting surface can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in a semiconductor sealing device for sealing and molding a semiconductor element using a synthetic resin.

[Conventional technology]

Conventionally, there has been an apparatus shown in FIG. 4 that seals and molds a semiconductor element with synthetic resin after mounting it on a lead frame. In the figure, (I) has the same height as a chamber block (not shown) having a known pot part (not shown) and a larena part (not shown) for injecting synthetic resin,
A plurality of grooves (not shown) having the same size as the plate thickness of a lead frame (not shown), and a cavity part (not shown) for sealing a semiconductor element (not shown), etc. Chase block, (2) is a surface plate for holding the chamber block and chase block fi+, and (3) is a heater for heating and keeping warm the chamber block (not shown) and chase block (+1). It is inserted into the plate (2). (4) is a spacer block that supports the surface plate (2), (5) is a boss that partially supports the surface plate (2), and the spacer block (4) (6) is machined with the same height dimension as the spacer block (4).
).

It is a base for supporting via the post (5), and has a built-in heat insulating plate so that the heat of the heater (3) is transmitted to the slide frame (10) of the press. Fixing fittings (8) and (9) are a guide shaft and guide bushing for matching the upper and lower molds, (Il+ is the parting surface of the chase block fil).

Next, the operation will be explained. During sealing molding, when the mold clamping pressure of the press acts, as shown in Figure 5, if a uniformly distributed load acts on the parting surface (1) of the chase block fi+, the surface plate that receives the load The amount of deformation in (2) is greatest near the center.

On the other hand, when looking at the thermal deformation of the surface plate (2), as shown in FIG. 6, the central portion becomes convex with respect to both ends. In other words, since the heater (3) is placed close to the upper surface of the surface plate (2), a temperature difference occurs between the upper and lower surfaces of the surface plate (2), and the upper surface is more woven. The degree becomes large, the upper surface is elongated, and the central part becomes convex.

Therefore, on the parting surface (II), deformation due to strain during pressurization and thermal deformation due to heating interact, and normally the amount of deformation δ1 due to strain during pressurization as shown in Figure 4 is This is smaller than the amount of thermal deformation δ2 as shown in FIG. 5, and a gap is generated on the outer peripheral side of the parting surface (1).

[Problem that the invention seeks to solve]

Since the conventional equipment is configured as described above, a gap occurs on the outer periphery, and during molding, resin flows out onto the lead frame from the gap between the parting surfaces of the upper and lower molds, reducing the yield of resin in the sealed product. There were problems in that a process for removing the spilled paris in the subsequent process was required.

This invention was made to solve the above problems, and can prevent the resin from flowing out on the lead frame.
It is possible to improve the yield of the resin itself, and
The object of the present invention is to obtain a semiconductor sealing device that can eliminate the step of removing leaked paris in a subsequent process.

[Means for solving problems]

A semiconductor encapsulation device according to the present invention has an upper mold and a lower mold supported by upper and lower surface plates, and resin is injected into these upper mold and lower mold to resin-seal a semiconductor element. In the semiconductor encapsulation device, a plurality of heaters are inserted into at least one of the upper and lower surface plates in close proximity to a side surface opposite to the upper mold or lower mold mounting surface, and In another invention of the present invention, a semiconductor device has an upper mold and a lower mold supported by upper and lower surface plates, and resin is injected into the upper mold and the lower mold to seal a semiconductor element with the resin. In the sealing device, a plurality of heaters are inserted into at least one of the upper and lower surface plates in close proximity to a side surface opposite to the upper mold or lower mold mounting surface, and a plurality of heaters are inserted into at least one of the upper and lower surface plates. A jacking means for adjusting the flatness of the outer peripheral side of the upper mold or the lower mold is arranged between the surface plates.

[Effect]

The semiconductor sealing device according to the present invention can reduce the gap that tends to occur around the outer periphery of the mold, and according to other inventions, the flatness of the parting surface can be adjusted.

〔Example〕

An embodiment of the present invention will be described below with reference to FIG.

In the figure, the shaft is a heater, and the heater is placed on the surface plate (2) so that the temperature on the bottom side (spacer block and post side) of the surface plate (2) is higher than the temperature on the top side (chase block side). It is set towards the bottom side. Although FIG. 1 shows the lower mold of the resin sealing device, the arrangement position of the heater example for the upper mold is similarly set to the lower surface side so that the temperature on the spacer block and post sides is higher.

Descriptions of other symbols are omitted as they are the same as in the conventional device.

In the structure as described above, the surface plate (2) is deformed into a concave shape due to the strain caused by the pressurizing force. It is also possible to prevent the parting surface (1) from forming a large convex shape due to thermal deformation as in the past, and to make the parting surface (1) close to a flat surface. In other words, the amount of deformation δ3 in FIG. 3 can be made equal to the amount of deformation δ1 during pressurization as shown in FIG. 5, and it is also possible to cancel each other out.

In addition, in another invention, as shown in FIGS. 2 to 3, the heater (2) is positioned below the surface plate (2) so that thermal deformation becomes concave, and the parting surface (1)
) is provided with means for adjusting the flatness of the

In other words, ■ is the guide bushing connected to the upper surface plate (2), and 02) is the threaded part (02) connected to the lower surface plate (2).
Ql has a guide shaft (12a)
) is a double nut with a scale on its outer periphery, and is screwed onto the screw shaft (12a) of the mold. I'm trying to get flatness. Note that the guide shaft 02) and the double neck 031 constitute a jacking means. In this configuration, the surface plate (2) is deformed into a concave shape due to the interaction between the deformation of the surface plate (2) into a concave shape due to strain caused by the pressure and the deformation of the surface plate (2) due to thermal deformation. The gap on the outer circumferential side is made small, and the flatness is obtained by adjusting the double nut 031. The dragon can be adjusted on the scale of the double nut A31.

By the way, as for the distribution of heat resistance, the contact thermal resistance of each part is determined based on the actually measured temperature, and it is determined by simulation using the heater capacity and position.

In conventional sealed gaskets, deformation due to mold clamping force and thermal deformation due to mold temperature rise cause the surface plate to convex downward and convex upward, respectively, and due to their interaction, the gap between the upper and lower parting surfaces of the mold is reduced. It was occurring. In order to reduce this gap below a certain amount, it may be necessary to increase the mold clamping load or use spacers inside and outside the mold, but this is inefficient. For this reason, in conventional thermal deformation, for example, in the case of the lower mold, the center of the surface plate is deformed in an upwardly convex shape, and when the upper and lower molds are combined, the minimum gap is at the center of the surface plate, and the maximum Since the gap is at both ends of the surface plate, it can only be adjusted by the mold clamping load. On the other hand, the amount of gap can be adjusted arbitrarily by making the minimum gap portion suddenly located at both ends of the surface plate.

In other words, flatness can be obtained by adjusting the double nut 02).

〔Effect of the invention〕

As described above, the present invention has an upper mold and a lower mold supported by upper and lower surface plates, and a semiconductor package in which resin is injected into the upper mold and the lower mold to resin-seal a semiconductor element. In the stopping device, a plurality of heaters are inserted into one of the upper and lower surface plates in close proximity to the side opposite to the surface on which the upper mold or the lower mold is mounted, so that the surface plate It is also possible to offset deformation during pressurization and thermal deformation, which has the effect of obtaining flatness of the paring surface. Since the jacking means for adjusting the flatness of the outer circumferential surface of the mold or the lower mold is provided, the parting surface itself can be adjusted quickly, which has the effect of further improving the flatness.

[Brief explanation of the drawing]

Fig. 1 is a sectional view showing one embodiment of the present invention, Fig. 2 is a sectional view showing another invention of the invention, Fig. gIJ3 is a sectional view showing its operating state, and Fig. 4 is a sectional view of a conventional device. , gfJ
5 and 9J6 are cross-sectional views showing the operating state thereof. In the figure, (2) is the surface plate, (the edge is the heater, (91 is the guide bushing, (Ill is the parting surface, (12) is the double nut, and (l (to) is the guide shaft. In the figures, the same reference numerals indicate the same or equivalent parts.

Claims (2)

[Claims] (1) In a semiconductor encapsulation device that has an upper mold and a lower mold supported by upper and lower surface plates, and injects resin into these upper mold and lower mold to resin-seal a semiconductor element, the above-mentioned A semiconductor encapsulation device characterized in that a plurality of heaters are inserted into at least one of the upper and lower surface plates in close proximity to a side surface opposite to the upper mold or lower mold mounting surface. (2) In a semiconductor encapsulation device that has an upper mold and a lower mold supported by upper and lower surface plates, and injects resin into these upper mold and lower mold to resin-seal a semiconductor element, the above-mentioned A plurality of heaters are inserted into at least one of the upper and lower surface plates in close proximity to the side opposite to the upper mold or lower mold mounting surface, and a plurality of heaters are inserted between the upper and lower surface plates. The semiconductor sealing device is characterized in that a jack means for adjusting the flatness of the outer peripheral side of the upper mold or the lower mold is arranged.