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JPS5435679A - Semiconductor connection method - Google Patents

Semiconductor connection method

Info

Publication number
JPS5435679A
JPS5435679A JP10189077A JP10189077A JPS5435679A JP S5435679 A JPS5435679 A JP S5435679A JP 10189077 A JP10189077 A JP 10189077A JP 10189077 A JP10189077 A JP 10189077A JP S5435679 A JPS5435679 A JP S5435679A
Authority
JP
Japan
Prior art keywords
connection method
semiconductor connection
difference
distance
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10189077A
Other languages
Japanese (ja)
Other versions
JPS5724027B2 (en
Inventor
Shinichi Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10189077A priority Critical patent/JPS5435679A/en
Publication of JPS5435679A publication Critical patent/JPS5435679A/en
Publication of JPS5724027B2 publication Critical patent/JPS5724027B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To elevate reliability by properly adjusting the shape of the wiring loop which is caused due to the difference of distance between the element electrode and the package inner lead.
COPYRIGHT: (C)1979,JPO&Japio
JP10189077A 1977-08-25 1977-08-25 Semiconductor connection method Granted JPS5435679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10189077A JPS5435679A (en) 1977-08-25 1977-08-25 Semiconductor connection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10189077A JPS5435679A (en) 1977-08-25 1977-08-25 Semiconductor connection method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP58030851A Division JPS593850B2 (en) 1983-02-28 1983-02-28 Semiconductor wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS5435679A true JPS5435679A (en) 1979-03-15
JPS5724027B2 JPS5724027B2 (en) 1982-05-21

Family

ID=14312515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10189077A Granted JPS5435679A (en) 1977-08-25 1977-08-25 Semiconductor connection method

Country Status (1)

Country Link
JP (1) JPS5435679A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127031A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Wire bonding
JPS55132049A (en) * 1979-03-30 1980-10-14 Nec Corp Method and device for wire bonding
JPS55156334A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Wire bonding method and apparatus thereof
JPS55166934A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Automatic wire bonding method
JPS5630785A (en) * 1979-08-21 1981-03-27 Nippon Electric Co Method of forming electrode on ceramic crude sheet
JPS5785290A (en) * 1980-11-17 1982-05-27 Fujitsu Ltd Method of producing ceramic printed board
JPS61179548A (en) * 1986-02-07 1986-08-12 Hitachi Ltd Wire bonding device
DE112017001656T5 (en) 2016-03-29 2018-12-13 Life Robotics Inc. Robot arm mechanism and hinge device
DE112017001677T5 (en) 2016-03-29 2018-12-13 Life Robotics Inc. Proximity sensor device and robot arm mechanism
DE112017001715T5 (en) 2016-03-29 2018-12-20 Life Robotics Inc. LINEAR EXIT AND RUNNING MECHANISM AND ROBOT ARM MECHANISM
DE112017001609T5 (en) 2016-03-29 2018-12-20 Life Robotics Inc. Linear extension and retraction mechanism and robot arm mechanism.
DE112017001742T5 (en) 2016-03-29 2018-12-27 Life Robotics Inc. Torsion joint mechanism, robot arm mechanism and cantilevered rotating mechanism
DE112017002744T5 (en) 2016-05-31 2019-02-14 Life Robotics Inc. Linear extension and retraction mechanism
DE112017003832T5 (en) 2016-07-30 2019-04-11 Life Robotics Inc. A robot arm
DE112017005491T5 (en) 2016-10-31 2019-08-08 Life Robotics Inc. A robot arm
DE112017005497T5 (en) 2016-10-31 2019-08-08 Life Robotics Inc. APPROXIMATION SENSOR DEVICE AND ROBOT ARM MECHANISM

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6329409B2 (en) * 1979-03-26 1988-06-14 Hitachi Ltd
JPS55127031A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Wire bonding
JPS55132049A (en) * 1979-03-30 1980-10-14 Nec Corp Method and device for wire bonding
JPS55156334A (en) * 1979-05-25 1980-12-05 Hitachi Ltd Wire bonding method and apparatus thereof
JPS6333295B2 (en) * 1979-05-25 1988-07-05 Hitachi Ltd
JPS55166934A (en) * 1979-06-15 1980-12-26 Hitachi Ltd Automatic wire bonding method
JPS5630785A (en) * 1979-08-21 1981-03-27 Nippon Electric Co Method of forming electrode on ceramic crude sheet
JPS5785290A (en) * 1980-11-17 1982-05-27 Fujitsu Ltd Method of producing ceramic printed board
JPS61179548A (en) * 1986-02-07 1986-08-12 Hitachi Ltd Wire bonding device
DE112017001656T5 (en) 2016-03-29 2018-12-13 Life Robotics Inc. Robot arm mechanism and hinge device
DE112017001677T5 (en) 2016-03-29 2018-12-13 Life Robotics Inc. Proximity sensor device and robot arm mechanism
DE112017001715T5 (en) 2016-03-29 2018-12-20 Life Robotics Inc. LINEAR EXIT AND RUNNING MECHANISM AND ROBOT ARM MECHANISM
DE112017001609T5 (en) 2016-03-29 2018-12-20 Life Robotics Inc. Linear extension and retraction mechanism and robot arm mechanism.
DE112017001742T5 (en) 2016-03-29 2018-12-27 Life Robotics Inc. Torsion joint mechanism, robot arm mechanism and cantilevered rotating mechanism
DE112017002744T5 (en) 2016-05-31 2019-02-14 Life Robotics Inc. Linear extension and retraction mechanism
DE112017003832T5 (en) 2016-07-30 2019-04-11 Life Robotics Inc. A robot arm
DE112017005491T5 (en) 2016-10-31 2019-08-08 Life Robotics Inc. A robot arm
DE112017005497T5 (en) 2016-10-31 2019-08-08 Life Robotics Inc. APPROXIMATION SENSOR DEVICE AND ROBOT ARM MECHANISM

Also Published As

Publication number Publication date
JPS5724027B2 (en) 1982-05-21

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