[go: up one dir, main page]

JPS5397367A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5397367A
JPS5397367A JP1272077A JP1272077A JPS5397367A JP S5397367 A JPS5397367 A JP S5397367A JP 1272077 A JP1272077 A JP 1272077A JP 1272077 A JP1272077 A JP 1272077A JP S5397367 A JPS5397367 A JP S5397367A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
lead surface
assured
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1272077A
Other languages
Japanese (ja)
Inventor
Takashi Masamoto
Hiroshi Isoya
Hikari Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1272077A priority Critical patent/JPS5397367A/en
Publication of JPS5397367A publication Critical patent/JPS5397367A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To form the two layers of gold and tin on the lead surface of the tape carrier and to ensure an assured junction between the electrode and the lead surface through a short-time heat pressure bonding.
COPYRIGHT: (C)1978,JPO&Japio
JP1272077A 1977-02-07 1977-02-07 Semiconductor device and its manufacture Pending JPS5397367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1272077A JPS5397367A (en) 1977-02-07 1977-02-07 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1272077A JPS5397367A (en) 1977-02-07 1977-02-07 Semiconductor device and its manufacture

Publications (1)

Publication Number Publication Date
JPS5397367A true JPS5397367A (en) 1978-08-25

Family

ID=11813254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1272077A Pending JPS5397367A (en) 1977-02-07 1977-02-07 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5397367A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02209742A (en) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> Gold/tin entectic bonding for tape automaization bonding process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02209742A (en) * 1988-09-16 1990-08-21 Natl Semiconductor Corp <Ns> Gold/tin entectic bonding for tape automaization bonding process

Similar Documents

Publication Publication Date Title
JPS52124865A (en) Semiconductor device
JPS528785A (en) Semiconductor device electrode structure
JPS5230162A (en) Semiconductor device
JPS5397367A (en) Semiconductor device and its manufacture
JPS522282A (en) Semiconductor device
JPS5348671A (en) Electrode structure of semiconductor element
JPS5411690A (en) Semiconductor laser unit
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS5378768A (en) Wire bonding method of semiconductor element
JPS5356969A (en) Production of tape for tape carrier
JPS51132764A (en) Semiconductor device
JPS53141575A (en) Semiconductor device
JPS5283166A (en) Semiconductor device and its production
JPS5362471A (en) Semiconductor device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS53141574A (en) Manufacture of semiconductor device
JPS5250167A (en) Semiconductor device
JPS5299068A (en) Semiconductor device
JPS5345969A (en) Schottky barrier semiconductor device
JPS5258370A (en) Semiconductor device
JPS5380184A (en) Manufacture of semiconductor device
JPS5313874A (en) Production of semiconductor device
JPS5383581A (en) Manufacture of semiconductor device
JPS5356970A (en) Tape for tape carrier
JPS5275979A (en) Semiconductor device