JPH10249709A - Polishing cloth - Google Patents
Polishing clothInfo
- Publication number
- JPH10249709A JPH10249709A JP8234297A JP8234297A JPH10249709A JP H10249709 A JPH10249709 A JP H10249709A JP 8234297 A JP8234297 A JP 8234297A JP 8234297 A JP8234297 A JP 8234297A JP H10249709 A JPH10249709 A JP H10249709A
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- polishing
- polishing cloth
- hardness
- urethane resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 50
- 239000004744 fabric Substances 0.000 title claims abstract description 27
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 27
- 239000006260 foam Substances 0.000 claims abstract description 23
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 abstract description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 239000000428 dust Substances 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- 238000004807 desolvation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009998 heat setting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
(57)【要約】
【課題】 半導体基板、ハードディスク用基板の精密研
磨に使用される研磨布の品質改良を目的とする。
【解決手段】 たて型発泡構造を有するウレタン樹脂膜
(1)に、硬さがショアー硬度で3度以上15度以下の
範囲で前記ウレタン樹脂膜(1)の硬度と硬さが異なる
樹脂膜(3)を、接着剤(2)を介して結合した研磨
布。
(57) [Problem] To improve the quality of a polishing cloth used for precision polishing of a semiconductor substrate and a hard disk substrate. SOLUTION: The urethane resin film (1) having a vertical foam structure has a hardness different from the hardness of the urethane resin film (1) in the range of 3 to 15 degrees in Shore hardness. A polishing cloth obtained by bonding (3) via an adhesive (2).
Description
【0001】[0001]
【発明の属する技術分野】本発明はシリコン等半導体基
板、ハードディスク用基板の精密研磨に使用される研磨
布の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a polishing cloth used for precision polishing of semiconductor substrates such as silicon and hard disk substrates.
【0002】[0002]
【従来の技術】従来、金属シリコン、ガリウム砒素等の
半導体基板、アルミニウム/ニッケルガラス等のハード
ディスク基板の精密研磨に使用されている研磨布は、不
織布の片面にタテ型発泡構造のウレタン樹脂膜を形成し
た研磨布が使用されている。2. Description of the Related Art Conventionally, a polishing cloth used for precision polishing of a semiconductor substrate such as metallic silicon or gallium arsenide, or a hard disk substrate such as aluminum / nickel glass has a urethane resin film having a vertical foam structure on one surface of a nonwoven fabric. The formed polishing cloth is used.
【0003】[0003]
【発明が解決しようとする課題】上記の様に不織布を基
材とし、その片面にタテ型発泡構造のポリウレタン樹脂
層を形成した研磨布では、不織布の厚さ、密度、硬度、
圧縮率、圧縮弾性率にバラツキが大きく、これらの品質
のバラツキが研磨布の品質に直接影響し、研磨性能のバ
ラツキとなる欠点をもっている。As described above, in a polishing cloth having a non-woven fabric as a base material and a polyurethane resin layer having a vertical foam structure formed on one surface thereof, the thickness, density, hardness,
The compression ratio and the compression elasticity vary greatly, and these variations in quality directly affect the quality of the polishing cloth, and have a disadvantage that the polishing performance varies.
【0004】又不織布の厚み、密度のバラツキが、タテ
型発泡構造のウレタン樹脂膜を形成するとき、加工精度
に影響しタテ型発泡ウレタン樹脂膜の厚さ、構造が変動
する要因となっていた。[0004] In addition, variations in the thickness and density of the nonwoven fabric affect the processing accuracy when forming a urethane resin film having a vertical foam structure, which is a factor that causes the thickness and structure of the vertical urethane foam resin film to fluctuate. .
【0005】更に不織布は繊維の集合体であるため裁断
面等からの粉塵の発生が多く、粉塵による研磨傷等のト
ラブル発生の要因となっていた。[0005] Further, since the nonwoven fabric is an aggregate of fibers, dust is often generated from a cut surface or the like, which has been a factor of causing troubles such as polishing scratches due to the dust.
【0006】本発明は研磨性能にバラツキのない均一な
品質と粉塵の発生がない研磨布を提供するものである。The present invention provides a polishing cloth having uniform quality without variation in polishing performance and generating no dust.
【0007】[0007]
【課題を解決するための手段】上記の課題を解決するた
めに本発明はタテ型発泡構造のウレタン樹脂膜(1)に
このタテ型発泡構造のウレタン樹脂膜(1)の硬度より
もショアー硬度で3度以上15度以下の範囲で硬度に差
異のある樹脂膜(3)を接着剤(2)で接着結合した。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a urethane resin film (1) having a vertical foam structure with a Shore hardness higher than that of the urethane resin film (1) having a vertical foam structure. Then, a resin film (3) having a difference in hardness within a range of 3 degrees or more and 15 degrees or less was bonded by an adhesive (2).
【0008】本第2発明の研磨布は樹脂膜(3)をスポ
ンジ構造の多孔性樹脂膜(3A)とした。(図2)In the polishing cloth of the second invention, the resin film (3) is a sponge-structured porous resin film (3A). (Fig. 2)
【0009】本第3発明は圧縮弾性率が30%以上95
%以下の弾性を有する樹脂膜(3)とした。The third invention has a compression elastic modulus of 30% or more and 95% or more.
% Of the resin film (3).
【0010】[0010]
【発明の実施の形態】研磨スラリーの保持機能をもつタ
テ型発泡構造のウレタン樹脂膜(1)はフィルム、フィ
ラメント織物等平坦なシート状基材の片面にウレタン樹
脂液を均一に塗布し湿式凝固法で凝固后、脱溶媒、乾燥
后バフ加工にて製造されるもので、厚さ、発泡構造が非
常に均一で、従って硬度、圧縮率、圧縮弾性率及び開口
径等の物理的な品質にバラツキのない均質なタテ型発泡
構造のウレタン樹脂膜が得られる。BEST MODE FOR CARRYING OUT THE INVENTION A urethane resin film (1) having a vertical foam structure having a function of holding a polishing slurry is formed by uniformly applying a urethane resin liquid to one surface of a flat sheet-like base material such as a film or a filament fabric, and wet-solidifying. It is manufactured by buffing after coagulation, desolvation, drying after solidification by the method.Thickness and foam structure are very uniform, so physical quality such as hardness, compressibility, compression elastic modulus and opening diameter A uniform urethane resin film with a vertical foam structure without variation can be obtained.
【0011】樹脂膜(3)はアクリル樹脂、ウレタン樹
脂、合成ゴム、天然ゴム等の天然又は合成樹脂で形成さ
れた樹脂膜であるため、非常に均質で、厚さ、硬度、圧
縮率、圧縮弾性率等の物性値のバラツキが非常に低い。Since the resin film (3) is a resin film formed of a natural or synthetic resin such as an acrylic resin, a urethane resin, a synthetic rubber, a natural rubber, etc., the resin film (3) is very homogeneous, and has a thickness, hardness, compressibility, and compressibility. Variations in physical properties such as elastic modulus are very low.
【0012】上記の非常に均質なタテ型発泡構造のウレ
タン樹脂膜(1)、繊維等を混入しない均質な樹脂膜
(3)をアクリル樹脂、エポキシ樹脂、ウレタン樹脂等
を主成分とする接着剤(2)で強固に接着することによ
り、厚さ、密度、圧縮率、圧縮弾性率、開口径等、研磨
性能に関与する物性値のバラツキの非常に少ない安定し
た品質の研磨布を提供することが出来る。The above-mentioned urethane resin film (1) having a very uniform vertical foam structure and a uniform resin film (3) containing no fibers or the like are bonded to an adhesive mainly composed of acrylic resin, epoxy resin, urethane resin or the like. (2) to provide a polishing cloth of stable quality with very little variation in physical properties related to polishing performance such as thickness, density, compression ratio, compression elastic modulus, opening diameter, etc. Can be done.
【0013】たて型発泡構造のウレタン樹脂膜(1)の
硬度よりもショアー硬度で3度以上15度以下の硬さに
差異のある樹脂膜(3)で構成されているため、多様な
研磨条件に最適な研磨布を設計することが出来る。Since the resin film (3) is different in hardness from 3 degrees to 15 degrees in Shore hardness than the hardness of the urethane resin film (1) having the vertical foam structure, various polishing methods are employed. The most suitable polishing cloth can be designed for the conditions.
【0014】本第2発明のスポンジ構造の樹脂膜(3
A)はポリウレタン樹脂、ポリアクリル樹脂、ポリプロ
ピレン樹脂、合成ゴム、天然ゴムを乾式発泡法又は湿式
凝固法により独立発泡又は連続発泡のスポンジ構造樹脂
膜が得られる。(図2)The resin film (3) having a sponge structure of the second invention
In A), a sponge structure resin film obtained by independently foaming or continuously foaming a polyurethane resin, a polyacrylic resin, a polypropylene resin, a synthetic rubber, or a natural rubber by a dry foaming method or a wet coagulation method is obtained. (Fig. 2)
【0015】本第3発明の圧縮弾性率が30%以上95
%以下の樹脂膜は樹脂の種類と架橋度、加硫度を選択す
ることにより調整することが出来る。The compression modulus of the third invention is 30% or more and 95% or more.
% Or less can be adjusted by selecting the type of resin, the degree of crosslinking, and the degree of vulcanization.
【0016】[0016]
[実施例1]厚さ75ミクロンのポリエステルフィルム
の片面に、予めエーテル型ウレタン樹脂15%、N,N
−ジメチルホルムアミド(以下DMFという)83.9
5%、顔料1%、活性剤0.05%に調液した樹脂液
を、ナイフオーバーロール法で塗布し、直ちに水中に浸
漬、完全に凝固、水洗、脱DMF、乾燥した后、ベルト
サンダーにてウレタン樹脂膜の表皮層を研削し、つづい
てポリエステルフィルムより剥離し、ショアー硬度61
度のタテ型発泡構造のウレタン樹脂膜(1)を得た。Example 1 One side of a 75 micron thick polyester film was previously coated with 15% ether urethane resin, N, N
-Dimethylformamide (hereinafter referred to as DMF) 83.9
A resin solution prepared to 5%, pigment 1% and activator 0.05% was applied by knife over roll method, immediately immersed in water, completely coagulated, washed with water, removed from DMF, dried, and then placed on a belt sander. To grind the skin layer of the urethane resin film, and then peel it off from the polyester film.
Thus, a urethane resin film (1) having a vertical foam structure was obtained.
【0017】一方、エチレン酢ビコポリマー(以下エバ
ーという)を押出し機にてシート状に押出し成型し、厚
さ0.9mm、ショアー硬度70度の均一なシート
(3)をえた。このエバーシート(3)の片面にクロロ
プレンゴム接着剤(2)をナイフオーバーロール法でコ
ートし乾燥した后、上記タテ型発泡構造のウレタン樹脂
膜(1)を圧着接合し研磨布を得た。この研磨布の品質
を測定した結果、厚さ、硬度、圧縮率、圧縮弾性率のバ
ラツキが不織布を基材とした研磨布に比べ非常に少な
く、ウレタン樹脂膜のタテ型発泡構造が均一で開口径の
バラツキが認められなかった。更に裁断面からの発塵が
全くなく、粉塵による研磨傷の発生は全く認められなか
った。On the other hand, an ethylene-vinyl acetate copolymer (hereinafter referred to as EVA) was extruded into a sheet by an extruder to obtain a uniform sheet (3) having a thickness of 0.9 mm and a Shore hardness of 70 degrees. One side of this eversheet (3) was coated with a chloroprene rubber adhesive (2) by a knife over roll method and dried, and then the above-mentioned urethane resin film (1) having a vertical foam structure was pressure-bonded to obtain a polishing cloth. As a result of measuring the quality of the polishing cloth, the thickness, hardness, compression ratio, and compression elasticity variation were extremely small compared to the polishing cloth based on nonwoven fabric, and the vertical foam structure of the urethane resin film was uniform and open. No variation in caliber was observed. Further, no dust was generated from the cut surface, and no generation of polishing scratches due to the dust was observed.
【0018】[実施例2]ポリエーテルトリオールとト
リレンジイソシアネートを反応させて作成したポリウレ
タン発泡体をスライス加工し、厚さ0.95mm、硬度
50度、圧縮率12%、圧縮弾性率85%のスポンジ構
造の樹脂膜(3A)を得た。実施例1で作製したタテ型
発泡構造のウレタン樹脂膜(1)の膜面に硬化型ウレタ
ン接着剤溶液をスプレーコーターで塗布、乾燥した后、
上記スポンジ構造の樹脂膜(3)を貼合せ、40℃、4
8時間硬化させて接着し、研磨布を得た。この研磨布を
使用し、シリコンウエハーを低圧にて研磨した結果、従
来の不織布基材の研磨布では得られなかった平坦性の非
常にすぐれた研磨結果を得ることが出来た。Example 2 A polyurethane foam produced by reacting polyether triol and tolylene diisocyanate was sliced, and had a thickness of 0.95 mm, a hardness of 50 degrees, a compressibility of 12% and a compressive elasticity of 85%. A resin film (3A) having a sponge structure was obtained. After applying a curable urethane adhesive solution to the film surface of the urethane resin film (1) having a vertical foam structure produced in Example 1 with a spray coater and drying,
The resin film (3) having the above-mentioned sponge structure is laminated,
After curing for 8 hours and bonding, a polishing cloth was obtained. Using this polishing cloth, the silicon wafer was polished at a low pressure. As a result, a polishing result with extremely excellent flatness, which could not be obtained with a conventional polishing cloth made of a nonwoven fabric substrate, could be obtained.
【0019】[実施例3]繊度50デニール、織密度、
経112本/インチ、緯98本/インチのポリエステル
長繊維織物を精錬加工、弗素処理、熱セット処理した基
材の片面に、予めウレタン樹脂16%、DMF83%、
顔料0.995%、活性剤0.005%に調液した樹脂
液を、ナイフオーバーロール法にて塗布し、直ちに水中
に浸漬、凝固、水洗、乾燥し、形成したウレタン樹脂膜
の表皮をベルトサンダーにて研削した后、基材より剥離
し、ショアー硬度68度のタテ型発泡構造のウレタン樹
脂膜(1)を得た。Example 3 Fineness 50 denier, woven density,
A polyester long-fiber woven fabric having a warp of 112 fibers / inch and a weft of 98 fibers / inch is subjected to refining, fluorine treatment and heat setting treatment on one side of a base material in advance, urethane resin 16%, DMF 83%,
A resin solution prepared with 0.995% pigment and 0.005% activator was applied by knife over roll method, immediately immersed in water, solidified, washed and dried, and the skin of the formed urethane resin film was belted. After grinding with a sander, the film was peeled off from the substrate to obtain a urethane resin film (1) having a vertical foam structure with a Shore hardness of 68 degrees.
【0020】放射線架橋にて製造したポリプロピレン発
泡体を厚さ0.6mmにスライス加工し、ショアー硬度
60度、圧縮率6%、圧縮弾性率55%のスポンジ構造
の樹脂膜(3A)を得た。このスポンジ構造の樹脂膜
(3A)の片面にクロロプレン系接着剤(2)をナイフ
オーバーロールにて塗布し乾燥した后、上記タテ型発泡
構造のウレタン樹脂膜を貼合せ、研磨布を得た。この研
磨布を使用し、ハードディスク用基板であるアルミニウ
ム/ニッケル基板を研磨した結果、研磨傷のない、平坦
性の優れた研磨結果が得られた。The polypropylene foam produced by radiation crosslinking was sliced to a thickness of 0.6 mm to obtain a resin film (3A) having a sponge structure having a Shore hardness of 60 degrees, a compressibility of 6% and a compressive elasticity of 55%. . A chloroprene-based adhesive (2) was applied to one surface of the resin film (3A) having a sponge structure by a knife over roll and dried, and then the urethane resin film having a vertical foam structure was attached to obtain a polishing cloth. As a result of polishing the aluminum / nickel substrate, which is a substrate for a hard disk, using this polishing cloth, a polishing result excellent in flatness without polishing scratches was obtained.
【0021】[0021]
【発明の効果】本発明による研磨布は厚さ、密度、硬
度、圧縮率、圧縮弾性率等の物性値のバラツキが非常に
小さく、たて型発泡構造が均質であるため、均一で安定
した研磨効果を発揮する。基材である樹脂膜(3)と研
磨スラリーを保持するタテ型発泡構造のウレタン樹脂膜
(1)とで硬さがショアー硬度3度以上15度以下の差
異をもっているため広い範囲の研磨条件に対応できる。
更に発塵性が非常に低いため、研磨傷の発生を防止する
ことが出来る。The polishing cloth according to the present invention has a very small variation in physical properties such as thickness, density, hardness, compressibility, compressive modulus and the like, and has a uniform vertical foam structure, so that it is uniform and stable. Exhibits a polishing effect. The hardness of the resin film (3) as the base material and the urethane resin film (1) of the vertical foam structure holding the polishing slurry differ from Shore hardness of 3 degrees to 15 degrees, so that it can be used in a wide range of polishing conditions. Can respond.
Further, since the dust generation is very low, it is possible to prevent the occurrence of polishing scratches.
【0022】本第2発明による研磨布は密度、硬度、圧
縮率、圧縮弾性率等の物性値を広い範囲にかえることが
出来るため、広い範囲の研磨条件に対応出来る。The polishing cloth according to the second aspect of the present invention can change physical properties such as density, hardness, compression ratio, compression elastic modulus and the like in a wide range, and can cope with a wide range of polishing conditions.
【0023】本第3発明による研磨布は研磨材の歪み等
による研磨面の歪みを防止し、安定した研磨効果を発揮
する。The polishing cloth according to the third aspect of the present invention prevents the polishing surface from being distorted due to the distortion of the polishing material and exhibits a stable polishing effect.
【図1】本発明の実施例による研磨布の断面図である。FIG. 1 is a cross-sectional view of a polishing cloth according to an embodiment of the present invention.
【図2】本発明の実施例2による研磨布の断面図であ
る。FIG. 2 is a sectional view of a polishing pad according to Embodiment 2 of the present invention.
1 タテ型発泡構造のウレタン樹脂膜 2 接着剤 3,3A 樹脂膜 1 Urethane resin film with vertical foam structure 2 Adhesive 3,3A resin film
Claims (3)
(1)に、ショアー硬度で3度以上15度以下の範囲で
前記ウレタン樹脂膜(1)の硬度と硬さが異なる樹脂膜
(3)を、接着剤(2)を介して結合した研磨布。1. A resin film (3) having a hardness different from the hardness of the urethane resin film (1) in a range of 3 to 15 degrees in Shore hardness in a urethane resin film (1) having a vertical foam structure. ) Is bonded via an adhesive (2).
脂膜(3A)である請求項1記載の研磨布。2. The polishing cloth according to claim 1, wherein the resin film is a porous resin film having a sponge structure.
性を有する樹脂膜(3)である請求項1記載の研磨布。3. The polishing cloth according to claim 1, wherein the polishing pad is a resin film (3) having a compression elastic modulus of 30% or more and 95% or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8234297A JPH10249709A (en) | 1997-03-14 | 1997-03-14 | Polishing cloth |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8234297A JPH10249709A (en) | 1997-03-14 | 1997-03-14 | Polishing cloth |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10249709A true JPH10249709A (en) | 1998-09-22 |
Family
ID=13771903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8234297A Pending JPH10249709A (en) | 1997-03-14 | 1997-03-14 | Polishing cloth |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10249709A (en) |
Cited By (15)
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---|---|---|---|---|
WO2002090049A1 (en) * | 2001-05-09 | 2002-11-14 | Nihon Micro Coating Co., Ltd. | Abrasive foam sheet and production method thereof |
JP2005153053A (en) * | 2003-11-25 | 2005-06-16 | Fuji Spinning Co Ltd | Abrasive cloth and method for producing abrasive cloth |
JP2006175576A (en) * | 2004-12-24 | 2006-07-06 | Fujibo Holdings Inc | Polishing cloth |
US7192340B2 (en) | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
US7220475B2 (en) | 2003-06-03 | 2007-05-22 | Fuji Spinning Co., Ltd. | Polishing sheet and polishing work method |
JP2007260855A (en) * | 2006-03-29 | 2007-10-11 | Fujibo Holdings Inc | Polishing cloth for finishing |
JP2008142839A (en) * | 2006-12-11 | 2008-06-26 | Kao Corp | Manufacturing method of magnetic disk substrate |
JP2009083014A (en) * | 2007-09-28 | 2009-04-23 | Fujibo Holdings Inc | Polishing cloth |
KR101099886B1 (en) * | 2002-06-07 | 2011-12-28 | 프랙스에어 에스.티. 테크놀로지, 인코포레이티드 | Controlled permeable subpad |
CN102452041A (en) * | 2010-10-29 | 2012-05-16 | 三芳化学工业股份有限公司 | Adsorption gasket and manufacturing method thereof |
JP2021112819A (en) * | 2014-10-17 | 2021-08-05 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | CMP pad construction with composite material properties using an additional manufacturing process |
US11724362B2 (en) | 2014-10-17 | 2023-08-15 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US11772229B2 (en) | 2016-01-19 | 2023-10-03 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US11958162B2 (en) | 2014-10-17 | 2024-04-16 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
-
1997
- 1997-03-14 JP JP8234297A patent/JPH10249709A/en active Pending
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US7641540B2 (en) | 2000-12-01 | 2010-01-05 | Toyo Tire & Rubber Co., Ltd | Polishing pad and cushion layer for polishing pad |
US7192340B2 (en) | 2000-12-01 | 2007-03-20 | Toyo Tire & Rubber Co., Ltd. | Polishing pad, method of producing the same, and cushion layer for polishing pad |
US7329170B2 (en) | 2000-12-01 | 2008-02-12 | Toyo Tire & Rubber Co., Ltd. | Method of producing polishing pad |
CN100379522C (en) * | 2000-12-01 | 2008-04-09 | 东洋橡膠工业株式会社 | Polishing pad, manufacturing method thereof, and buffer layer for polishing pad |
JP2008168433A (en) * | 2000-12-01 | 2008-07-24 | Toyo Tire & Rubber Co Ltd | Polishing pad, method for producing the same, and cushion layer for polishing pad |
US7762870B2 (en) | 2000-12-01 | 2010-07-27 | Toyo Tire & Rubber Co., Ltd | Polishing pad and cushion layer for polishing pad |
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KR100778607B1 (en) * | 2001-05-09 | 2007-11-22 | 니혼 미크로 코팅 가부시끼 가이샤 | Polishing foam sheet and its manufacturing method |
KR101099886B1 (en) * | 2002-06-07 | 2011-12-28 | 프랙스에어 에스.티. 테크놀로지, 인코포레이티드 | Controlled permeable subpad |
US7220475B2 (en) | 2003-06-03 | 2007-05-22 | Fuji Spinning Co., Ltd. | Polishing sheet and polishing work method |
JP2005153053A (en) * | 2003-11-25 | 2005-06-16 | Fuji Spinning Co Ltd | Abrasive cloth and method for producing abrasive cloth |
JP2006175576A (en) * | 2004-12-24 | 2006-07-06 | Fujibo Holdings Inc | Polishing cloth |
JP2007260855A (en) * | 2006-03-29 | 2007-10-11 | Fujibo Holdings Inc | Polishing cloth for finishing |
JP2008142839A (en) * | 2006-12-11 | 2008-06-26 | Kao Corp | Manufacturing method of magnetic disk substrate |
JP2009083014A (en) * | 2007-09-28 | 2009-04-23 | Fujibo Holdings Inc | Polishing cloth |
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JP2021112819A (en) * | 2014-10-17 | 2021-08-05 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | CMP pad construction with composite material properties using an additional manufacturing process |
US11446788B2 (en) | 2014-10-17 | 2022-09-20 | Applied Materials, Inc. | Precursor formulations for polishing pads produced by an additive manufacturing process |
US11724362B2 (en) | 2014-10-17 | 2023-08-15 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US11958162B2 (en) | 2014-10-17 | 2024-04-16 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US11772229B2 (en) | 2016-01-19 | 2023-10-03 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
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