JP2005150458A - Resin sealing and forming method of semiconductor chip and resin sealing and forming die - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing and forming method which effectively prevents the deformation of a substrate 4 such as the warping or curving of the substrate 4 occurring at resin sealing and forming, and to provide a resin sealing and forming die. <P>SOLUTION: By using the resin sealing and forming die on a die plane 13 supporting a rear face 8 opposed to a front face 7 of the substrate 4 mounting a semiconductor chip 5, a recess 15 having a required equivalent depth C set as a wider range than a product effective range Y of the substrate 4 is provided, also an inside of the recess 15 is reduced in pressure (e.g., an air in the recess 15 is forcibly sucked via a communication groove 17 and a suction hole 16) prior to a filling action of a melted resin 18 into a cavity 12, thereby making an operation of correcting at least a portion of the product effective range Y of the substrate 4 to an equivalent flat-topped attitude. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin sealing molding method for resin sealing molding of a semiconductor chip mounted on a substrate surface using a resin sealing molding die, and an improvement of the resin sealing molding die.

  2. Description of the Related Art Conventionally, a plurality of semiconductor chips (electronic components) mounted on a substrate are collectively molded with a resin sealing mold.

That is, the conventional mold for resin sealing molding is provided with an upper mold and a lower mold. In addition, the substrate for resin sealing molding is configured such that, for example, a plurality of semiconductor chips (electronic components) and a wire that electrically connects the substrate and the chip are mounted on one surface. A resin molded body portion for resin-molding chip wires and a substrate outer peripheral portion that is not resin-sealed molded are formed on the surface, and an electronic component non-mounting surface that does not mount electronic components is formed on the back surface of the substrate. It is configured. In addition, on the upper mold surface (upper mold surface), a resin passage for injecting a heat-melted resin material, a cavity communicating with the resin passage and fitted with a chip wire to form a resin seal And are provided. In addition, the lower mold surface (lower mold surface) is provided with a recess for setting a substrate that can supply and set the substrate on which the chip wire is mounted at a predetermined position on the lower mold surface. It is configured to supply and set in the recess with the mounting side facing upward. The recess bottom surface (lower mold surface) for supplying and setting the electronic component non-mounting surface, which is the back surface of the substrate, is a flat surface.
Accordingly, first, the substrate is supplied and set in a recess at a predetermined position of the lower die with the molding die in the open state and the chip / wire mounting side of the substrate facing upward. Next, the molding die is clamped, and the resin material is heated and melted by heating the molding die to a predetermined temperature with a heater in advance on the chip wire fitted in the cavity to melt the resin. Then, the molten resin sealed with the chip and wire is cured to form a cured resin, and a sealed substrate is formed. In addition, since the molded sealed substrate has a plurality of semiconductor chips that are encapsulated in a resin seal, each individual chip is cut and separated into individual products (packages). The molded product is separated into a product effective range of the substrate that is effective as a product that is the sealed substrate and an unnecessary resin range of the substrate that is cut and separated and discarded.
JP 2001-28377 A

  However, in recent years, the thickness of the substrate and the resin molded body has been reduced, and the substrate described above is a flexible substrate formed, for example, in the form of a film or a tape in addition to the printed substrate. Therefore, the substrate set on the flat bottom surface of the recess (lower mold surface) is expanded by thermal expansion, and the outer periphery of the substrate is formed on the molding die. Since it is fixed on the mold surface and resin-sealed and molded, at least the substrate is frequently deformed so that the product effective range of the substrate is warped upward.

  Here, as a method for solving the deformation of the substrate that is warped upward, first, a suction hole is provided in the peripheral portion of the lower mold surface that is outside the product effective range, and second, the recess A substrate for adsorbing and fixing the electronic component non-mounting surface, which is the back surface of the substrate, to the recess bottom surface (lower mold surface) by providing a porous member and a suction hole communicating with the porous member at a required portion of the bottom surface Adsorption fixing method is adopted. In the first method, the suction hole is provided outside the product effective range. When the back surface of the substrate is sucked by the suction hole, the suction portion on the back surface of the sealed substrate is expanded by the injection pressure at the time of resin sealing molding. This is because there is an indentation. In order to substitute for this suction hole, the structure which provides a porous member in the required part of the flat recess bottom containing the product effective range by the 2nd method mentioned above is considered.

  However, even in the first and second substrate adsorption fixing methods described above, the entire substrate is warped before the substrate is supplied to the mold (before the resin sealing molding step) or at the time of resin sealing molding, or the substrate The substrate is drawn by sucking the deformed portion of the substrate that has been deformed in various ways (particularly, locally), in particular, the deformed portion formed in the product effective range, with the flat bottom of the recess. If the substrate is sucked and fixed, the substrate is deformed from the flat bottom surface of the recess and lifted upward. Thus, it is considered that the substrate in the floating state cannot be corrected and is adsorbed and fixed to the bottom surface of the recess. In other words, it is considered difficult to correct the substrate in the floated (deformed) state to a sufficiently horizontal posture as long as the back surface of the substrate and the bottom surface of the recess are formed horizontally. .

  For this reason, when the thickness of the substrate and the resin molded body is reduced, the substrate floats (is deformed) when the molten resin is injected into the resin molded body into the substrate in which the product effective range of the substrate is variously deformed. ) Resin molding in which the wire portion is in contact with the cavity forming surface and a wire failure such as deformation or breakage of the wire occurs or a failure such as unfilling occurs. The above problems are still considered unsolvable. Furthermore, since individual products (packages) cut and separated from the product effective range of the substrate are formed in a non-uniform state, they are formed by the substrate suction fixing method and the flat bottom surface of the recess as described above. It is considered difficult to prevent with a mold for resin sealing molding.

  Therefore, in the resin sealing molding method according to the present invention for solving the technical problem, the semiconductor chip 5 mounted on the surface 7 of the substrate 4 is fitted into the cavity 12 provided in one of the molding dies. At the same time, the molding dies 1 and 2 are closed while the back surface 8 of the substrate 4 is supported by the other two mold surfaces 13 of the molding die, and melted in the cavity 12 in this state. This is a resin sealing molding method of a semiconductor chip 5 in which the semiconductor chip 5 is resin-sealed and molded by filling the resin 18 and molding the required resin sealing range X on the surface 7 of the substrate 4 by resin sealing molding. The second mold surface 13 that supports the back surface 8 of the substrate 4 is provided with a recess 15 having a required uniform depth C set as a range wider than the product effective range Y of the substrate 4. Along with the cavity 12 described above Prior to the filling of the molten resin 18 to the inside, the inside of the concave portion 15 is depressurized, so that at least the product effective range Y portion of the substrate 4 is corrected to an even flush posture. It is what.

  In addition, a resin-sealing molding die according to the present invention for solving the technical problem is fitted with a semiconductor chip 5 mounted on the surface 7 of the substrate 4 in a cavity 12 provided in one of the molding die 1. And the molds 1 and 2 are closed while the back surface 8 of the substrate 4 is supported by the other mold surface 13 of the mold, and in this state the inside of the cavity 12 The resin chip is filled with the molten resin 18 and the required resin sealing range X on the surface 7 of the substrate 4 is molded by resin sealing. The mold has a required uniform depth C set as a range wider than the product effective range Y of the substrate 4 on the second mold surface 13 that supports the back surface 8 of the substrate 4. A recess 15 is provided, and the inside of the recess 15 and a vacuum source It is characterized in by being configured to communicate with and.

  The present invention uses a resin sealing molding die to efficiently solve the deformation of the substrate 4 on which the semiconductor chip 5 is resin-sealed and molded, and to efficiently solve various problems in resin molding. This provides an excellent effect of providing a stop molding method and a mold for resin sealing molding.

  The mold surface 13 for supporting the back surface 8 facing the front surface 7 of the substrate 4 on which the semiconductor chip 5 is mounted is wider than the product effective range Y of the substrate 4 by using the resin sealing molding die in the present invention. A recess 15 having a required uniform depth C set as a range is provided, and the inside of the recess 15 is decompressed prior to the filling of the molten resin 18 into the cavity 12. For example, as a pressure reducing action, first, a required number of suction holes 16 are provided in a peripheral portion that communicates with the concave portion 15 and is outside the product effective range Y, and second, a breathable member is provided in the required portion of the concave horizontal plane B. First, the back surface 8 of the substrate 4 is disposed at least through the recess 15 and the suction hole 16 by using a pressure reducing action such as providing the required number of suction holes 16 communicating with the air permeable member 19. Forcibly sucking the substrate 4, and secondly, the substrate 4 is forcibly sucked through the breathable member 19 and the suction hole 16 on the back surface 8 of the substrate 4. In other words, when the substrate 4 is forcibly sucked using the pressure reducing action as described above, at least the substrate 4 itself in the product effective range Y of the substrate 4 moves downward and fits into the recess 15. In addition, the product effective range Y portion of the inserted substrate 4 is adsorbed and fixed horizontally to the concave horizontal plane B. Further, the deformed portion where the entire substrate 4 is warped or curved is corrected to a horizontal posture by the above-described decompression action.

  First, Example 1 is demonstrated using FIG. 1 and FIG.

FIG. 1 (1) is a schematic cross-sectional view schematically showing a state in which the molding die is opened using the molding die according to the present invention and a substrate to be resin-sealed. FIG. 1 (2) is a schematic enlarged plan view of the other mold surface of the molding die corresponding to FIG. 1 (1).
FIGS. 2 (1) and 2 (2) are schematic enlarged cross-sectional views showing, in a stepwise manner, an implementation method for supporting a substrate with a molding die corresponding to FIG. 1 (1). 2 (1) and 2 (2) are partly omitted in order to clarify the support state of the substrate. FIG. 2 (3) is a schematic cross-sectional view schematically showing a state in which the molding die is clamped by the molding die corresponding to FIG. 1 (1).

  That is, the resin sealing molding die (molding die) according to Example 1 is, for example, one die (upper die 1) and the other die (lower die 2) as shown in FIG. It consists of and. In the illustrated example, the molding die (upper and lower molds 1 and 2) is used. However, for example, the molding die may be arranged in the left-right direction or inclined at a required angle. .

  As shown in FIG. 1A, the sealed substrate 3 according to the first embodiment includes, for example, semiconductor chips 5 (in a matrix) arranged at predetermined locations on a printed, film-like, or tape-like substrate 4. The electronic component), the substrate 4 side, and the wire 6 that electrically connects the chip 5 are configured to be attached to the surface 7, and the chip 5 and the wire 6 are attached to the surface 7 of the substrate 4. The resin molded body 9 that is resin-sealed, the substrate outer peripheral portion 10 that is not resin-sealed, and the back surface 8 of the substrate 4 are formed as a surface on which no electronic component or the like is mounted (electronic component non-mounting surface).

As shown in FIG. 1A, the molding die (upper and lower molds 1 and 2) is fitted with the resin molded body 9 portion of the substrate 4 provided on one mold surface (upper mold surface 11). A cavity 12 for resin sealing, a resin passage (not shown) that communicates with the cavity 12 and supplies resin material in contact with the surface 7 of the substrate 4, and the other mold surface (lower mold surface 13) are formed. And a substrate setting section 14 for supplying and setting the substrate 4 at a predetermined position.
Accordingly, the semiconductor chip 5 mounted on the surface 7 of the substrate 4 is fitted in the cavity 12 provided in the upper mold 1 and the upper and lower molds 1 are supported with the back surface 8 of the substrate 4 supported by the lower mold surface 13. 2 is closed (clamping), and in this state, the cavity 12 is filled with the molten resin 18 and the required resin sealing range X on the surface 7 of the substrate 4 is molded by resin sealing, The semiconductor chip 5 is configured to be resin-sealed.

Further, as shown in FIG. 1 (1), the upper and lower molds 1 and 2 are more evenly arranged in the substantially central portion of the recessed portion of the substrate set portion 14 set as a range wider than the product effective range Y described later. A recess 15 formed with a recess (engraved) with a depth C, and a required portion that communicates with the recess 15 and is outside the product effective range Y to be described later (in the illustrated example, is opened in the horizontal plane A of the substrate set portion in the outer periphery of the recess 15) And a required number of suction holes 16 communicating with an appropriate pressure reduction mechanism (not shown) for reducing the pressure in the recess 15 (forcing air to be sucked), and between the recess 15 and the suction hole 16. And a communication groove 17 formed so as to open in the horizontal plane A of the substrate set portion. The uniform depth C indicates the depth between the substrate set portion horizontal plane A and the concave portion horizontal plane B. In addition to the configuration of the illustrated example, for example, a configuration in which the substrate is supported only by the recess 15 without providing the substrate setting portion 14 (a configuration in which a portion to supply and set is not provided), the communication groove 17 is provided. It may be carried out with appropriate changes such as direct communication from the recess 15 to the suction hole 16 without providing the.
In addition, as shown in FIG. 1 (2), a range in which the resin molded body 9 portion of the substrate 4 is fitted in the cavity 12 and resin-sealed is shown as a resin sealing range X, and the formation of the recess 15 is formed. The range is formed wider than the product effective range Y (the broken line portion in the figure) to which the semiconductor chip 5 and the wire 6 are mounted (in the figure example, it is formed in substantially the same range as the resin sealing range X). The mold surface of the back surface 8 of the substrate 4 (the lower mold surface 13 in the illustrated example) is configured.
Therefore, by providing the recess 15, the substrate 4 is warped or curved upward, which occurs when the upper and lower molds 1 and 2 are clamped and the substrate 4 with the chip 5 and the wire 6 is sealed with resin. The deformation of the conventional substrate 4 is reduced in pressure in the recess 15 prior to the filling of the molten resin 18 into the cavity 12, that is, the communication groove 17 and the suction hole 16 formed in the peripheral portion of the recess 15. By sucking the air in the recess 15 through the concave portion 15, at least the product effective range Y of the substrate 4 is fitted into the recess 15 and the horizontal surface of the recess 15 is a horizontal plane B (position below the horizontal plane A of the substrate set portion). In addition, the substrate 4 can be fixed to the horizontal posture by being sucked and fixed. In other words, at least the product effective range Y portion of the substrate 4 is configured to be corrected to an even flat posture.

  Here, as described above, an implementation method for supporting the substrate 4 in which the chip 5 and the wire 6 are mounted in the recess 15 will be described in detail below with reference to FIGS. 2 (1) and 2 (2). To do. In FIG. 2A and FIG. 2B, one mold (upper mold 1) is omitted in order to clarify the support state of the substrate 4 described above.

First, as shown in FIG. 2 (1), the resin molded body 9 portion supplied between the mold surfaces 11 and 13 of the molding die (upper and lower molds 1 and 2) shown in FIG. The substrate 4 facing the substrate 2 is supplied and set to the substrate setting unit 14 which is a predetermined position of the lower mold 2, that is, the back surface 8 (the electronic component non-mounting surface) of the substrate 4 is brought into contact with the horizontal surface A of the substrate setting unit. At approximately the same time, the space region Z (between the substrate set portion horizontal surface A and the concave horizontal surface B) between the back surface 8 of the substrate 4 and the concave horizontal surface B is decompressed. As this decompression means, the air in the space region Z is forcibly sucked by the decompression mechanism through the forward path of the recess 15, the communication groove 17, and the suction hole 16.
Next, as shown in FIG. 2 (2), the substrate 4 supported by the concave portion 15 moves downward and contacts the substrate set portion horizontal plane B while maintaining the above-described reduced pressure state. Thus, it is in a state of being fitted into the recess 15. At this time, at least the substrate 4 that is in the product effective range Y is adsorbed and fixed in the horizontal direction B of the recess. That is, the deformation of the conventional substrate 4 in which the substrate 4 supported by the flat substrate setting portion 14 as in the prior art is warped or curved upward, that is, the substrate is moved to the upper and lower molds 1 and 2. Before the supply of 4 (before the resin sealing molding step) or variously deformed portions of the substrate 4 deformed at the time of resin sealing molding, in particular, the deformed portion formed in the product effective range Y in the sealed substrate 3 is horizontal. The substrate 4 which is at least the product effective range Y on the concave horizontal surface B is corrected to have a uniform and uniform posture. For example, in the case of a film (sheet) -like substrate 4, even in a deformed portion where a film (sheet) wrinkle is generated, it is inserted into the recess 15 formed with a recess (engraved) with a uniform depth C. When the substrate itself is moved downward by the decompression (suction) action and the film itself is in tension, the substrate 4 is corrected to a flat posture at least on the horizontal surface B of the recess and supported.
On the other hand, as shown in the figure, substantially simultaneously with the decompression of the recess 15 by the decompression mechanism, as shown in FIGS. 2 (1) and 2 (2), the communication grooves 17 and the suction holes 16 The back surface 8 of the substrate 4 can be adsorbed and fixed to the substrate set portion horizontal plane A through the opening formed in the substrate set portion horizontal plane A.
By the way, as described above, in order to provide the communication groove 17 and the suction hole 16 in the outer periphery of the concave portion 15, that is, in the peripheral portion other than the product effective range Y, the lower mold surface facing the product effective range Y is assumed. 13 (including the substrate set portion horizontal plane A and the concave portion horizontal plane B) with the communication groove 17 and the suction hole 16 opened to support the substrate 4, after resin sealing molding due to resin injection pressure during resin sealing molding Constructed so that indentations and bulges are formed in the reduced pressure portion (suction portion) of the sealed substrate 3 and that damage to the resin-sealed semiconductor chip 5 and the wire 6 is not caused. Has been.

  Here, an implementation method for resin-sealing molding of the substrate 4 on which the chip 5 and the wire 6 (resin molded body 9 portion) in Example 1 are mounted is shown in FIG. 1 (1) and the schematic cross-sectional view of FIG. The details will be described step by step.

First, as shown in FIG. 1 (1), the upper mold surface 11 and the lower mold surface 13 with the upper and lower molds 1 and 2 opened and the resin molded body 9 portion of the substrate 4 facing upward. Is supplied directly above a predetermined position of the lower mold 2 (substrate setting unit 14).
Next, as shown in FIG. 2 (1), when the substrate 4 is supplied and set from the upper part of the substrate setting unit 14 to the horizontal surface A of the substrate setting unit, it is formed between the back surface 8 of the substrate 4 and the concave horizontal surface B substantially simultaneously. The air in the space region Z is sucked by the pressure reducing mechanism through the communication groove 17 and the suction hole 16. At this time, the upper and lower molds 1 and 2 are clamped and the molten resin 18 is a resin material heated and melted by appropriate heating means (not shown) embedded in the upper and lower molds 1 and 2. Thus, the entire upper and lower molds 1 and 2 are heated.
Next, in the state of FIG. 2 (1), as shown in FIG. 2 (2), the back surface 8 of the substrate 4 moves downward to come into contact with the bottom surface B of the substrate set portion 15 and the recess 15 and The substrate 4 is inserted into the substrate setting unit 14 and the substrate 4 is horizontally fixed to the concave horizontal surface B by suction.
Next, in the state shown in FIG. 2 (2), as shown in FIG. 2 (3), the molten resin 18 is injected and filled into the resin molded body 9 portion fitted in the cavity 12 through the resin passage. .
Next, although not shown, the resin molded body 9 portion is cured after the required time for the molten resin 18 to cure, and the sealed substrate 3 is molded. At this time, it is preferable to stop the decompression action of the substrate 4 from the decompression mechanism.
In addition, finally, since the molded sealed substrate 3 has a plurality of semiconductor chips 5 collectively resin-sealed and molded, it is cut and separated for each chip 5 and the product effective range Y The individual products (packages) inside are molded, and the unnecessary resin substrate range (not shown) other than the cut and separated product effective range Y is discarded.

  Next, Example 2 will be described based on FIGS. 3 and 4.

Basically, the same reference numerals as those in FIG. 1 and FIG.
FIG. 3 (1) is a schematic cross-sectional view schematically showing a state where the molding die is opened using another molding die according to the present invention and a substrate to be resin-sealed. FIG. 3 (2) is a schematic enlarged plan view of the other mold surface in another mold corresponding to FIG. 3 (1).
FIGS. 4 (1) and 4 (2) are schematic enlarged cross-sectional views showing another embodiment of the molding die corresponding to FIG. 3 (1), in which the implementation method for supporting the substrate 4 is enlarged step by step. is there. 4 (1) and 4 (2) are partially omitted in order to clarify the support state of the substrate. FIG. 4 (3) is a schematic cross-sectional view schematically showing a state in which the molding die is clamped by another molding die corresponding to FIG. 3 (1).

  That is, the resin sealing molding die (molding die) according to Example 2 is, for example, one mold (upper mold 1) and the other mold (lower mold 2) as shown in FIG. 3 (1). It consists of and. In the example shown in the figure, the molding die (upper and lower molds 1 and 2) is used. However, for example, a molding die in the left-right direction or inclined at a required angle may be employed.

  As shown in FIG. 3A, the sealed substrate 3 of the second embodiment includes, for example, semiconductor chips 5 arranged in a matrix at predetermined locations on a printed, film-like, or tape-like substrate 4. The electronic component), the substrate 4 side, and the wire 6 that electrically connects the chip 5 are configured to be attached to the surface 7, and the chip 5 and the wire 6 are attached to the surface 7 of the substrate 4. The resin molded body 9 that is resin-sealed, the substrate outer peripheral portion 10 that is not resin-sealed, and the back surface 8 of the substrate 4 are formed as a surface on which no electronic component or the like is mounted (electronic component non-mounting surface).

As shown in FIG. 3 (1), the molding die (upper and lower molds 1 and 2) is fitted with a resin molded body 9 portion of the substrate 4 provided on one mold surface (upper mold surface 11). A cavity 12 to be sealed, a resin passage (not shown) that communicates with the cavity 12 and supplies resin material in contact with the surface 7 of the substrate 4, and a substrate formed on the other mold surface (lower mold surface 13) And a substrate setting unit 14 for supplying and setting 4 to a predetermined position.
Accordingly, the semiconductor chip 5 mounted on the surface 7 of the substrate 4 is fitted in the cavity 12 provided in the upper mold 1 and the upper and lower molds 1 are supported with the back surface 8 of the substrate 4 supported by the lower mold surface 13. 2 is closed (clamping), and in this state, the cavity 12 is filled with the molten resin 18 and the required resin sealing range X on the surface 7 of the substrate 4 is molded by resin sealing, The semiconductor chip 5 is configured to be resin-sealed.

Further, the upper and lower molds 1 and 2 are formed with a recess (engraved) with a uniform depth C at a substantially central portion of the recessed portion of the substrate set portion 14 set as a range wider than the product effective range Y described later. The recessed portion 15, the breathable member 19 that is in communication with the recessed portion 15 and disposed in a required portion of the recessed portion horizontal plane B (the portion formed in the substantially same range as the product effective range Y in the illustrated example), and the breathable member 19. In addition, a required number of suction holes 16 communicating with an appropriate decompression mechanism (not shown) for decompressing the inside of the recess 15 (forcing the air to be sucked) are provided. The uniform depth C indicates the depth between the substrate set portion horizontal plane A and the concave portion horizontal plane B.
In addition to the configuration of the illustrated example, for example, a configuration in which the substrate is supported only by the recess 15 without providing the substrate setting portion 14 (a configuration in which a supply setting portion is not provided) is appropriately changed. May be implemented.
Further, as shown in FIG. 3B, the resin sealing range X is shown as a range where the resin molded body 9 portion of the substrate 4 is fitted into the cavity 12 and sealed, and the recess 15 is formed. The range is formed wider than the product effective range Y in which the semiconductor chip 5 and the wire 6 are mounted (in the illustrated example, it is formed in substantially the same range as the resin sealing range X), and the back surface 8 of the substrate 4 is formed. It comprises a mold surface (lower mold surface 13 in the example).
Therefore, by providing the recess 15, the substrate 4 is warped or curved upward, which occurs when the upper and lower molds 1 and 2 are clamped and the substrate 4 with the chip 5 and the wire 6 is sealed with resin. The deformation of the conventional substrate 4 is reduced by reducing the pressure in the concave portion 15 prior to the filling of the molten resin 18 into the cavity 12, that is, the breathable member 19 formed at a required portion of the concave horizontal plane B, suction By sucking the air in the recess 15 through the hole 16, at least the product effective range Y of the substrate 4 is fitted into the recess 15, and the recess horizontal plane B (lower than the substrate set portion horizontal plane A) is the horizontal plane of the recess 15. At the position), the substrate 4 is corrected to a horizontal posture and can be sucked and fixed. In other words, at least the product effective range Y portion of the substrate 4 is configured to be corrected to an even flat posture.

  Here, as described above, an implementation method for supporting the substrate 4 in which the chip 5 and the wire 6 are mounted in the recess 15 will be described in detail below with reference to FIGS. 4 (1) and 4 (2). To do. In FIGS. 4A and 4B, one mold (upper mold 1) is omitted in order to clarify the support state of the substrate 4 described above.

First, as shown in FIG. 4 (1), the resin molded body 9 portion supplied between the molding surfaces 11 and 13 of the molding die (upper and lower molds 1 and 2) shown in FIG. The substrate 4 facing the substrate 2 is supplied and set to the substrate setting unit 14 which is a predetermined position of the lower mold 2, that is, the back surface 8 (the electronic component non-mounting surface) of the substrate 4 is brought into contact with the horizontal surface A of the substrate setting unit. At approximately the same time, the space region Z (between the substrate set portion horizontal surface A and the concave horizontal surface B) between the back surface 8 of the substrate 4 and the concave horizontal surface B is decompressed. As this decompression means, the air in the space region Z is forcibly sucked by the decompression mechanism through the forward path of the recess 15, the air-permeable member 19, and the suction hole 16.
Next, as shown in FIG. 4 (2), the substrate 4 supported by the concave portion 15 moves downward and contacts the substrate set portion horizontal plane B while maintaining the above-described reduced pressure state. Thus, it is in a state of being fitted into the recess 15. At this time, at least the substrate 4 that is in the product effective range Y is adsorbed and fixed in the horizontal direction B of the recess. That is, the deformation of the conventional substrate 4 in which the substrate 4 supported by the flat substrate setting portion 14 as in the prior art is warped or curved upward, that is, the substrate is moved to the upper and lower molds 1 and 2. Before the supply of 4 (before the resin sealing molding step) or variously deformed portions of the substrate 4 deformed at the time of resin sealing molding, in particular, the deformed portion formed in the product effective range Y in the sealed substrate 3 is horizontal. The substrate 4 which is at least the product effective range Y on the concave horizontal surface B is corrected to have a uniform and uniform posture. For example, in the case of a film (sheet) -like substrate 4, even in a deformed portion where a film (sheet) wrinkle is generated, it is inserted into the recess 15 formed with a recess (engraved) with a uniform depth C. When the substrate itself is moved downward by the decompression (suction) action and the film itself is in tension, the substrate 4 is corrected to a flat posture at least on the horizontal surface B of the recess and supported.

  Here, an implementation method of resin sealing molding of the substrate 4 on which the chip 5 and the wire 6 (resin molded body 9 portion) in Example 2 are mounted is shown in FIG. 3A and the schematic sectional view of FIG. The details will be described step by step.

First, as shown in FIG. 3 (1), the upper mold surface 11 and the lower mold surface 13 with the upper and lower molds 1 and 2 opened and the resin molded body 9 portion of the substrate 4 facing upward. Is supplied directly above a predetermined position of the lower mold 2 (substrate setting unit 14).
Next, as shown in FIG. 4 (1), when the substrate 4 is supplied and set to the substrate setting portion horizontal plane A from directly above the substrate setting portion 14, it is formed between the back surface 8 of the substrate 4 and the concave horizontal surface B substantially simultaneously. The air in the space region Z is sucked by the decompression mechanism through the path of the air permeable member 19 and the suction hole 16. At this time, the upper and lower molds 1 and 2 are clamped and the molten resin 18 is a resin material heated and melted by appropriate heating means (not shown) embedded in the upper and lower molds 1 and 2. Thus, the entire upper and lower molds 1 and 2 are heated.
Next, in the state of FIG. 4A, as shown in FIG. 4B, the back surface 8 of the substrate 4 is moved downward to come into contact with the bottom surface B of the substrate setting unit 15 and The substrate 4 is inserted into the substrate setting unit 14 and the substrate 4 is horizontally fixed to the concave horizontal surface B by suction.
Next, in the state shown in FIG. 4 (2), as shown in FIG. 4 (3), the molten resin 18 is injected and filled into the resin molded body 9 portion fitted in the cavity 12 through the resin passage. .
Next, although not shown, the resin molded body 9 portion is cured after the required time for the molten resin 18 to cure, and the sealed substrate 3 is molded. At this time, it is preferable to stop the decompression action of the substrate 4 from the decompression mechanism.
In addition, finally, since the molded sealed substrate 3 has a plurality of semiconductor chips 5 collectively resin-sealed and molded, it is cut and separated for each chip 5 and the product effective range Y Unnecessary resin substrate areas (not shown) other than the product effective area Y that has been molded and separated into individual products (packages) are discarded.

  From the above, the wire 6 contacts the top surface of the cavity 12 of one mold (upper mold 1), which could not be solved by the conventional mold for resin sealing molding in the first embodiment and the second embodiment. This makes it possible to efficiently solve various problems in resin molding, such as deformation or disconnection of the wire 6 or the occurrence of unfilled defects. Furthermore, the individual product (package) cut and separated from the product effective range Y in the substrate 4 is not molded in a non-uniform state, and the resin sealing molding die provided with the recess 15 as described above. Thus, by reducing the pressure in the recess 15 prior to the filling of the molten resin 18 into the cavity 11, the effect of correcting at least the product effective range Y portion of the substrate 4 to an even flat posture is performed. Can do.

In the first and second embodiments, the timing at which the substrate 4 is supported by the recess 15 and depressurized is the molten resin 18 even when the molding die is opened, in the middle of clamping, or after the clamping is completed. If it is before injection into the cavity 12, it can be carried out with appropriate changes continuously or intermittently.
Further, the substrate setting part 14, the recess 15, the suction hole 16, the communication groove 17, the air permeable member 19, and the pressure reducing mechanism in the first and second embodiments are not limited to the illustrated examples. For example, the substrate setting part 14 is provided on the upper mold surface 11 or the mold surfaces 11 and 13 of the molds 1 and 2, and the substrate 4 is easily fitted into the recess 15 without forming the side surfaces of the substrate setting portion 14 and the recess 15 vertically. Forming in an appropriate shape (for example, taper shape), forming the planar shape of the suction hole 16 in a polygonal shape instead of a round shape, and communicating the required number of suction holes 16 to the pressure reducing mechanism in the vertical direction in the figure. In Example 1, as a method of integrating the suction holes 16 in the molding die instead of making it, or as a method of supporting the substrate 4 to the molding die and reducing the pressure (suction) with the pressure reducing mechanism, Almost simultaneously or stepwise from all the suction holes 16 To pull, or be provided Ikue not single out around the suction holes 16 of the recess 15, after light of the above-mentioned contents etc., it can also be carried out sift appropriately.

  In addition, the two-sheet structure, transfer molding, the resin molded body 9 portion of the substrate 4 is supplied upward to the molding die, and the resin passage for supplying the resin material into the cavity 12 is in contact with the substrate 4. It was described in the configuration such as providing. Not limited to this, for example, a required mold structure including a two-sheet structure (for example, a three-sheet structure), and substrate immersion molding (substrate compression molding), which is transferless molding without a resin passage, is performed. The resin molded body 9 portion of the substrate 4 is supplied downward to the molding die (that is, the recess 15 is formed in the upper mold surface 11), and the cavity 12 is formed in a non-contact state with the substrate 4. In consideration of the above-described contents such as providing a single or a plurality of resin passages 12 at appropriate positions on the surface, it is possible to carry out by selecting appropriately.

Moreover, although the resin molded body 9 portion in the sealed substrate 3 is described as one object, for example, a sealed substrate 3 in which a plurality of resin molded bodies 9 are formed may be employed. . In this case, at least the cavity 12, the recesses 15, etc. can be provided correspondingly to the plurality of resin molded bodies 9, or a single unit can be provided at a time.
Further, the shape of the substrate 4 itself is not a quadrangle, and may be employed for the substrate 4 having an appropriate shape such as a circle or a polygon. Further, in this embodiment, the substrate 4 on which the semiconductor chip 5 and the wire 6 are mounted is described. However, as another substrate, for example, a flip chip substrate provided with bumps may be adopted, or It can also be used for wafer level packages.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily modified and selected as necessary within a range not departing from the gist of the present invention. It is.

FIG. 1 (1) is a schematic cross-sectional view schematically showing a state in which the molding die is opened using the molding die according to the present invention and a substrate to be resin-sealed. FIG. 1 (2) is a schematic enlarged plan view of the other mold surface of the molding die corresponding to FIG. 1 (1). FIGS. 2 (1) and 2 (2) are schematic enlarged cross-sectional views showing, in a stepwise manner, an implementation method for supporting a substrate with a molding die corresponding to FIG. 1 (1). FIG. 2 (3) is a schematic cross-sectional view schematically showing a state in which the molding die is clamped by the molding die corresponding to FIG. 1 (1). FIG. 3 (1) is a schematic cross-sectional view schematically showing a state where the molding die is opened using another molding die according to the present invention and a substrate to be resin-sealed. FIG. 3 (2) is a schematic enlarged plan view of the other mold surface in another mold corresponding to FIG. 3 (1). FIGS. 4 (1) and 4 (2) are schematic enlarged cross-sectional views showing, in a step-by-step manner, an implementation method for supporting a substrate with another molding die corresponding to FIG. 3 (1). . FIG. 4 (3) is a schematic cross-sectional view schematically showing a state in which the molding die is clamped by another molding die corresponding to FIG. 3 (1).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 One type | mold 2 The other type | mold 3 Substrate already sealed 4 Substrate 5 Semiconductor chip (electronic component)
6 Wire 7 Surface 8 Back 9 Resin molded body 10 Substrate outer periphery 11 Upper mold surface 12 Cavity 13 Lower mold surface 14 Substrate set portion 15 Recess 16 Suction hole 17 Communication groove 18 Molten resin 19 Breathable member A Substrate set portion bottom B Recess Bottom C Uniform depth X Resin sealing range Y Product effective range Z Space area

Claims (2)

The semiconductor chip mounted on the surface of the substrate is fitted into a cavity provided on one side of the molding die, and the back surface of the substrate is supported by the other mold surface of the molding die. A semiconductor that molds the semiconductor chip by closing the mold and filling the cavity with the molten resin in this state and molding the required resin sealing range on the surface of the substrate by resin sealing molding It is a resin sealing molding method of a chip,
The other mold surface for supporting the back surface of the substrate is provided with a recess having a required uniform depth set as a range wider than the product effective range of the substrate, and the molten resin into the cavity described above The resin sealing of a semiconductor chip is characterized in that at least the product effective range portion of the substrate is corrected to an even flat posture by reducing the pressure inside the recess prior to the filling operation of Molding method. The semiconductor chip mounted on the surface of the substrate is fitted into a cavity provided on one side of the molding die, and the back surface of the substrate is supported by the other mold surface of the molding die. A semiconductor that molds the semiconductor chip by closing the mold and filling the cavity with the molten resin in this state and molding the required resin sealing range on the surface of the substrate by resin sealing molding A mold for resin sealing molding of a chip,
The other mold surface for supporting the back surface of the substrate is provided with a recess having a required uniform depth set as a range wider than the product effective range of the substrate, and the recess and the vacuum source side A mold for resin-sealing molding of a semiconductor chip, characterized by being configured to communicate with each other.

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