JPS54112941A - Adhesive for copper-clad laminate - Google Patents
Adhesive for copper-clad laminateInfo
- Publication number
- JPS54112941A JPS54112941A JP1925478A JP1925478A JPS54112941A JP S54112941 A JPS54112941 A JP S54112941A JP 1925478 A JP1925478 A JP 1925478A JP 1925478 A JP1925478 A JP 1925478A JP S54112941 A JPS54112941 A JP S54112941A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- parts
- copper
- clad laminate
- organic material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 239000000378 calcium silicate Substances 0.000 abstract 2
- 229910052918 calcium silicate Inorganic materials 0.000 abstract 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 abstract 2
- 239000011368 organic material Substances 0.000 abstract 2
- -1 silica anhydride Chemical class 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 abstract 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 229920001568 phenolic resin Polymers 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title cheap adhesive having improved bonding strength, heat resistance for soldering, and tracking resistance, obtained by adding silica anhydride and/or calcium silicate as fillers to an organic material.
CONSTITUTION: A) 100 parts by wt. of an organic material (e.g., polyvinyl acetal, phenol formaldehyde resin) excluding solvents is blended with 10W200 parts by wt., preferably 70W150 parts by wt. of B) silica anhydride and/or C) calcium silicate to give the desired adhesive.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1925478A JPS54112941A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1925478A JPS54112941A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS54112941A true JPS54112941A (en) | 1979-09-04 |
Family
ID=11994280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1925478A Pending JPS54112941A (en) | 1978-02-22 | 1978-02-22 | Adhesive for copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS54112941A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
| JPH02130145A (en) * | 1988-11-11 | 1990-05-18 | Matsushita Electric Works Ltd | Electrical laminate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843740A (en) * | 1971-10-07 | 1973-06-23 | ||
| JPS4935439A (en) * | 1972-08-09 | 1974-04-02 | ||
| JPS4957040A (en) * | 1972-06-09 | 1974-06-03 | ||
| JPS50141623A (en) * | 1974-05-02 | 1975-11-14 |
-
1978
- 1978-02-22 JP JP1925478A patent/JPS54112941A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4843740A (en) * | 1971-10-07 | 1973-06-23 | ||
| JPS4957040A (en) * | 1972-06-09 | 1974-06-03 | ||
| JPS4935439A (en) * | 1972-08-09 | 1974-04-02 | ||
| JPS50141623A (en) * | 1974-05-02 | 1975-11-14 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5885593A (en) * | 1981-11-16 | 1983-05-21 | 鐘淵化学工業株式会社 | Paper substrate material metal foil-covered laminated board |
| JPH02130145A (en) * | 1988-11-11 | 1990-05-18 | Matsushita Electric Works Ltd | Electrical laminate |
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