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JPS5330873A - Packaging structure of ic - Google Patents

Packaging structure of ic

Info

Publication number
JPS5330873A
JPS5330873A JP10499276A JP10499276A JPS5330873A JP S5330873 A JPS5330873 A JP S5330873A JP 10499276 A JP10499276 A JP 10499276A JP 10499276 A JP10499276 A JP 10499276A JP S5330873 A JPS5330873 A JP S5330873A
Authority
JP
Japan
Prior art keywords
packaging structure
potting
barriers
simplified
face down
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10499276A
Other languages
Japanese (ja)
Inventor
Yuzo Maekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP10499276A priority Critical patent/JPS5330873A/en
Publication of JPS5330873A publication Critical patent/JPS5330873A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10152—Auxiliary members for bump connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
    • H01L2224/10175—Flow barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/384—Bump effects
    • H01L2924/3841—Solder bridging

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: The structure of face down bonding is simplified by forming solder dams, potting barriers, etc. with an insulation coat.
COPYRIGHT: (C)1978,JPO&Japio
JP10499276A 1976-09-03 1976-09-03 Packaging structure of ic Pending JPS5330873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10499276A JPS5330873A (en) 1976-09-03 1976-09-03 Packaging structure of ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10499276A JPS5330873A (en) 1976-09-03 1976-09-03 Packaging structure of ic

Publications (1)

Publication Number Publication Date
JPS5330873A true JPS5330873A (en) 1978-03-23

Family

ID=14395580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10499276A Pending JPS5330873A (en) 1976-09-03 1976-09-03 Packaging structure of ic

Country Status (1)

Country Link
JP (1) JPS5330873A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55110051A (en) * 1979-02-15 1980-08-25 Nec Corp Lead frame and semiconductor device
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55110051A (en) * 1979-02-15 1980-08-25 Nec Corp Lead frame and semiconductor device
US4812421A (en) * 1987-10-26 1989-03-14 Motorola, Inc. Tab-type semiconductor process

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