JPS61126187A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS61126187A JPS61126187A JP24737784A JP24737784A JPS61126187A JP S61126187 A JPS61126187 A JP S61126187A JP 24737784 A JP24737784 A JP 24737784A JP 24737784 A JP24737784 A JP 24737784A JP S61126187 A JPS61126187 A JP S61126187A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- copper
- resistance
- heat resistance
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- 239000005062 Polybutadiene Substances 0.000 claims abstract description 6
- 239000002245 particle Substances 0.000 claims abstract description 6
- 229920002857 polybutadiene Polymers 0.000 claims abstract description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 5
- 239000005011 phenolic resin Substances 0.000 claims abstract description 3
- 239000002904 solvent Substances 0.000 claims abstract description 3
- 239000011368 organic material Substances 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 7
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 229910021502 aluminium hydroxide Inorganic materials 0.000 abstract 2
- 229910001679 gibbsite Inorganic materials 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 235000013405 beer Nutrition 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 206010000369 Accident Diseases 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- NFDFQCUYFHCNBW-SCGPFSFSSA-N dienestrol Chemical compound C=1C=C(O)C=CC=1\C(=C/C)\C(=C\C)\C1=CC=C(O)C=C1 NFDFQCUYFHCNBW-SCGPFSFSSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、印刷回路用銅張り積層板のはんだ耐熱性と耐
ランキング性な向上させる銅張積層板用接着剤に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an adhesive for copper-clad laminates that improves the solder heat resistance and ranking resistance of copper-clad laminates for printed circuits.
（従来の技術〉
印刷回路用銅張積Ｍ板は導電部な形成する鋼箔回路以外
の部分を化学的に蝕刻して配Ｉｗ！板を形成し更に該回
路褥材に穴あけ加工を施し℃搭載部品取付部分のターミ
ナルを挿着し、溶融はんだ浴に浸漬した場合に））フレ
を生じない仁と、又回路にメッキな施す際に、メツ命薬
品類に侵されないこと等が必要である。電気機器製造の
゛作業性向上のためこれら使用条件はますま丁苛酷な
方向にあり、耐熱性ＦｉＺ６０℃、２０秒以上のはんだ
処理に耐え得ることが望まれており、はんだ浴温度も更
に上昇する傾向にある。しかも、テレビ等の高電圧用途
ての火災事故対策として最近は銅箔を積層板に接着する
接着剤に耐トラツキング性まで要求されるに至り比。従
来から２エノール基材を用いた銅張積層板用接着剤には
ポリビニルブチラールにレゾール型フェノールホルムア
ルデヒド樹脂（アルカリ触′媒）を加え友ものが用いら
れ℃いる。(Prior art) Copper-clad laminated M boards for printed circuits are produced by chemically etching the parts other than the conductive parts and the steel foil circuit to form a wiring board, and then drilling holes in the circuit backing material. It is necessary that the terminals on the mounting parts of the mounted parts are inserted and immersed in a molten solder bath, so that they do not warp, and when plating the circuits, they must not be attacked by chemicals. . In order to improve the workability of electrical equipment manufacturing, these usage conditions are becoming increasingly severe, and it is desired that heat-resistant FiZ can withstand soldering at 60°C for 20 seconds or more, and the solder bath temperature is also increasing. There is a tendency to Furthermore, in order to prevent fire accidents in high-voltage applications such as televisions, the adhesive used to bond copper foil to laminates has recently come to be required to have tracking resistance. Conventionally, adhesives for copper-clad laminates using dienol base materials include polyvinyl butyral and resol type phenol formaldehyde resin (alkaline catalyst) added thereto.
一方、有機材料の耐トラツキング性は屋外用レジンがい
しの実用化等のため種々検討されている。樹脂としては
、フェノール核等炭化しやすい構造のものを多く含むも
のが悪いことが知られている１例えばエポキシ樹脂では
ビスフェノールタイプやノボラックタイプが悪く、環状
脂肪族、鎖状脂肪族系がよいことなどである。On the other hand, various studies have been conducted on the tracking resistance of organic materials for the practical use of outdoor resin insulators. It is known that resins containing many structures that are easily carbonized, such as phenol nuclei, are bad.1 For example, in epoxy resins, bisphenol and novolac types are bad, while cycloaliphatic and chain aliphatic types are good. etc.
又、フィラーの効果が大きく、水酸化アルミニウム、シ
リカ、硼酸塩等を多量に添加使用している。In addition, the effect of fillers is large, and large amounts of aluminum hydroxide, silica, borates, etc. are added and used.
（発明が解決しようとする問題点）
前記の、ポリビニルブチラールにレゾール型フェノール
の二成分だけの配合では得られる銅張積層板の鋼箔−基
材の接着力とはんだ耐熱性が実用上満足できないので、
これらを改良するため檻々の添加剤が用いられている。(Problems to be Solved by the Invention) The steel foil-substrate adhesion strength and soldering heat resistance of the copper-clad laminate obtained with the above-mentioned combination of only the two components of polyvinyl butyral and resol type phenol are not practically satisfactory. So,
A variety of additives are used to improve these conditions.
しかしこれら多くは高い接着力とすぐれｆｅはんだ耐熱
性、耐めつき薬品性な有するものといわれているが、最
近電気機器の火災等で問題になっている耐トラツキング
性については何ら考慮されていない。即ち、ＩＥＣ法６
００ボルト（以下Ｖと略す）テストでは１〜１０滴糧度
でトラックを形成してしまい最近の要求であるＩＥＣ法
６００Ｖ、３０滴以上にはるかに及ばないものである。However, although many of these are said to have high adhesive strength, excellent FE soldering heat resistance, and chemical resistance, no consideration has been given to tracking resistance, which has recently become a problem due to fires in electrical equipment. . That is, IEC method 6
In the 00 volt (hereinafter abbreviated as V) test, a track was formed with a density of 1 to 10 drops, which is far below the recent requirement of IEC method 600 V, 30 drops or more.
一方耐トラッキング性だけを向上するのであれば、これ
ら公知の技術を取り入れて実用化すればよいが銅張積層
板用接着剤には、絶対条件としてはんだ耐熱性とビール
強さがあるものでなければならない、この目的の沈めに
は、接着剤および積層板の耐熱性向上が図られなければ
ならない。本発明はこのような点に鑑みてなさｎ７ｔ４
のでｌＥｃ法、６ＱＱＶ、５０ｍ以上に耐え、かつはん
だ耐熱性が２６０℃、２０秒以上、ビール強さが１．２
ｋｇ／ｃｍ以上の銅張積層板用接着剤を提供するもので
ある。On the other hand, if only tracking resistance is to be improved, these known technologies can be incorporated and put into practical use, but adhesives for copper-clad laminates must have soldering heat resistance and beer strength as absolute requirements. For this purpose, the heat resistance of the adhesive and the laminate must be improved. The present invention was made in view of these points.
Therefore, it can withstand 1Ec method, 6QQV, 50m or more, and has soldering heat resistance of 260℃ for 20 seconds or more, and beer strength of 1.2.
The present invention provides an adhesive for copper-clad laminates with a tensile strength of at least kg/cm.
（問題点を解決するｔめの手段）
本発明の接着剤は、溶剤な除く有機材料１００重量部に
対して、水酸化アルミニウムを５〜１５０重量部添加し
てなるものである。水酸化アルミ二りムは結晶水を３４
，５％も含みこれが２００℃付近で急激な脱水分解反応
を起すと同、 時に多量の熱を吸収するので、難燃剤、
耐トラツキング剤として用いられているのである。しか
し、銅張積膚板用材料、特に接着剤成分として用いるこ
とは、はんだ耐熱性の点から全く考慮されなかっｔ材料
である。本発明はこれらの知見に基いてなされたもので
ある。即ち水酸アルミニウム添加による耐熱性低下を有
機材料の配合を検討することによって耐熱性レベルを向
上させ接着剤として耐トラツキング性、耐熱性トモにバ
ランスの有るものにすることである。(Tth Means for Solving the Problems) The adhesive of the present invention is made by adding 5 to 150 parts by weight of aluminum hydroxide to 100 parts by weight of organic materials excluding solvents. Aluminum hydroxide diminutive crystallization water
, 5%, which causes a rapid dehydration decomposition reaction at around 200℃ and absorbs a large amount of heat, so flame retardants,
It is used as an anti-tracking agent. However, the use of this material as a material for copper-clad laminates, especially as an adhesive component, has not been considered at all from the viewpoint of soldering heat resistance. The present invention has been made based on these findings. That is, the problem is to improve the heat resistance level by considering the combination of organic materials, which reduces the heat resistance due to the addition of aluminum hydroxide, and to create an adhesive with a good balance between tracking resistance and heat resistance.
この有機材料の成分別に比較検討し比ところ、フェノー
ル樹脂添加量増加が耐熱性向上に有効であるが、耐トラ
ツキング性低下をまねくので、樹脂の架橋密度を上げ、
耐熱性向上させると同時に耐トラツキング性を向上させ
る材料について、種々検討した所、エポキシ化ポリブタ
ジェンを５〜３５重量％添加した場合、はんだ耐熱性の
低下がなく、耐トラツキング性もよいことがわかっ几。A comparative study of each component of this organic material revealed that increasing the amount of phenolic resin added is effective in improving heat resistance, but it also leads to a decrease in tracking resistance, so increasing the crosslinking density of the resin,
After conducting various studies on materials that improve heat resistance and tracking resistance at the same time, we found that when 5 to 35% by weight of epoxidized polybutadiene was added, there was no decrease in soldering heat resistance and tracking resistance was also good. .
５ｘ′Ｊ１％未満でｈａんだ耐熱性が低下し、３５重量
％を超えてもはんだ耐熱性は変わらず、耐めっき薬品性
が低下する。If it is less than 1% by weight of 5x'J, the heat resistance to haze will decrease, and if it exceeds 35% by weight, the soldering heat resistance will not change and the resistance to plating chemicals will decrease.
なおエポキシ当量は１００〜２０００の範囲が好ましい
。この有機材料１００重量部に対して水酸化アル４ニウ
ムの量が５重量部未満では効果が小さく、ま几１５０重
量部な越えると接着力（ビール強さ）が１．２ ｋｇ
／ ｃａ＋以下になり実用性がない。好ましい添加量は
１５〜７０重量部である。水酸化アルミニウムの平均粒
度３μ以下の微粒子がはんだ耐熱性、耐トラツキング性
では最も良かつ比、また平均３μ以下の場合接着剤溶液
中での沈降が少なく管理上望ましい。In addition, the epoxy equivalent has a preferable range of 100 to 2000. If the amount of aluminum hydroxide is less than 5 parts by weight with respect to 100 parts by weight of this organic material, the effect will be small, and if it exceeds 150 parts by weight, the adhesive strength (beer strength) will be 1.2 kg.
/ca+ and is not practical. The preferred amount added is 15 to 70 parts by weight. Fine particles of aluminum hydroxide with an average particle size of 3 μm or less have the best soldering heat resistance and tracking resistance, and when the average particle size is 3 μm or less, sedimentation in the adhesive solution is small and is desirable for management purposes.
以上説明した本発明の接着剤は紙フェノール積層板ばか
りでなく、紙エポキシ積層板用接着剤としても用いられ
る。The adhesive of the present invention described above can be used not only for paper phenol laminates but also for paper epoxy laminates.
次に実施例、比叔例を示す。部とあるのは重量部を示す
。Next, examples and comparative examples will be shown. Parts indicate parts by weight.
実施例１
ポリビニルブチラール（ＢＸ−１、種水化学工業■製）
３５部、レゾール型フェノール樹脂（ＶＰ−１３Ｎ、日
立化成工業■＃り３０部、エポキシ化ポリブタジェン樹
脂（Ｒ−４５ＥＰＩ出光石油化学■裂）１５部、水酸化
アルミニウム（ハイシライトＨ−４２、昭和電工障組平
均粒子径１５〜２μ）３５部をメチルエチルケトンに溶
解分散し、固形分１７％の接着剤な作成した。この接着
剤を銅箔（日本電解工業■製、３５μ厚）に、固形分３
０ｇ／ｃｎ”の割合で塗布乾燥後、フェノール樹脂含浸
紙と共に加熱加圧し、銅張積層板を作成し友。この銅張
積層板の特性を別表に示す。Example 1 Polyvinyl butyral (BX-1, manufactured by Tanemizu Chemical Industry ■)
35 parts of resol type phenolic resin (VP-13N, Hitachi Chemical Co., Ltd.), 15 parts of epoxidized polybutadiene resin (R-45EPI Idemitsu Petrochemical Co., Ltd.), aluminum hydroxide (Hisilite H-42, Showa Denko Kogyo Co., Ltd.) An adhesive with a solid content of 17% was prepared by dissolving and dispersing 35 parts of particles having a set average particle size of 15 to 2 μm in methyl ethyl ketone.
After coating and drying at a rate of 0 g/cn'', it was heated and pressed together with phenol resin-impregnated paper to produce a copper-clad laminate. The properties of this copper-clad laminate are shown in the attached table.
実施例２
実施例１の接着剤のうち、エポキシ化ポリブタジェン樹
脂に代り環状脂肪族エボ命シ樹脂（チッソノックス３１
３、チッソ■製）１５部を使用する以外は、実施例１と
同様にして、銅張り積層板を作成し友。得られた銅張積
層板の特性を別表に示す。Example 2 Among the adhesives in Example 1, cycloaliphatic Evo Life resin (Chissonox 31) was used instead of epoxidized polybutadiene resin.
3. A copper-clad laminate was prepared in the same manner as in Example 1, except that 15 parts (manufactured by Chisso ■) were used. The properties of the obtained copper-clad laminate are shown in the attached table.
比較例１
実施例１の接着剤のうち、水酸化アルミニウムな使用し
ない以外は、実施例１ど同様にして銅張積層板を作成し
次。Comparative Example 1 A copper-clad laminate was prepared in the same manner as in Example 1, except that aluminum hydroxide was not used as the adhesive in Example 1.
得られた銅張積ＷＩ板の特性を別表に示す。The properties of the obtained copper-clad WI board are shown in the attached table.
別 表
試験方法 耐トラッキング性：ＩＥＣ法６００ｖはんだ
耐熱性 ； ＪＩＳＣ６４８１５，５（２６０’Ｃ）
引きはがし強さ ； ＪＩＳＣ６４８１５，７（発明の
効果）
以上説明したように本発明による銅張積層板用接着剤は
、はんだ耐熱性に優れ、必要とされる他の特性な低下さ
せることなく、耐トラツキング性を向上させることがで
きる。Attached table test method Tracking resistance: IEC method 600v soldering heat resistance; JISC64815,5 (260'C)
Peeling strength: JISC64815, 7 (effects of the invention) As explained above, the adhesive for copper-clad laminates according to the present invention has excellent solder heat resistance, and has excellent resistance to soldering without deteriorating other required properties. Tracking performance can be improved.
Claims (1)
アルミニウムを５〜１５０重量部添加してなる銅張積層
板用接着剤。 ２、水酸化アルミニウムが平均粒径３μ以下の微粒子で
ある特許請求の範囲第１項記載の銅張積層板用接着剤。 ３、有機材料がポリビニルブチラール、フェノール樹脂
、エポキシ化ポリブタジエン樹脂からなり、エポキシ化
ポリブタジエン樹脂は５〜３５重量％である特許請求の
範囲第１項又は第２項記載の銅張積層板用接着剤。[Claims] 1. An adhesive for copper-clad laminates, which is made by adding 5 to 150 parts by weight of aluminum hydroxide to 100 parts by weight of an organic material excluding a solvent. 2. The adhesive for copper-clad laminates according to claim 1, wherein the aluminum hydroxide is fine particles with an average particle size of 3 μm or less. 3. The adhesive for copper-clad laminates according to claim 1 or 2, wherein the organic material is composed of polyvinyl butyral, phenol resin, and epoxidized polybutadiene resin, and the epoxidized polybutadiene resin is 5 to 35% by weight. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24737784A JPS61126187A (en) | 1984-11-22 | 1984-11-22 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24737784A JPS61126187A (en) | 1984-11-22 | 1984-11-22 | Adhesive for copper-clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61126187A true JPS61126187A (en) | 1986-06-13 |
| JPH0437870B2 JPH0437870B2 (en) | 1992-06-22 |
Family
ID=17162518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24737784A Granted JPS61126187A (en) | 1984-11-22 | 1984-11-22 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61126187A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02255886A (en) * | 1988-12-05 | 1990-10-16 | Hitachi Chem Co Ltd | Adhesive composition for metal-clad leminate |
| JPH0548265A (en) * | 1991-08-09 | 1993-02-26 | Hitachi Chem Co Ltd | Adhesive for copper-clad laminated board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5468840A (en) * | 1977-11-11 | 1979-06-02 | Hitachi Chem Co Ltd | Adhesive for copper-lined laminate |
| JPS5534250A (en) * | 1978-08-31 | 1980-03-10 | Matsushita Electric Works Ltd | Adhesive composition |
| JPS6079080A (en) * | 1983-10-07 | 1985-05-04 | Nippon Mektron Ltd | Adhesive composition |
-
1984
- 1984-11-22 JP JP24737784A patent/JPS61126187A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5468840A (en) * | 1977-11-11 | 1979-06-02 | Hitachi Chem Co Ltd | Adhesive for copper-lined laminate |
| JPS5534250A (en) * | 1978-08-31 | 1980-03-10 | Matsushita Electric Works Ltd | Adhesive composition |
| JPS6079080A (en) * | 1983-10-07 | 1985-05-04 | Nippon Mektron Ltd | Adhesive composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02255886A (en) * | 1988-12-05 | 1990-10-16 | Hitachi Chem Co Ltd | Adhesive composition for metal-clad leminate |
| JPH0548265A (en) * | 1991-08-09 | 1993-02-26 | Hitachi Chem Co Ltd | Adhesive for copper-clad laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0437870B2 (en) | 1992-06-22 |
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