KR940019440A - Mold of Molding Press Device for Encapsulation - Google Patents
Mold of Molding Press Device for Encapsulation Download PDFInfo
- Publication number
- KR940019440A KR940019440A KR1019930002361A KR930002361A KR940019440A KR 940019440 A KR940019440 A KR 940019440A KR 1019930002361 A KR1019930002361 A KR 1019930002361A KR 930002361 A KR930002361 A KR 930002361A KR 940019440 A KR940019440 A KR 940019440A
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- cam
- molding
- plate
- chase
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/66—Mould opening, closing or clamping devices mechanical
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C2045/648—Rack and pinion means for mould opening and closing a pair of mould halves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
- B29C45/66—Mould opening, closing or clamping devices mechanical
- B29C2045/667—Cam drive for mould closing or clamping
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 발명은 봉입 성형용의 모울딩 프레스 장치의 금형의 관한 것으로, 구체적으로는 캠 구동방식으로 봉입성형(ENCAPSULATION)을 위한 수지를 압송시키면서 낭비를 최소화시키도록 등거리에 다수의 포트와 플린저를 갖추고, 기존의 모울딩 프레스 장치에 적용이 가능하게 설계된 금형에 관한 것이다.The present invention relates to a mold of a molding press apparatus for encapsulation. Specifically, a plurality of ports and plungers are equidistantly equilibrated to minimize waste while feeding resin for encapsulation by a cam driving method. The present invention relates to a mold designed to be applicable to a conventional molding press apparatus.
본 발명은 봉입 성형용 모울딩 프레스 장치의 상ㆍ하부 금형에 있어서, 상ㆍ하형 플레이트 사이의 상ㆍ하 체이스상에 상ㆍ하 캐비티블럭이 설치되고, 이 상ㆍ하 캐비티블럭내에 리드프레임이 놓여져서, 상ㆍ하 캐비티블럭에 장착되는 런너블럭의 런너를 따라 용융된 수지가 상기 리드프레임을 봉입시키도록 압송되도록 하되, 하부금형상에 캠지지봉을 설치하여 캠축에서 시이소오 운동이 되도록 캠을 설치하고, 이 캠의 일측을 눌러주도록 압력로드가 하부금형을 관통하여 수직으로 설치되며, 캠의 타측은 쿠션블럭상의 플런저와 일체로 결합된 하이동판을 하부에 떠받치듯 접촉되고, 상기 하이동판은 랙과 피니언으로 구성되는 기어로 수평 승강되게 결합된 채 스프링블럭상에 복원용 스프링으로 탄지되는 구성을 갖는 것이다.The upper and lower cavity blocks are provided on the upper and lower chases between the upper and lower mold plates, and the lead frame is placed in the upper and lower cavity blocks in the upper and lower molds of the molding press apparatus for sealing molding. The molten resin is pushed along the runner of the runner block mounted on the upper and lower cavity blocks so as to enclose the lead frame. The pressure rod is installed vertically through the lower mold so as to press one side of the cam, and the other side of the cam contacts the high copper plate integrally coupled with the plunger on the cushion block as if it is holding the lower copper plate. It is to have a configuration that is supported as a restoring spring on the spring block while being coupled horizontally elevated by the gear consisting of and pinion.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1도는 반도체 칩에 봉입성형(ENCAPSULATION)하는 예를 설명하기 위하여 리드프레임을 평면 및 정면 도시한 도면.1 is a plan view showing a lead frame in front and in order to explain an example of encapsulation in a semiconductor chip.
제2도는 제1도의 리드프레임에 봉입성형을 하는 종래의 실시예시도.2 is a view showing a conventional embodiment of encapsulating the lead frame of FIG.
제3도는 종래 모울딩 프레스 장치의 예시도.3 is an illustration of a conventional molding press apparatus.
제5도는 제9도보다 개선된 종래의 모울딩 금형의 에시도.FIG. 5 is an illustration of a conventional molding die improved over FIG.
제8도는 제7도중 하부금형의 구성을 평면에서 도시한 도면.8 is a plan view showing the configuration of the lower mold in FIG.
제10도는 체이스의 확대 도면으로, (A)는 상체이스의 평면 구성도, (B)는 하부체이스의 저면 구성도이다.10 is an enlarged view of the chase, (A) is a plan view of the upper chase, and (B) is a bottom view of the lower chase.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930002361A KR960007278B1 (en) | 1993-02-20 | 1993-02-20 | Molding mould |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019930002361A KR960007278B1 (en) | 1993-02-20 | 1993-02-20 | Molding mould |
Publications (2)
Publication Number | Publication Date |
---|---|
KR940019440A true KR940019440A (en) | 1994-09-14 |
KR960007278B1 KR960007278B1 (en) | 1996-05-30 |
Family
ID=19351032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019930002361A KR960007278B1 (en) | 1993-02-20 | 1993-02-20 | Molding mould |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960007278B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101242441B1 (en) * | 2008-12-19 | 2013-03-12 | 세메스 주식회사 | Die casting apparatus for semiconductor device auto molding system |
-
1993
- 1993-02-20 KR KR1019930002361A patent/KR960007278B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101242441B1 (en) * | 2008-12-19 | 2013-03-12 | 세메스 주식회사 | Die casting apparatus for semiconductor device auto molding system |
Also Published As
Publication number | Publication date |
---|---|
KR960007278B1 (en) | 1996-05-30 |
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