JPS54112940A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS54112940A JPS54112940A JP1925378A JP1925378A JPS54112940A JP S54112940 A JPS54112940 A JP S54112940A JP 1925378 A JP1925378 A JP 1925378A JP 1925378 A JP1925378 A JP 1925378A JP S54112940 A JPS54112940 A JP S54112940A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- copper
- soldering
- fillers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract 4
- 239000000945 filler Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000011368 organic material Substances 0.000 abstract 2
- 238000005476 soldering Methods 0.000 abstract 2
- 239000004408 titanium dioxide Substances 0.000 abstract 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 239000011354 acetal resin Substances 0.000 abstract 1
- 239000000378 calcium silicate Substances 0.000 abstract 1
- 229910052918 calcium silicate Inorganic materials 0.000 abstract 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 abstract 1
- 229920006324 polyoxymethylene Polymers 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title cheap adhesive having improved bonding strength, heat resistance for soldering, and tracking resistance, obtained by adding a specific amount of zirconium silicate and/or titanium dioxide as fillers to an organic material.
CONSTITUTION: A) 100 parts by wt. of an organic material (e.g., polyvinyl acetal resin, etc.) excluding solvent is blended with B) 10W300 parts by wt., preferably 70W200 parts by wt. of zirconium slicate and/or titanium dioxide as fillers to give the desired adhesive. Silica, calcium silicate, etc., capable of maintaining heat resistance for soldering may be added as a filler.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1925378A JPS54112940A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1925378A JPS54112940A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8414580A Division JPS5665064A (en) | 1980-06-20 | 1980-06-20 | Adhesive for copper-clad laminated sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS54112940A true JPS54112940A (en) | 1979-09-04 |
| JPS5550077B2 JPS5550077B2 (en) | 1980-12-16 |
Family
ID=11994250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1925378A Granted JPS54112940A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54112940A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS499675A (en) * | 1972-05-26 | 1974-01-28 | ||
| JPS5319252A (en) * | 1976-08-06 | 1978-02-22 | Sakurai Shishiyuu Yuugengaishi | Jacquard drill embroidering machine |
-
1978
- 1978-02-22 JP JP1925378A patent/JPS54112940A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS499675A (en) * | 1972-05-26 | 1974-01-28 | ||
| JPS5319252A (en) * | 1976-08-06 | 1978-02-22 | Sakurai Shishiyuu Yuugengaishi | Jacquard drill embroidering machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5550077B2 (en) | 1980-12-16 |
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