[go: up one dir, main page]

JPS6120032Y2 - - Google Patents

Info

Publication number
JPS6120032Y2
JPS6120032Y2 JP13998181U JP13998181U JPS6120032Y2 JP S6120032 Y2 JPS6120032 Y2 JP S6120032Y2 JP 13998181 U JP13998181 U JP 13998181U JP 13998181 U JP13998181 U JP 13998181U JP S6120032 Y2 JPS6120032 Y2 JP S6120032Y2
Authority
JP
Japan
Prior art keywords
hearth
liner
evaporation
hearth liner
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13998181U
Other languages
Japanese (ja)
Other versions
JPS5845363U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13998181U priority Critical patent/JPS5845363U/en
Publication of JPS5845363U publication Critical patent/JPS5845363U/en
Application granted granted Critical
Publication of JPS6120032Y2 publication Critical patent/JPS6120032Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Description

【考案の詳細な説明】 本考案は特に真空蒸着装置で、例えばアルミニ
ウム(以下、単にAlと記す)を電子ビーム蒸発
源を用いて蒸着する際にるつぼの中に入れて使用
する所謂ハースライナーに関するものである。ハ
ースライナーは、蒸発源が挿入されるハースが冷
却されているために問題となる蒸着パワーの増大
を解決するために、蒸発源とハースとの間に挿入
されるものである。
[Detailed description of the invention] The present invention particularly relates to a so-called hearth liner that is placed in a crucible and used when depositing aluminum (hereinafter simply referred to as Al) using an electron beam evaporation source in a vacuum evaporation apparatus. It is something. The hearth liner is inserted between the evaporation source and the hearth in order to solve the problem of increase in evaporation power, which is a problem because the hearth into which the evaporation source is inserted is cooled.

従来、このようなハースライナーは、W,
Ta,BN(ボロンナイトライド)コンポジツト
(EC)ライナー等を使用し種々の金属を蒸着する
際に銅ハース内に挿入していた。しかしこれらの
ライナーを使用してもAlを蒸着する際に3KWの
蒸着パワーが投入されないとAlが蒸発するには
いたらなかつた。
Conventionally, such hearth liners are W,
Ta, BN (boron nitride) composite (EC) liners, etc. were used and inserted into the copper hearth when various metals were evaporated. However, even if these liners were used, Al would not evaporate unless 3KW of evaporation power was applied during the evaporation process.

本考案は以上の欠点を除去するために形状を変
更し3KW以下の低い蒸着パワーでAlを溶融蒸発
させかつ基板(蒸着すべき)への二次電子の影響
及び温度上昇を最小限に抑えることができること
を特徴としたAl蒸着用ハースライナーである。
This invention changes the shape to eliminate the above drawbacks, melts and evaporates Al with a low evaporation power of 3KW or less, and minimizes the influence of secondary electrons on the substrate (to be evaporated) and temperature rise. This is a hearth liner for aluminum evaporation.

次に図面を用いて本考案をより詳細に説明す
る。
Next, the present invention will be explained in more detail using the drawings.

第1図は従来のハースライナーである。即ち、
図のように銅ハース1にハースライナー2を挿入
してAlに電子ビームを照射し、Al2を蒸発させる
わけであるが、このようなハースライナーである
と、接触部分4から熱が冷却されている銅ハース
1へと逃げていき、このために蒸着パワーを
3KW(10KV,0.3A)以上投入しないと、殆ど
Al2の蒸発は見られない。
Figure 1 shows a conventional hearth liner. That is,
As shown in the figure, the hearth liner 2 is inserted into the copper hearth 1 and the electron beam is irradiated onto the aluminum to evaporate the Al2. Escape to Copper Hearth 1, and use the evaporation power for this purpose.
If you do not input more than 3KW (10KV, 0.3A), almost no
No evaporation of Al2 is observed.

第2図は本考案の一実施例によるAl蒸着用ハ
ースライナーである。即ち、銅ハース1にハース
ライナー3を挿入し、その中にAlソース2を入
れるものであるが、本考案の特徴とするところ
は、ギヤツプ5を設けてAlソース2の入つてい
る部分を銅ハース1と接触させないようにし、熱
の逃げを極力抑え又底の部分には図のようにゲタ
をはかせてなおかつ底板の部分は銅ハースの底の
部分にぴつたりと入るようにし、位置出しの役目
もしている。
FIG. 2 shows a hearth liner for Al deposition according to an embodiment of the present invention. That is, a hearth liner 3 is inserted into a copper hearth 1, and an Al source 2 is placed therein.The feature of the present invention is that a gap 5 is provided to cover the part containing the Al source 2 with copper. Avoid contact with the copper hearth 1 to minimize heat escape, and make sure that the bottom part has a gap as shown in the figure, and that the bottom plate fits snugly into the bottom of the copper hearth. It also plays a role.

又、AlとBNコンポジツトハースライナー3と
のぬれ性が良いため蒸着中に中のAl2がハースラ
イナー3の外側にはい上つた場合も底部のゲタの
部分にたまり、銅ハース1と接触しない様に考え
たものである。このような、ハースライナー3
(材質はBNコンポジツト)を製作使用することに
より、蒸着パワー560W(10KV56mA)程で60
Å/secという高い蒸発速度が得られ、従来の
3KW(10KV、0.3A)で10Å/secと比較すると
パワーが約1/3で蒸発速度が6倍以上という非常
に熱効率の良いハースライナーであるといえる。
又、基板(蒸着されるもの)への2次電子の影
響、熱の影響がなくなり特性も大幅な改良向上が
できる。
In addition, since the wettability between Al and the BN composite hearth liner 3 is good, even if the Al2 inside climbs to the outside of the hearth liner 3 during vapor deposition, it collects in the gap at the bottom and does not come into contact with the copper hearth 1. This is what I thought about. Like this, Hearth Liner 3
(Material is BN composite) By manufacturing and using BN composite, evaporation power of 560W (10KV56mA)
A high evaporation rate of Å/sec can be obtained, compared to conventional
Compared to 10Å/sec at 3KW (10KV, 0.3A), the power is about 1/3 and the evaporation rate is more than 6 times, making it an extremely thermally efficient hearth liner.
Furthermore, the influence of secondary electrons and heat on the substrate (on which it is deposited) is eliminated, and the characteristics can be greatly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のAl蒸着用ハースライナーを示
す断面図、第2図は本考案の一実施例を示すハー
スライナーの断面図である。 1……銅ハース、2……Alソース、3……ハ
ースライナー。
FIG. 1 is a sectional view showing a conventional hearth liner for Al vapor deposition, and FIG. 2 is a sectional view of a hearth liner showing an embodiment of the present invention. 1... Copper hearth, 2... Al source, 3... Hearth liner.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 蒸発源とこれを収納するハースとの間にハース
ライナーが介在し、かつ前記ハースライナーと前
記ハースとの間に空間ができるように前記ハース
ライナーが支持部によつて支持された蒸着装置に
おいて、前記支持部の前記ハース側の端部を前記
ハースの底の部分と実質的に同じ大きさにしたこ
とを特徴とする蒸着装置。
A vapor deposition apparatus in which a hearth liner is interposed between an evaporation source and a hearth that stores the same, and the hearth liner is supported by a support part so that a space is created between the hearth liner and the hearth, A vapor deposition apparatus characterized in that an end portion of the support portion on the side of the hearth is substantially the same size as a bottom portion of the hearth.
JP13998181U 1981-09-21 1981-09-21 Vapor deposition equipment Granted JPS5845363U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13998181U JPS5845363U (en) 1981-09-21 1981-09-21 Vapor deposition equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13998181U JPS5845363U (en) 1981-09-21 1981-09-21 Vapor deposition equipment

Publications (2)

Publication Number Publication Date
JPS5845363U JPS5845363U (en) 1983-03-26
JPS6120032Y2 true JPS6120032Y2 (en) 1986-06-17

Family

ID=29933156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13998181U Granted JPS5845363U (en) 1981-09-21 1981-09-21 Vapor deposition equipment

Country Status (1)

Country Link
JP (1) JPS5845363U (en)

Also Published As

Publication number Publication date
JPS5845363U (en) 1983-03-26

Similar Documents

Publication Publication Date Title
JPS6120032Y2 (en)
JPS6366391B2 (en)
GB1087205A (en) Method and apparatus for coating by flash evaporation of metals
JPS605233B2 (en) Method for manufacturing high melting point compound thin film
JPS61272367A (en) Thin film forming device
JPS61291965A (en) Superhigh-vacuum chamber
JPH0673543A (en) Continuous vacuum deposition equipment
JP2503756Y2 (en) Crucible for vapor deposition
JPS6013067B2 (en) Vacuum deposition equipment
JP2570560Y2 (en) Electron beam evaporation source
US5493630A (en) Pyrolytic boron nitride coated flash evaporator
JPH0139713Y2 (en)
JPS6059990B2 (en) Vapor deposition equipment
JPH06280004A (en) Electron beam evaporation source
US3414655A (en) Apparatus for evaporation of low temperature semiconductor material by electron beam impingement on the material and comprising means for draining electric charge from the material
JPS6157907B2 (en)
JPH02104659A (en) Device for producing thin film
JPH06948B2 (en) Metal evaporation method
JPH04303537A (en) Vapor deposition method for anti-doming material of shadow mask
JPS6225249B2 (en)
JPS6451662U (en)
JPS62118517A (en) Vapor jetting device of melted material
JPS586972A (en) Hearth liner for vacuum deposition by electron beam
KR100623701B1 (en) Organic material deposition apparatus
JPH07237912A (en) Method for producing fullerene compounds and device for producing the same