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JPS5313357A - Formation of connector lead of semiconductor device - Google Patents

Formation of connector lead of semiconductor device

Info

Publication number
JPS5313357A
JPS5313357A JP8749576A JP8749576A JPS5313357A JP S5313357 A JPS5313357 A JP S5313357A JP 8749576 A JP8749576 A JP 8749576A JP 8749576 A JP8749576 A JP 8749576A JP S5313357 A JPS5313357 A JP S5313357A
Authority
JP
Japan
Prior art keywords
semiconductor device
formation
connector lead
solder layer
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8749576A
Other languages
Japanese (ja)
Inventor
Tetsuo Masuda
Masahiko Nishiomote
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8749576A priority Critical patent/JPS5313357A/en
Publication of JPS5313357A publication Critical patent/JPS5313357A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:Connector leads of a semiconductor device are formed as a concatenation body, and divided separatly after the adhesion of a prescribed solder layer, thereby making it possible to form the solder layer at once and at high uniformity.
JP8749576A 1976-07-22 1976-07-22 Formation of connector lead of semiconductor device Pending JPS5313357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8749576A JPS5313357A (en) 1976-07-22 1976-07-22 Formation of connector lead of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8749576A JPS5313357A (en) 1976-07-22 1976-07-22 Formation of connector lead of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5313357A true JPS5313357A (en) 1978-02-06

Family

ID=13916535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8749576A Pending JPS5313357A (en) 1976-07-22 1976-07-22 Formation of connector lead of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5313357A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662893A (en) * 1979-10-26 1981-05-29 Nippon Steel Corp Lubricant for rolling having improved surface cleanability
US11241476B2 (en) * 2016-09-27 2022-02-08 Camurus Ab Mixtures and formulations comprising an alkyl ammonium EDTA salt

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662893A (en) * 1979-10-26 1981-05-29 Nippon Steel Corp Lubricant for rolling having improved surface cleanability
JPS633000B2 (en) * 1979-10-26 1988-01-21 Nippon Steel Corp
US11241476B2 (en) * 2016-09-27 2022-02-08 Camurus Ab Mixtures and formulations comprising an alkyl ammonium EDTA salt

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