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JPS54158469A - Preparation of prepreg - Google Patents

Preparation of prepreg

Info

Publication number
JPS54158469A
JPS54158469A JP6736678A JP6736678A JPS54158469A JP S54158469 A JPS54158469 A JP S54158469A JP 6736678 A JP6736678 A JP 6736678A JP 6736678 A JP6736678 A JP 6736678A JP S54158469 A JPS54158469 A JP S54158469A
Authority
JP
Japan
Prior art keywords
filler
thermosetting resin
base material
prepreg sheet
prepreg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6736678A
Other languages
Japanese (ja)
Other versions
JPS6030340B2 (en
Inventor
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP6736678A priority Critical patent/JPS6030340B2/en
Publication of JPS54158469A publication Critical patent/JPS54158469A/en
Publication of JPS6030340B2 publication Critical patent/JPS6030340B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE: To improve the adhesiveness of a prepreg sheet to a metal foil, by applying a thermosetting resin compostion containing a small amount of a filler to a base material coated with a thermosetting resin composition comprising a large amount of a filler.
CONSTITUTION: A composition of a thermosetting resin, e.g. an epoxy resin, comprising 30W85 wt% of a filler, is applied to a base material, e.g. glass cloth, and (semi)cured. A thermosetting resin composition containing less than 30 wt% of a filler is applied to the coated base material, and semicured to give a prepreg sheet.
COPYRIGHT: (C)1979,JPO&Japio
JP6736678A 1978-06-05 1978-06-05 Prepreg manufacturing method Expired JPS6030340B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6736678A JPS6030340B2 (en) 1978-06-05 1978-06-05 Prepreg manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6736678A JPS6030340B2 (en) 1978-06-05 1978-06-05 Prepreg manufacturing method

Publications (2)

Publication Number Publication Date
JPS54158469A true JPS54158469A (en) 1979-12-14
JPS6030340B2 JPS6030340B2 (en) 1985-07-16

Family

ID=13342934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6736678A Expired JPS6030340B2 (en) 1978-06-05 1978-06-05 Prepreg manufacturing method

Country Status (1)

Country Link
JP (1) JPS6030340B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60203642A (en) * 1984-03-28 1985-10-15 Shin Kobe Electric Mach Co Ltd Manufacture of composite laminate board
WO1989003406A1 (en) * 1987-10-15 1989-04-20 Suzuki Kanshi Co., Ltd. Production of composite sheet material having inclination function
JP2003110246A (en) * 2001-09-27 2003-04-11 Kyocera Corp INSULATING SHEET, ITS MANUFACTURING METHOD, MULTILAYER WIRING BOARD, AND ITS MANUFACTURING METHOD
WO2019181428A1 (en) * 2018-03-23 2019-09-26 三菱マテリアル株式会社 Insulated circuit board and method for producing insulated circuit board
JP2024516775A (en) * 2021-03-24 2024-04-17 ヒタチ・エナジー・リミテッド Power semiconductor module and manufacturing method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60203642A (en) * 1984-03-28 1985-10-15 Shin Kobe Electric Mach Co Ltd Manufacture of composite laminate board
WO1989003406A1 (en) * 1987-10-15 1989-04-20 Suzuki Kanshi Co., Ltd. Production of composite sheet material having inclination function
JP2003110246A (en) * 2001-09-27 2003-04-11 Kyocera Corp INSULATING SHEET, ITS MANUFACTURING METHOD, MULTILAYER WIRING BOARD, AND ITS MANUFACTURING METHOD
WO2019181428A1 (en) * 2018-03-23 2019-09-26 三菱マテリアル株式会社 Insulated circuit board and method for producing insulated circuit board
JP2019169634A (en) * 2018-03-23 2019-10-03 三菱マテリアル株式会社 Insulative circuit board, and method for manufacturing the same
CN111527797A (en) * 2018-03-23 2020-08-11 三菱综合材料株式会社 Insulated circuit board and method for manufacturing insulated circuit board
US11222835B2 (en) 2018-03-23 2022-01-11 Mitsubishi Materials Corporation Insulating circuit substrate and method for producing insulating circuit substrate
JP2024516775A (en) * 2021-03-24 2024-04-17 ヒタチ・エナジー・リミテッド Power semiconductor module and manufacturing method

Also Published As

Publication number Publication date
JPS6030340B2 (en) 1985-07-16

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