JPH09248756A - Polishing cloth - Google Patents
Polishing clothInfo
- Publication number
- JPH09248756A JPH09248756A JP8054596A JP8054596A JPH09248756A JP H09248756 A JPH09248756 A JP H09248756A JP 8054596 A JP8054596 A JP 8054596A JP 8054596 A JP8054596 A JP 8054596A JP H09248756 A JPH09248756 A JP H09248756A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- layer
- flocked
- suede
- polishing cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 37
- 239000004744 fabric Substances 0.000 title claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 229920005830 Polyurethane Foam Polymers 0.000 claims abstract description 3
- 239000011496 polyurethane foam Substances 0.000 claims abstract description 3
- 230000006835 compression Effects 0.000 abstract description 13
- 238000007906 compression Methods 0.000 abstract description 13
- 229920005749 polyurethane resin Polymers 0.000 abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 7
- 239000000835 fiber Substances 0.000 abstract description 7
- 229920000728 polyester Polymers 0.000 abstract description 7
- 229920002803 thermoplastic polyurethane Polymers 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000005406 washing Methods 0.000 abstract description 4
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 238000005187 foaming Methods 0.000 abstract 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 8
- 239000006260 foam Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000002759 woven fabric Substances 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 239000000049 pigment Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229940094537 polyester-10 Drugs 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Landscapes
- Treatment Of Fiber Materials (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、半導体ウエハー等
の精密研磨に使用される、研磨布の改良に関るものであ
る。TECHNICAL FIELD The present invention relates to improvement of a polishing cloth used for precision polishing of semiconductor wafers and the like.
【0002】[0002]
【従来の技術】従来、シリコンウエハー等の半導体ウエ
ハーの精密研磨は、砥粒を含有する研磨液を、研磨面に
供給しながら研磨布により研磨する方法が用いられてい
る。この場合不織布の片面に、スエード状の発泡ウレタ
ン樹脂層を、形成した研磨布が使用されている。2. Description of the Related Art Conventionally, for precision polishing of a semiconductor wafer such as a silicon wafer, a method of polishing with a polishing cloth while supplying a polishing liquid containing abrasive grains to a polishing surface has been used. In this case, a polishing cloth having a suede urethane foam resin layer formed on one surface of the nonwoven fabric is used.
【0003】[0003]
【発明が解決しようとする課題】上記の様に不織布を基
材とし、その片面にスエード状発泡ウレタン樹脂層を形
成した研磨布では、不織布の厚さ、密度、硬度、圧縮
率、圧縮弾性率のバラツキが大きく、これらの品質のバ
ラツキが研磨布の品質に直接影響し、研磨性能のバラツ
キとなる欠点をもっていた。又、不織布の厚さ、密度の
バラツキがスエード状発泡ポリウレタン樹脂層を形成す
る場合、加工精度に影響し、発泡ウレタン樹脂層のバラ
ツキの原因になっていた。本発明は研磨性能にバラツキ
のない均一な品質の研磨布を提供するものである。As described above, in a polishing cloth having a nonwoven fabric as a base material and a suede-like urethane foam resin layer formed on one surface thereof, the thickness, density, hardness, compressibility, and compression elastic modulus of the nonwoven fabric are The quality of the polishing cloth directly affects the quality of the polishing cloth, resulting in a variation in polishing performance. Further, when forming the suede-shaped polyurethane foam resin layer, variations in the thickness and density of the non-woven fabric affect the processing accuracy and cause variations in the urethane foam resin layer. The present invention provides a polishing cloth of uniform quality with no variation in polishing performance.
【0004】[0004]
【課題を解決するための手段】上記の課題を解決するた
めに、本第一発明はカットパイル織物、及び織物、紙、
フィルム等の片面に接着剤を介して静電植毛技法等で、
短繊維を植毛し立毛層を形成した植毛基材の立毛層面に
スエード状発泡ポリウレタン樹脂層を形成した。In order to solve the above problems, the first invention of the present invention is to provide a cut pile woven fabric, and a woven fabric, paper,
Electrostatic flocking technique etc. via adhesive on one side of film etc.,
A suede-like foamed polyurethane resin layer was formed on the napped layer surface of a napped substrate on which napped layers were formed by short-fiber fluffing.
【0005】更に本第二発明は、微多孔構造の樹脂を、
含浸等の加工方法で、立毛層の基材に充填した。The second aspect of the present invention further provides a resin having a microporous structure,
The napped layer base material was filled by a processing method such as impregnation.
【0006】[0006]
【発明の実施の形態】本第一発明はカットパイル又は静
電植毛技法で植毛された立毛層と、織布、紙、フィルム
等で構成された基材であるため、従来の不織布に構造が
非常に均一であり、厚さ、密度、硬度等のバラツキが少
なく、且つ短繊維が垂直方向に均一に構成されているた
め、均一でバラツキのない圧縮率、圧縮弾性率が得られ
る。更にスエード状発泡ウレタン樹脂層を形成加工に於
て、立毛層が均一な構造をもっているため、安定した均
一なスエード状発泡ウレタン樹脂層を作ることが容易と
なり、基材の品質の均一化と、均一なスエード状発泡構
造により、バラツキのない、安定した研磨性能のある研
磨布が得られる。BEST MODE FOR CARRYING OUT THE INVENTION Since the first invention of the present invention is a base material composed of a napped layer that has been flocked by a cut pile or electrostatic flocking technique and a woven fabric, paper, film, etc. Since the fibers are extremely uniform and have little variation in thickness, density, hardness, etc., and the short fibers are uniformly formed in the vertical direction, a uniform compression rate and compression elastic modulus can be obtained. Further, in the process of forming the suede-like urethane foam resin layer, since the nap layer has a uniform structure, it becomes easy to make a stable and uniform suede-like urethane foam resin layer, and the quality of the base material becomes uniform, Due to the uniform suede-like foam structure, it is possible to obtain a polishing cloth having a stable polishing performance without variations.
【0007】さらに本第二発明は、立毛層を有する基材
を、微多孔構造の樹脂で充填することにより、立毛層の
構造を緻密に、より均一にすることが出来るため、硬
度、圧縮率、圧縮弾性率の均一性を向上させることが出
来、研磨性能の均一性、安定性をより良くする効果があ
る。又硬度、圧縮率、圧縮弾性率等、研磨性能に影響す
る品質を、充填する樹脂の性能、発泡倍率、充填量等で
調整することが出来るため研磨されるワークに最適な研
磨布を提供することが出来る。Further, according to the second aspect of the present invention, by filling the base material having a napped layer with a resin having a microporous structure, the structure of the napped layer can be made denser and more uniform, so that the hardness and compressibility are improved. In addition, it is possible to improve the uniformity of the compression elastic modulus and to improve the uniformity and stability of the polishing performance. In addition, since the quality that affects the polishing performance such as hardness, compressibility, compression elastic modulus, etc. can be adjusted by the performance of the resin to be filled, the expansion ratio, the filling amount, etc., it provides an optimum polishing cloth for the work to be polished. You can
【0008】[0008]
[実施例1]太さ50デニールのポリエステルフィラメ
ン織物(1)に静電植毛技法で太さ1.5デニール、長
さ0.4mmのポリエステル短繊維(2)を熱硬化樹脂
7%を混入したアクリル樹脂接着剤(4)を介して、植
毛した基材の植毛面に、ポリウレタン樹脂15%をジメ
チルホルムアミド(以下DMFという)84%、着色剤
1%に溶解した塗料を、ナイフオーバーロール法で塗布
し、直ちに水中に浸漬、塗布したウレタン樹脂を凝固
し、タテ型発泡構造のウレタン樹脂層を形成した。水洗
により完全にDMFを除去、乾燥した后ウレタン層の表
皮をバフ加工にて研削し、スエード状研磨布を得た。こ
の研磨布の品質を測定した結果、厚さ、硬度、圧縮率、
圧縮弾性率のバラツキが従来の研磨布に比べて非常に小
さく、スエード状ウレタン樹脂層のスポンジ構造も非常
に均一であった。[Example 1] Polyester filament fabric (1) having a thickness of 50 denier (1) was mixed with 7% of thermosetting resin and polyester denier (2) having a thickness of 1.5 denier and a length of 0.4 mm by an electrostatic flocking technique. Via an acrylic resin adhesive (4), a flocked surface of a flocked substrate was coated with a paint prepared by dissolving 15% of polyurethane resin in 84% of dimethylformamide (hereinafter referred to as DMF) and 1% of a coloring agent by a knife over roll method. The urethane resin was applied and immediately immersed in water to solidify the applied urethane resin to form a urethane resin layer having a vertical foam structure. After the DMF was completely removed by washing with water and dried, the skin of the urethane layer was buffed to obtain a suede-like polishing cloth. As a result of measuring the quality of this polishing cloth, the thickness, hardness, compressibility,
The variation in compression modulus was very small compared to the conventional polishing cloth, and the sponge structure of the suede-like urethane resin layer was also very uniform.
【0009】[実施例2]ポリエステル繊維を湿式抄紙
した紙(6)に、太さ1.0デニール、長さ0.4mm
に裁断したポリエステル繊維(2)を植毛した基材を、
ポリウレタン樹脂10%、DMF89%、顔料1%に調
整した樹脂液に含浸し、直ちに水中に浸漬、凝固、水
洗、乾燥し、微多孔構造のウレタン樹脂(5)を形成し
た。ポリウレタン樹脂15%、DMF83%、顔料1
%、気孔調整剤他1%に調整した塗料を、植毛面にナイ
フオーバーロール法にて塗布し、直ちに水中に浸漬、ウ
レタン樹脂を凝固し、タテ型発泡構造の樹脂層(3)を
形成した。水洗、乾燥后バフ加工を行いスエード状とし
た。この研磨布の品質を測定した結果、厚さ、硬度、圧
縮率、圧縮弾性率のバラツキが全くなく且つスエード状
ポリウレタン樹脂層の構造が非常に均一でスポンジ構
造、開口径のバラツキがない研磨布が得られた。Example 2 A paper (6) obtained by wet-making a polyester fiber was used, and a thickness of 1.0 denier and a length of 0.4 mm
The base material on which the polyester fiber (2) cut into
A polyurethane resin (5) having a microporous structure was formed by impregnating a resin solution containing 10% polyurethane resin, 89% DMF and 1% pigment, and immediately immersing in water, coagulating, washing with water and drying. Polyurethane resin 15%, DMF 83%, Pigment 1
%, A porosity control agent and other 1% coating material was applied to the flocked surface by the knife over roll method and immediately immersed in water to solidify the urethane resin to form a resin layer (3) having a vertical foam structure. . After washing with water and drying, buffing was applied to give a suede shape. As a result of measuring the quality of this polishing cloth, there is no variation in thickness, hardness, compression rate, and compression elastic modulus, and the structure of the suede-like polyurethane resin layer is very uniform, and there is no sponge structure or variation in opening diameter. was gotten.
【0010】[実施例3]タテ糸75d/36f、ヨコ
糸75d/36f、織密度タテ70本/インチ、ヨコ4
6本/インチ、パイル長0.6mmのポリエステル10
0%カットパイル織物(7)に、ポリウレタン樹脂12
%、DMF87%、顔料1%に調整した樹脂液に含浸
し、実施例2と同じ工程に加工した研磨布の品質を測定
した結果、品質のバラツキが非常に少ない研磨布が得ら
れた。[Embodiment 3] 75d / 36f warp yarns, 75d / 36f weft yarns, 70 weaving density warp / inch, 4 wefts
6 / inch, pile length 0.6mm polyester 10
Polyurethane resin 12 on 0% cut pile fabric (7)
%, DMF 87%, and pigment 1% were impregnated with the resin liquid, and the quality of the polishing cloth processed in the same process as in Example 2 was measured. As a result, a polishing cloth with very little variation in quality was obtained.
【0011】[0011]
【発明の効果】本第一発明による研磨布は、厚さ、硬
度、圧縮率、圧縮弾性率のバラツキが少なく、研磨性能
が均一で、安定した研磨効果を発揮する。The polishing cloth according to the first aspect of the present invention has little variation in thickness, hardness, compressibility and compression elastic modulus, has uniform polishing performance, and exhibits a stable polishing effect.
【0012】本第二発明により本第一発明による研磨性
能の均一性をより向上させることが出来る。さらに硬
度、圧縮率、圧縮弾性率を調整することが容易に出来
る。The second aspect of the present invention can further improve the uniformity of polishing performance according to the first aspect of the present invention. Further, it is possible to easily adjust the hardness, the compression rate, and the compression elastic modulus.
【図1】本発明実施例1による研磨布の断面図である。FIG. 1 is a sectional view of a polishing cloth according to a first embodiment of the present invention.
【図2】本発明実施例2による研磨布の断面図である。FIG. 2 is a sectional view of a polishing cloth according to a second embodiment of the present invention.
【図3】本発明実施例3による研磨布の断面図。FIG. 3 is a sectional view of a polishing cloth according to a third embodiment of the present invention.
1 織物 2 立毛繊維 3 スエード状発泡ポリウレタン樹脂層 4 接着剤 5 微多孔構造の樹脂 6 ポリエステル紙 7 カットパイル織物 DESCRIPTION OF SYMBOLS 1 woven fabric 2 napped fiber 3 suede-like foamed polyurethane resin layer 4 adhesive 5 microporous resin 6 polyester paper 7 cut pile woven fabric
Claims (2)
に、スエード状発泡ポリウレタン樹脂層を形成する事を
特徴とする研磨布。1. A polishing cloth comprising a substrate having a napped structure and a suede-shaped polyurethane foam resin layer formed on the napped layer.
樹脂で、充填した請求項1の研磨布。2. The polishing cloth according to claim 1, wherein a substrate having a napped structure is filled with a resin having a microporous structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8054596A JPH09248756A (en) | 1996-03-08 | 1996-03-08 | Polishing cloth |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8054596A JPH09248756A (en) | 1996-03-08 | 1996-03-08 | Polishing cloth |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH09248756A true JPH09248756A (en) | 1997-09-22 |
Family
ID=13721324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8054596A Pending JPH09248756A (en) | 1996-03-08 | 1996-03-08 | Polishing cloth |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH09248756A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002516764A (en) * | 1998-06-02 | 2002-06-11 | スキャパ・グループ・パブリック・リミテッド・カンパニー | Improved polishing pad with reduced moisture absorption |
JP2004524683A (en) * | 2001-02-07 | 2004-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | Abrasive article suitable for modifying semiconductor wafers |
JP2006239786A (en) * | 2005-03-01 | 2006-09-14 | Fujibo Holdings Inc | Holding pad |
KR100695740B1 (en) * | 2000-09-29 | 2007-03-15 | 주식회사 코오롱 | Woven fabric suede with excellent touch and abrasion strength and its manufacturing method |
CN104786137A (en) * | 2014-01-17 | 2015-07-22 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
CN105437056A (en) * | 2014-09-19 | 2016-03-30 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
CN115008852A (en) * | 2022-05-20 | 2022-09-06 | 安徽禾臣新材料有限公司 | Porous damping cloth for crystal polishing and preparation process thereof |
CN115194666A (en) * | 2022-07-12 | 2022-10-18 | 陈猛 | Electrostatic flocking material and manufacturing method suitable for surface grinding and polishing of various materials |
-
1996
- 1996-03-08 JP JP8054596A patent/JPH09248756A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002516764A (en) * | 1998-06-02 | 2002-06-11 | スキャパ・グループ・パブリック・リミテッド・カンパニー | Improved polishing pad with reduced moisture absorption |
KR100695740B1 (en) * | 2000-09-29 | 2007-03-15 | 주식회사 코오롱 | Woven fabric suede with excellent touch and abrasion strength and its manufacturing method |
JP2004524683A (en) * | 2001-02-07 | 2004-08-12 | スリーエム イノベイティブ プロパティズ カンパニー | Abrasive article suitable for modifying semiconductor wafers |
JP2006239786A (en) * | 2005-03-01 | 2006-09-14 | Fujibo Holdings Inc | Holding pad |
JP4540502B2 (en) * | 2005-03-01 | 2010-09-08 | 富士紡ホールディングス株式会社 | Holding pad |
CN104786137A (en) * | 2014-01-17 | 2015-07-22 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
CN105437056A (en) * | 2014-09-19 | 2016-03-30 | 三芳化学工业股份有限公司 | Polishing pad, polishing apparatus, and method of manufacturing polishing pad |
CN115008852A (en) * | 2022-05-20 | 2022-09-06 | 安徽禾臣新材料有限公司 | Porous damping cloth for crystal polishing and preparation process thereof |
CN115008852B (en) * | 2022-05-20 | 2023-09-12 | 安徽禾臣新材料有限公司 | Porous damping cloth for crystal polishing and preparation process thereof |
CN115194666A (en) * | 2022-07-12 | 2022-10-18 | 陈猛 | Electrostatic flocking material and manufacturing method suitable for surface grinding and polishing of various materials |
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