JP4579275B2 - Resin mold - Google Patents

Description

  The present invention relates to a configuration of a resin mold for resin-sealing a semiconductor device. In particular, the present invention relates to a structure of a resin mold for sealing a thin semiconductor device with resin.

  With the development of technology in recent years, semiconductor devices have become thinner and smaller, and semiconductor devices in which only one surface of a substrate is sealed with resin have been put into practical use. In particular, in the reduction in thickness, in addition to the application of a thinner substrate, the semiconductor element thinning technique, and the low bonding wire technique, the resin that protects the semiconductor element is also becoming thinner. When such a thin molded object is resin-sealed, warping of the substrate, which is the molded object when resin-sealing, becomes an obstacle during molding, causing problems such as resin leakage.

  For such problems, Patent Document 1 discloses a technique in which a part for setting a molding is made of a porous material, and the molding is air-adsorbed through the porous material to correct the warp. Yes. The figure shown in the resin mold using the porous material of Patent Document 1 (part of FIGS. 1 and 3) is a plan view of the lower mold of the resin mold (FIG. 8), and the cavity insert They are shown as a plan view (FIG. 9A) and a side view (FIG. 9B), respectively. Patent Document 2 discloses a molding apparatus that uses a porous material to prevent generation of burrs of bubbles, sink marks, and resin during molding.

JP 2001-277306 A (FIGS. 1 and 3) JP-A-8-192438

  However, in the resin mold disclosed in Patent Document 1, it has become clear from the experiments of the present inventor that the warp may not be sufficiently corrected when the substrate, which is a molding object, becomes thinner. In the case of a thin substrate, the warp could not be corrected sufficiently, so that resin leakage occurred, and the resin was filled in the pores of the porous material, causing a problem in air adsorption. The first cause is that the material is made of a porous material whose rigidity is lowered to the part to be clamped, so that the clamping force is reduced so that the molded object cannot be clamped sufficiently and the resin leaks. The second cause is that there is a case where the warping of the substrate, which is a molded object, cannot be corrected by air adsorption alone.

  In recent years, when a thin semiconductor device is manufactured using a lead frame, it has become common to attach a resin substrate under the lead frame as a sealing resin for sealing resin. In this way, when the substrate is formed of a composite of a lead frame and a resin substrate whose molding is made of metal, the resin substrate can be adsorbed by air adsorption. However, the lead frame affixed thereon is peeled off from the above-described resin substrate due to warpage due to heat, and a phenomenon that the sealing resin leaks between the lead frame and the resin substrate occurs. In particular, in a thin lead frame having a thickness of 100 micrometers or less, the rigidity thereof is extremely lowered, so that such a problem due to heat becomes prominent and becomes a serious problem. Further, Patent Document 2 has a problem different from that of the present invention, and its specific configuration is not shown, and does not suggest means for solving the problem in the present invention.

  The purpose of the present invention is to increase the clamping force of the molding while correcting the warp due to the heat of the substrate that is the molding using the porous material, and to prevent the resin leakage of the sealing resin into the porous material portion. It is in providing the resin mold metal mold | die which can be prevented.

The resin mold mold of the present invention includes an upper mold and a lower mold for resin-sealing an object including a substrate and a semiconductor element mounted on one surface of the substrate. One is provided with a first clamp part, the other of the upper mold or lower mold is provided with a flat set part for supporting the other surface of the substrate, and the first clamp part is a resin to which resin is pumped A peripheral portion of the fluidized portion is provided with a convex crush, and the set portion is composed of a porous portion having a hole penetrating the plane and a surface opposite to the plane, and a non-porous metal body And the second clamp part is configured to clamp the substrate with the first clamp part and the second clamp part.

  Thus, the clamp part of a resin mold metal mold | die is comprised by a metal body, the rigidity of a resin mold metal mold | die is raised, and the clamping force of the position which crushes the board | substrate which is a to-be-molded object slightly can be applied. In addition, by improving the clamping force, it is possible to completely prevent resin leakage from the resin molding part of the molding, protect the porous material, ensure air adsorption, and completely warp the molding. Correction is possible. Further, since the set portion is made of a porous material, the resin molding portion of the molding can be adsorbed to the support surface of the resin mold mold over almost the entire surface.

  Next, embodiments of the present invention will be described in detail with reference to the drawings as examples.

  The first embodiment will be described in detail with reference to FIGS. FIG. 1 is a plan view showing the configuration of the lower mold 100 of the resin mold in Example 1. FIG. 2 and 3 are sectional views of the respective molds taken along the lines A-A 'and B-B' of FIG. The resin mold of the present embodiment is for resin molding a molding object on which a large number of semiconductor elements are mounted in a matrix on one surface of a thin substrate 14.

  A lower mold 100 shown in FIG. 1 is provided with a resin flow block 2 through which resin from a pot 16 passes, a cavity block 5 including a resin molding area 4, side blocks 3 arranged at both ends of the cavity block 5, and substrate positioning pins 8. The guide block 6 is made up of. The substrate is set in the substrate mounting area 7 (indicated by a two-dot chain line) by the substrate positioning pins 8. In the resin molding area 4 (indicated by a broken line) including the semiconductor element of the substrate, the resin from the pot 16 passes through the resin flow area 1 (indicated by the alternate long and short dash line) to resin mold the object to be molded.

  The resin flow block 2 is provided between the pot 16 and the resin molding area 4. It is composed of a rigid metal body with a width of about 2 mm at a position along the end face of the molded product in the substrate mounting area 7 which is a flat area for supporting the molded product, and clamps the molded product when resin molding is performed. To do. The resin flow block 2 does not necessarily need to be limited to a width of 2 mm, but needs a width that secures an area for securely clamping the molding.

  The cavity block 5 is provided at the position of the resin molding area 4 and has an upper surface formed as a flat surface in order to support the molding target in a flat shape. The upper surfaces of the substrate mounting area 7 of the resin flow block 2 and the guide block 6 are also formed on a flat surface having the same height as the upper surface of the cavity block 5. The side block 3 and the guide block 6 are made of a metal body to give the lower mold 100 rigidity. The guide block 6 is provided with substrate positioning pins 8 in order to prevent displacement of the mounting position of the substrate 14 that is the molding target.

  The cavity block 5 is formed of a porous material (cavity block 5a) in which a large number of air suction holes are formed in order to support the object to be molded by air suction over the entire surface. The material of the porous material is not particularly limited as long as the porous material is formed with pores capable of air-sucking the workpiece. As the size (diameter) of the pores, a size of about several micrometers to several tens of micrometers is suitable, and a heat resistant temperature of about 200 ° C. is necessary. In the following description, in the plan view, the cavity block is generically referred to as the cavity block 5 and in the sectional view, for example, the cavity block 5a is indicated with a suffix.

  FIG. 2 shows a sectional view of the mold along the line A-A ′ of FIG. 1. This figure shows a lower mold 100 and an upper mold 101 of a resin mold. The lower mold 100 is configured to flatly support the substrate 14 to be molded on the flat surface of the upper surface of the cavity block 5a, the resin flow block 2 and the guide block 6 through the positioning pins 8 as described above. ing. The substrate 14 is set flat on the set portion using the substrate mounting area 7 as a set portion. The upper surfaces of the resin flow block 2, the cavity block 5a, and the guide block 6 constituting the set portion are formed as flat surfaces having the same height, and can support the substrate flat.

  The cavity block 5a draws and sucks a large number of pores of the porous material by an air suction mechanism (not shown) from the lower surface opposite to the upper surface on which the molding target is mounted. In this way, the cavity block 5a becomes an adsorbing portion, and the substrate 14 that is a molding object can be supported by air suction. A plunger 18 is provided below the pot 16, and the sealing resin in the pot 16 is injected by the plunger 18.

  The upper mold 101 has a cull portion 17 for pouring resin into the resin molding area 4, a resin flow portion 11 and a resin molding portion 12, and a crushing 13 for clamping the substrate. The cull part 17, the resin flow part 11, the resin molding part 12, and the crushing 13 are made of a metal body. A resin flow portion 11 called a runner is provided so as to face the resin flow area 1 through the substrate 14 and a resin molding portion 12 to face the resin molding area 4. Further, a cull portion 17 is provided so as to face the pot 16.

  A convex crushing 13 protruding toward the lower mold side is provided at the peripheral edge of the resin flow part 11. The width of the crushing 13 is the same as that of the resin flow block 2, and the protruding amount is made of a metal body of about 1 to 10 micrometers. The crushing 13 is securely clamped by slightly crushing the substrate 14 that is a molding object when resin molding is performed. When clamping the board | substrate 14, the crushing 13 is made into the 1st clamp part, the resin flow block 2 is made into the 2nd clamp part, and the board | substrate 14 is clamped from the upper and lower sides. At this time, the distance between the first clamp portion and the second clamp portion is shorter than the thickness of the substrate by the amount of protrusion of the crushing 13. Accordingly, the substrate is crushed and the substrate is clamped by the protruding amount. The protruding amount of the crushing 13 is not necessarily 1 to 10 micrometers, but it is necessary to secure an protruding amount for reliably clamping the molded article without causing abnormal deformation.

  FIG. 3 is a cross-sectional view taken along the line B-B ′ of FIG. Only the resin flow block 2 is shown in the lower mold 100, and the substrate 14, which is a molding object, is configured to be supported flat on the flat surface of the upper surface of the resin flow block 2. The upper mold 101 has a resin flow part 11 and a convex crush 13 protruding to the lower mold side at the peripheral part thereof, and the side surface of the resin flow part 11 and the convex side surface of the crush 13 are formed in the same plane. It is composed of a metal body.

  The metal body here means a rigid metal that is generally used as a mold application, and is not the above-described porous material that can be vented. Moreover, the board | substrate 14 which is a to-be-molded object is not specifically limited. For example, the present invention can be applied to a thin resin film substrate, a thin rigid substrate, and a substrate in which a back tape is attached to a thin metallic lead frame. In addition to the substrates described above, the present invention can be applied to substrates that need to be securely clamped. As described above, the substrate is not particularly limited, but the present invention is particularly effective when warpage or misalignment is likely to occur when the resin mold is set.

  For example, in the case of a thin substrate of 100 micrometers or less, the substrate is likely to be deformed by the influence of heat, and warpage and positional deviation are likely to occur. Therefore, a large effect can be obtained by reliably performing substrate clamping with the resin mold of the present invention. Further, when the lead frame formed on the substrate is thin and has a thickness of 100 micrometers or less, the rigidity of the lead frame is lowered, and warpage and misalignment are more likely to occur. Therefore, when the substrate clamp of the present invention is applied, a greater effect can be obtained.

  Next, the resin molding process flow will be described using the resin mold having the above-described structure. First, a substrate 14 which is a molding on which a large number of semiconductor elements are mounted in a matrix on one surface is placed on the lower mold 100 so that the semiconductor elements face upward. The substrate 14 is placed at a predetermined position by the substrate positioning pins 8. The substrate 14 is supported flat by air suction from the lower surface of the porous cavity block 5a to the flat surface of the substrate mounting area 7 by an air suction mechanism. Compared with the case of a cavity block made of a conventional metal body, this structure, which is made of a porous material and sucks air, can eliminate the accumulation of air in the gap between the substrate 14 and the cavity block 5. Therefore, the floating of the substrate due to the thermal expansion of air in the gap between the substrate 14 and the cavity block 5 can be eliminated. Further, the warpage of the substrate 14 can be corrected by air suction.

  Next, a tablet-shaped sealing resin is put into the lower mold pot 16 to perform mold clamping. In clamping, the crushing 13 first hits the substrate 14 to perform clamping. The upper mold crush 13 and the lower mold resin flow block 2 are made of a metal body and have high rigidity, and can be reliably clamped by slightly crushing the peripheral edge corresponding to the resin flow section 11 of the substrate 14. When the clamping of the protruding amount of the crushing 13 is finished, the substrate at the portion corresponding to the periphery of the resin filling portion other than the resin flow portion 11 including the resin molding portion is clamped. The clamp is not as strong as the portion corresponding to the crush 13, but there is almost no gap between the upper mold and the substrate, and the sealing resin does not flow out during the molding of the resin mold. In addition, air suction of the cavity block 5a is also performed during mold clamping.

  After completing the mold clamping, the plunger 18 operates from below the lower mold pot 16 to inject the sealing resin in the pot. The sealing resin is filled into the resin molding part 12 from the upper mold part 17 through the resin flow part 11. The substrate 14 at the peripheral portion of the resin flow portion 11 is slightly crushed by the crushing 13 and is securely clamped, and leakage of the sealing resin from the end surface corresponding to the peripheral portion of the resin flow portion 11 of the substrate 14 can be prevented. By doing in this way, there is no generation | occurrence | production of the resin flow to the resin flow block 2 and the cavity block 5a of the lower mold | type flat area | region which is a support surface of the board | substrate 14. FIG. Further, air suction of the cavity block 5a is performed until the molding of the sealing resin is completed. The molding of the sealing resin is finished, the mold is opened after a resin curing time in the mold, the substrate 14 on which the sealing resin is formed is taken out, and the resin molding process flow is completed.

  In this embodiment, the object to be molded is supported by the lower mold by air suction. However, it is not always necessary to perform air suction. For example, in the case of a molded article in which the air in the gap between the substrate and the cavity block escapes from the porous material to the outside and the substrate does not float and the substrate is hardly warped, it is not necessary to perform air suction. The start and stop timing of the air suction is the best example, and when there is no problem, it can be set to a time other than the above.

  As described above, when the workpiece is set, the lower mold positioning pins can be mounted without displacement, and can be supported flat on the flat surface by air suction of the cavity block portion. In addition, a resin flow block formed of a rigid metal body is formed on the lower mold, and a convex crush formed of a rigid metal body protruding toward the lower mold side at the periphery of the resin flow portion is formed on the upper mold facing the lower mold. Provided. With the lower mold resin flow block and the upper mold convex crushing, it is possible to reliably clamp the molded object corresponding to the resin flow section by a slight crushing. Even in the peripheral portion where the resin other than the resin flow block is filled, it is possible to clamp without being affected by crushing. Further, there is no occurrence of deformation or warping of the molded article due to crushing, and there is no adverse effect on the subsequent process.

  As described above, the mold of the set portion on which the substrate 14 is set includes the resin flow block 2, the cavity block 5a, and the guide block 6. The upper surface of the set portion is formed as a flat surface having the same height and supports the substrate in a flat shape. The substrate set flat on the set unit is sucked into the air by the cavity block 5a, which is a suction unit, and is sucked onto the set unit. Furthermore, the board | substrate is clamped by making the crushing 13 formed with the metal body into the 1st clamp part, and using the resin flow block 2 formed with the metal body as the 2nd clamp part. By clamping the substrate in this way, resin leakage can be prevented.

  In the present invention, a resin flow block composed of a metal body having higher rigidity than the porous material and a convex crush provided at the peripheral edge of the opposed resin flow portion are provided. By the convex crushing of the resin flow block and the facing, the molded object corresponding to the resin flow part is slightly crushed to enable reliable clamping. By securely clamping the molding, it is possible to completely prevent resin leakage. In addition, by using a metal body for the resin flow block area, it is possible to reduce the use area of the expensive porous material, and to obtain the effect of reducing the price of the resin mold.

  A second embodiment of the present invention will be described with reference to FIGS. In FIG. 4, the top view which shows the structure of the lower mold | type 200 of the resin mold metal mold | die in Example 2 is shown. FIG. 5 shows a cross-sectional view of the mold along the line A-A ′ of FIG. 4. The resin mold of the present embodiment is for resin molding a molding object on which a large number of semiconductor elements are mounted in a matrix on one surface of a thin substrate 14. Example 1 is an example in which a resin flow area which is a peripheral part of a substrate is clamped. In this embodiment, the semiconductor element is further clamped around the resin molding portion which is a resin molding area for resin sealing. In addition, the same components as those in the first embodiment are denoted by the same reference numerals.

  Referring to FIG. 4, the lower mold 200 is similar to the first embodiment in that the resin flow block 2 through which the resin from the pot 16 passes, the cavity block 5 including the resin molding area 4, and the side blocks disposed at both ends of the cavity block 5. 3. It is comprised from the guide block 6 in which the board | substrate positioning pin 8 was installed. The difference from Example 1 is that the cavity block 5 is made of only a region of the resin molding area 4 as a porous material, and its periphery is formed of a rigid metal body (insert block).

  The resin flow block 2 is provided between the pot 16 and the resin molding area 4. It is comprised with the metal body in the position along the end surface of the to-be-molded object of the board | substrate mounting area 7 which is a plane area | region which supports a to-be-molded object, and clamps a to-be-molded object when resin-molding. The cavity block 5 is provided at the position of the resin molding area 4 and has an upper surface formed as a flat surface in order to support the molding target in a flat shape.

  The upper surfaces of the substrate mounting area 7 of the resin flow block 2 and the guide block 6 are also formed on a flat surface having the same height as the upper surface of the cavity block 5. The side block 3 and the guide block 6 are made of a metal body in order to give the rigidity of the lower mold 200. The guide block 6 is provided with substrate positioning pins 8 in order to prevent displacement of the mounting position of the substrate 14 that is the molding target. The resin flow block 2 can also be configured as the same block as the metal body portion of the side block 3 or the cavity block 5.

  The region corresponding to the resin molding area 4 of the cavity block 5 is supported by a porous material (cavity block 5b) in which a large number of air suction holes are formed in order to support the object to be molded by air suction over the entire surface. Constitute. The periphery is composed of a rigid metal body (insert block 5c). The material of the porous material is not particularly limited as long as the porous material is formed with pores capable of air-sucking the workpiece. As the size of the pores, a size of about several micrometers to several tens of micrometers is suitable, and a heat resistant temperature of about 200 ° C. is necessary.

  FIG. 5 shows a cross-sectional view taken along the line A-A ′ of FIG. 4. This figure shows a lower mold 200 and an upper mold 201 of a resin mold. The lower mold 200 is configured to flatly support the substrate 14 as a molding object via the positioning pins 8 on the flat surfaces of the cavity block 5, the resin flow block 2 and the guide block 6 as described above. ing. The cavity block 5 includes a porous cavity block 5 b corresponding to the resin molding area 4 and a metal insert block 5 c corresponding to a region other than the resin molding area 4.

  The substrate 14 is set flat on the set portion using the substrate mounting area 7 as a set portion. The upper surfaces of the resin flow block 2, the cavity block 5b, the insert block 5c, and the guide block 6 constituting the set portion are formed as flat surfaces having the same height, and can support the substrate 14 flatly. The cavity block 5b draws and sucks a large number of pores of the porous material by an air suction mechanism (not shown) from the lower surface, which is the opposite surface of the upper surface on which the workpiece is mounted. In this way, the cavity block 5b becomes an adsorbing portion, and the substrate 14 that is a molding object can be supported by air suction.

  The upper mold 201 has a cull portion 17 for pouring resin into the resin molding area 4, a resin flow portion 11 and a resin molding portion 12, and a crushing portion 13 for clamping the substrate. The cull part 17, the resin flow part 11, the resin molding part 12, and the crushing 13 are made of a metal body. A resin flow portion 11 called a runner is provided so as to face the resin flow area 1 through the substrate 14 and a resin molding portion 12 to face the resin molding area 4. Further, a cull portion 17 is provided so as to face the pot 16.

  A convex crushing 13 protruding to the lower mold side is provided at the peripheral portion of the portion where the sealing resin including the resin flow portion 11 and the resin molding portion 12 is fluidly filled. The protruding amount of the crushing 13 is made of a metal body having a size of about 1 to 10 micrometers, and when the resin molding is performed, the substrate 14 that is a molding object is slightly crushed and clamped securely. When the substrate 14 is clamped, the substrate 13 is clamped from above and below using the crushing 13 as the first clamp portion and the resin flow block 2 and the insert block 5c as the second clamp portion. The protruding amount of the crushing 13 is not necessarily 1 to 10 micrometers, but it is necessary to secure an protruding amount for reliably clamping the molded article without causing abnormal deformation. Further, the side surface of the resin flow filling portion and the side surface of the convex portion of the crush 13 are formed in the same plane and are made of a metal body.

  As described above, the mold of the set portion on which the substrate 14 is set includes the resin flow block 2, the cavity block 5b, the insert block 5c, and the guide block 6. The cavity block 5b is formed of a porous material, and the insert block 5c is formed of a metal body. The upper surface of the set portion is formed as the same flat surface having the same height, and supports the substrate in a flat shape. The substrate set flat on the set part is sucked into the air by the cavity block 5b, which is an adsorbing part, and adsorbed on the set part. Furthermore, the board | substrate is clamped in a wide area | region using the crushing 13 formed with the metal body as a 1st clamp part, and the resin flow block 2 and the insert block 5c formed with the metal body as a 2nd clamp part. By clamping the substrate in this way, resin leakage can be prevented.

  Compared with the first embodiment, the present embodiment is a resin mold having a structure in which the crushing 13 is provided in a wide range and clamped more reliably. With this configuration, the resin flow part including the resin molding area on the surface side where the sealing resin of the substrate is formed and the peripheral part of the resin filling part are slightly crushed so that the clamping can be reliably performed. Therefore, as in Example 1, it is possible to completely prevent resin leakage from the resin flow part. Furthermore, resin leakage from the resin molding area can be completely prevented. In addition, by using a metal body in a region other than the resin molding area, it is possible to reduce the use area of the porous material that is more expensive than the mold of the first embodiment. Therefore, the effect of reducing the price of the resin mold is obtained, and the rigidity of the whole mold is also improved.

  A third embodiment of the present invention will be described with reference to FIGS. In FIG. 6, the top view which shows the structure of the lower mold | type 300 of the resin mold metal mold | die in Example 3 is shown. FIG. 7 shows a cross-sectional view of the mold along the line A-A ′ of FIG. 6. The resin mold of the present embodiment is for resin molding a molding object on which a large number of semiconductor elements are mounted in a matrix on one surface of a thin substrate 14. In addition, the same components as those in the first embodiment are denoted by the same reference numerals.

  In a lower mold 300 shown in FIG. 6, a metal block insert 10 made of a metal body is inserted into a resin flow area 1 through which resin from a pot 16 passes, and a cavity block 5 including a substrate mounting area 7, a cavity The enclosure block 9 and the board positioning pins 8 are arranged so as to surround the block 5. The cavity block 5 has a region larger than the substrate mounting area 7 and is made of a porous material (cavity block 5d). The width of the insert 10 has a shape wider by 0.5 mm or more on one side than the width of the resin flow block 2 of the lower mold 300. Further, the insert 10 may be configured as a resin flow block having a length up to the end face of the side block 3 or a length equivalent to the substrate as in the first embodiment instead of the block configuration.

  The insert 10 is provided between the pot 16 and the resin molding area 4 and is formed of a metal body at a position along the end surface of the molding in the substrate mounting area 7 which is a planar region for supporting the molding. Is done. When the resin molding is performed, the object to be molded is clamped. The cavity block 5 is provided in a region equal to or larger than the substrate mounting area 7 and has an upper surface formed as a flat surface in order to support the object to be molded in a flat shape. The cavity block 5 is provided with substrate positioning pins 8 in order to prevent displacement of the mounting position of the substrate 14 that is a molding target. The upper surface of the insert 10 is also formed as a flat surface having the same height as the upper surface of the cavity block 5. The enclosure block 9 is made of a metal body to give the rigidity of the lower mold 300.

  The cavity block 5 is constituted by a porous material (cavity block 5d) in which a large number of air suction holes are formed in order to support the object to be molded by air suction over the entire surface thereof. The material of the porous material is not particularly limited as long as the porous material is formed with pores capable of air-sucking the workpiece. As the size of the pores, a size of about several micrometers to several tens of micrometers is suitable, and a heat resistant temperature of about 200 ° C. is necessary.

  FIG. 7 is a cross-sectional view taken along the line A-A ′ of FIG. 6. This figure shows a lower mold 300 and an upper mold 301 of a resin mold. The lower mold 300 is configured to support the substrate 14 as a molding object flatly on the flat surface of the upper surface of the cavity block 5d and the upper surface of the insert 10 through the positioning pins 8 as described above. The insert 10 is fixed to the lower resin flow block 2 with a fixing screw 15. The substrate 14 is set flat on the set portion using the substrate mounting area 7 as a set portion. The upper surface of the insert 10 and the cavity block 5d constituting the set portion is formed as a flat surface having the same height, and can support the substrate flat. The cavity block 5d sucks the substrate 14 from the lower surface, which is the opposite surface of the upper surface on which the workpiece is mounted, by aerating many holes of the porous material by an air suction mechanism (not shown). In this way, the cavity block 5d becomes an adsorbing portion, and the substrate 14 that is a molding object can be supported by air suction.

  The upper mold 301 has a cull part 17 for pouring resin into the resin molding area 4, a resin flow part 11 and a resin molding part 12, and a crushing part 13 for clamping the substrate. The cull part 17, the resin flow part 11, the resin molding part 12, and the crushing 13 are made of a metal body. A resin flow portion 11 called a runner is provided so as to face the resin flow area 1 through the substrate 14 and a resin molding portion 12 to face the resin molding area 4. Further, a cull portion 17 is provided so as to face the pot 16.

  A convex crushing 13 protruding toward the lower mold side is provided at the peripheral edge of the resin flow part 11. The width of the crushing 13 is a shape facing the nest 10 and the protruding amount is made of a metal body of about 1 to 10 micrometers. When the resin molding is performed, the peripheral portion of the resin flow area 1 of the substrate 14 that is the molding target is securely clamped by being crushed slightly by the crushing 13. When clamping the board | substrate 14, the board | substrate is clamped from the upper and lower sides using the crushing 13 as a 1st clamp part and the insert 10 as a 2nd clamp part. The protruding amount of the crushing 13 is not necessarily 1 to 10 micrometers, but it is necessary to secure an protruding amount for reliably clamping the molded article without causing abnormal deformation. Further, the side surface of the resin flow filling portion and the side surface of the convex portion of the crush 13 are formed in the same plane and are made of a metal body.

  As described above, the mold of the set portion on which the substrate 14 is set is composed of the insert 10 and the cavity block 5d. The cavity block 5d is formed of a porous material, and the insert 10 is formed of a metal body. The upper surface of the set portion is formed as the same flat surface having the same height, and supports the substrate in a flat shape. The substrate set flat on the set part is sucked into the air by the cavity block 5d, which is an adsorbing part, and adsorbed on the set part. Furthermore, the board | substrate is clamped by using the crushing 13 formed with the metal body as a 1st clamp part, and the nest | insert 10 formed with the metal body as a 2nd clamp part. By clamping the substrate in this way, resin leakage can be prevented.

  In the present embodiment, a nesting composed of a metal body having a higher rigidity than that of the porous material and a convex crush provided on the peripheral edge of the opposed resin flow portion are provided. Due to the convex crushing facing the nest, the object to be molded is slightly crushed to enable reliable clamping. By securely clamping the object to be molded, it is possible to completely prevent the resin leakage from the resin flow part as in the first embodiment. Further, since most of the conventional resin mold can be used as it is, it is not necessary to manufacture a new mold, and the investment amount can be reduced.

  In the resin mold of the present invention, at least the resin molding part of the molding object including the planar region that supports the molding object is formed with a large number of through-holes on the opposite surface from the setting surface of the molding object. It is made of a porous material. And it is set as the structure which made the metal body the part which clamps the to-be-molded object of the plane area | region which supports a to-be-molded object with an upper mold | type and a lower mold | type.

  By doing so, the rigidity of the resin mold in the clamp portion can be increased, and the object to be molded can be reliably clamped. Further, this porous material portion preferably has a structure communicating with an air suction mechanism provided outside the mold in order to securely adsorb the resin molded portion of the molded article with air. Furthermore, the resin mold structure at the periphery of the molding, which is the part that clamps the molding between the upper mold and the lower mold, causes the resin to leak into the porous material part by slightly crushing the molding. It is preferable to prevent. For this reason, it is preferable that the separation distance between the upper mold and the lower mold at the time of resin filling in this portion is configured to be 1 to 10 micrometers shorter than the thickness of the molding object.

  Thus, the clamp part of a resin mold metal mold | die is comprised by a metal body, the rigidity of a resin mold metal mold | die is raised, and the clamping force of the position which crushes the board | substrate which is a to-be-molded object slightly can be applied. In addition, by improving the clamping force, it is possible to completely prevent resin leakage from the resin molding part of the molding, protect the porous material, ensure air adsorption, and completely warp the molding. Correction is possible. Moreover, since this part is comprised with a porous material, the resin molding part of a to-be-molded object can be adsorb | sucked to the support surface of a resin mold metal mold | die over almost whole surface.

  In the resin mold according to the present invention, the resin molding portion of the molding is made of a porous material, and the portion to be clamped is made of a metal body. With this configuration, it is possible to reliably clamp the molding by crushing the resin flow portion with a rigid metal body while correcting the floating or warping of the molding using the porous material. By securely clamping the molding, leakage of the sealing resin can be surely prevented. ADVANTAGE OF THE INVENTION According to this invention, the resin mold metal mold | die which can prevent the leakage of sealing resin reliably is obtained.

  Although the present invention has been specifically described above based on the embodiments, the present invention is not limited to the above-described embodiments. Various modifications can be made without departing from the scope of the present application, and it goes without saying that these modified examples are also included in the present application. For example, in this embodiment, the crush which is the first clamp is provided on the upper mold of the resin mold, and the second clamp is provided on the lower mold of the resin mold. However, conversely, the first and second clamps may be provided on the lower mold and the upper mold. Thus, it can be applied to various application examples.

  As an application example of the present invention, there is a resin sealing mold for an electronic device including a semiconductor device that is sealed on one surface using a resin.

It is a top view of the lower mold | type of the resin mold metal mold | die in Example 1 of this invention. It is sectional drawing of the resin mold metal in the A-A 'line in FIG. It is sectional drawing of the resin mold metal in the B-B 'line in FIG. It is a top view of the lower mold | type of the resin mold metal mold | die in Example 2 of this invention. It is sectional drawing of the resin mold metal in the A-A 'line in FIG. It is a top view of the lower mold | type of the resin mold metal mold | die in Example 3 of this invention. It is sectional drawing of the resin mold metal in the A-A 'line in FIG. It is a top view of the lower mold | type of the resin mold metal mold | die in a prior art example. It is the top view (A) of the cavity insert of the resin mold metal mold | die in a prior art example, and a side view (B).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Resin flow area 2 Resin flow block 3 Side block 4 Resin molding area 5 Cavity block 5a Cavity block 5b Cavity block 5c Insert block 5d Cavity block 6 Guide block 7 Substrate mounting area 8 Substrate positioning pin 9 Enclosing block 10 Nesting 11 Resin flow Part 12 Resin molding part 13 Squash 14 Substrate 15 Fixing screw 16 Pot 17 Cull part 18 Plunger 100 Lower mold 101 of resin mold in Example 1 Upper mold 200 of resin mold in Example 1 Resin mold in Example 2 Lower mold 201 Upper mold 300 of resin mold mold in Example 2 Lower mold 301 of resin mold mold in Example 3 Upper mold of resin mold mold in Example 3

Claims (9)

A resin mold having an upper mold and a lower mold for resin-sealing an object to be formed including a substrate and a semiconductor element mounted on one surface of the substrate,
One of the upper mold or the lower mold is provided with a first clamp part, and the other of the upper mold or the lower mold is provided with a flat set part for supporting the other surface of the substrate,
The first clamp part is provided with a convex crush on the peripheral part of the resin flow part to which the resin is pumped,
The set portion includes an adsorption portion made of a porous material having a hole penetrating the plane and a surface opposite to the plane, and a second clamp portion made of a non-porous metal body. ,
A resin mold, wherein the first clamp part and the second clamp part are configured to clamp the substrate. The resin mold according to claim 1, wherein the crushing is provided only in the other mold of the mold provided with the set surface. 3. The resin mold according to claim 1, wherein the first clamp portion is made of a non-porous metal body. 4. The resin mold according to claim 1 , wherein the diameter of the hole is several micrometers to several tens of micrometers. 5. The resin mold according to claim 1 , wherein the suction part is configured to communicate with an air suction mechanism provided outside the mold. When the object to be formed is resin-sealed, the separation distance between the convex crush of the first clamp part and the second clamp part is 1 to 10 micrometers shorter than the thickness of the substrate. The resin mold according to any one of claims 1 to 5 , wherein the mold is configured. The thickness of the said board | substrate is 100 micrometers or less, The resin mold metal mold | die of Claim 6 characterized by the above-mentioned. The resin mold mold according to any one of claims 1 to 7, wherein the first clamp part is configured to clamp a peripheral part of the substrate. The said upper mold | type is provided with the resin formation part for resin-sealing the said semiconductor element, and said 1st clamp part was provided in the periphery of the said resin formation part, The one of Claim 1 thru | or 8 characterized by the above-mentioned. The resin mold die as described in 2.

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