JPS5468840A - Adhesive for copper-lined laminate - Google Patents
Adhesive for copper-lined laminateInfo
- Publication number
- JPS5468840A JPS5468840A JP13529877A JP13529877A JPS5468840A JP S5468840 A JPS5468840 A JP S5468840A JP 13529877 A JP13529877 A JP 13529877A JP 13529877 A JP13529877 A JP 13529877A JP S5468840 A JPS5468840 A JP S5468840A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- resin
- epoxy
- epoxy resin
- aluminum hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title abstract 5
- 230000001070 adhesive effect Effects 0.000 title abstract 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 3
- 229920000647 polyepoxide Polymers 0.000 abstract 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract 2
- 239000011368 organic material Substances 0.000 abstract 2
- 229920001568 phenolic resin Polymers 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract 2
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: A polyvinyl butyral, phenolic resin and epoxy resin are used as adhesive organic materials and a specific amount of aluminum hydroxide is incorporated thereto to produce title adhesive with high resistance to heat on soldering and good antitracking property.
CONSTITUTION: To 100 parts by wt of an adhesive organic material consisting of polyvinyl butyral, phenolic resin and epoxy resin are added 5W150 parts of aluminum hydroxide preferably with an average particle size of less than 3 microns and they are dispersed in a solvent such as methyl ethyl ketone to prepare said adhesive. The amount of the epoxy resin added is about 3W30 wt% in which about 30W70 wt% of the resin is a cyclic apliphatic epoxy one and the epoxy equivalent is at a level of 100W1500.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13529877A JPS5468840A (en) | 1977-11-11 | 1977-11-11 | Adhesive for copper-lined laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13529877A JPS5468840A (en) | 1977-11-11 | 1977-11-11 | Adhesive for copper-lined laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5468840A true JPS5468840A (en) | 1979-06-02 |
| JPS5549640B2 JPS5549640B2 (en) | 1980-12-12 |
Family
ID=15148422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13529877A Granted JPS5468840A (en) | 1977-11-11 | 1977-11-11 | Adhesive for copper-lined laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5468840A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472241A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chem Co Ltd | Adhesive for copper-plated laminate |
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
| JPS60158215A (en) * | 1984-01-30 | 1985-08-19 | Toshiba Chem Corp | Epoxy resin composition for laminate |
| JPS61126187A (en) * | 1984-11-22 | 1986-06-13 | Hitachi Chem Co Ltd | Adhesive for copper-clad laminate |
| JPH03264350A (en) * | 1990-03-15 | 1991-11-25 | Showa Denko Kk | Copper clad laminate |
| EP0592937A2 (en) * | 1992-10-12 | 1994-04-20 | Nitto Denko Corporation | Tracking resistant material and circuit substrate using the material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535235A (en) * | 1976-07-05 | 1978-01-18 | Matsushita Electric Ind Co Ltd | Flame-retardant adhesives |
| JPS548643A (en) * | 1977-06-21 | 1979-01-23 | Matsushita Electric Ind Co Ltd | Flame-retardant adhesive |
-
1977
- 1977-11-11 JP JP13529877A patent/JPS5468840A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS535235A (en) * | 1976-07-05 | 1978-01-18 | Matsushita Electric Ind Co Ltd | Flame-retardant adhesives |
| JPS548643A (en) * | 1977-06-21 | 1979-01-23 | Matsushita Electric Ind Co Ltd | Flame-retardant adhesive |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5472241A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chem Co Ltd | Adhesive for copper-plated laminate |
| JPS5724826B2 (en) * | 1977-11-22 | 1982-05-26 | ||
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
| JPH0219995B2 (en) * | 1981-11-16 | 1990-05-07 | Kanegafuchi Chemical Ind | |
| JPS60158215A (en) * | 1984-01-30 | 1985-08-19 | Toshiba Chem Corp | Epoxy resin composition for laminate |
| JPS61126187A (en) * | 1984-11-22 | 1986-06-13 | Hitachi Chem Co Ltd | Adhesive for copper-clad laminate |
| JPH0437870B2 (en) * | 1984-11-22 | 1992-06-22 | Hitachi Chemical Co Ltd | |
| JPH03264350A (en) * | 1990-03-15 | 1991-11-25 | Showa Denko Kk | Copper clad laminate |
| EP0592937A2 (en) * | 1992-10-12 | 1994-04-20 | Nitto Denko Corporation | Tracking resistant material and circuit substrate using the material |
| EP0592937A3 (en) * | 1992-10-12 | 1997-03-05 | Nitto Denko Corp | Tracking resistant material and circuit substrate using the material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5549640B2 (en) | 1980-12-12 |
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