[go: up one dir, main page]

JP7043346B2 - 切削装置 - Google Patents

切削装置 Download PDF

Info

Publication number
JP7043346B2
JP7043346B2 JP2018096174A JP2018096174A JP7043346B2 JP 7043346 B2 JP7043346 B2 JP 7043346B2 JP 2018096174 A JP2018096174 A JP 2018096174A JP 2018096174 A JP2018096174 A JP 2018096174A JP 7043346 B2 JP7043346 B2 JP 7043346B2
Authority
JP
Japan
Prior art keywords
holding
cutting
jig
face
cutting blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018096174A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019198944A (ja
Inventor
欣浩 楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2018096174A priority Critical patent/JP7043346B2/ja
Priority to KR1020190045283A priority patent/KR102681934B1/ko
Priority to TW108116728A priority patent/TWI797333B/zh
Priority to CN201910426869.5A priority patent/CN110497270B/zh
Publication of JP2019198944A publication Critical patent/JP2019198944A/ja
Application granted granted Critical
Publication of JP7043346B2 publication Critical patent/JP7043346B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
    • B23D45/02—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage
    • B23D45/021—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a circular saw blade or the stock mounted on a carriage with the saw blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0042—Devices for removing chips
    • B23Q11/0046—Devices for removing chips by sucking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0092—Grinding attachments for lathes or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/01—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor for combined grinding of surfaces of revolution and of adjacent plane surfaces on work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Dicing (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Confectionery (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
JP2018096174A 2018-05-18 2018-05-18 切削装置 Active JP7043346B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018096174A JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置
KR1020190045283A KR102681934B1 (ko) 2018-05-18 2019-04-18 절삭 장치
TW108116728A TWI797333B (zh) 2018-05-18 2019-05-15 切割裝置
CN201910426869.5A CN110497270B (zh) 2018-05-18 2019-05-16 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018096174A JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置

Publications (2)

Publication Number Publication Date
JP2019198944A JP2019198944A (ja) 2019-11-21
JP7043346B2 true JP7043346B2 (ja) 2022-03-29

Family

ID=68585726

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018096174A Active JP7043346B2 (ja) 2018-05-18 2018-05-18 切削装置

Country Status (4)

Country Link
JP (1) JP7043346B2 (ko)
KR (1) KR102681934B1 (ko)
CN (1) CN110497270B (ko)
TW (1) TWI797333B (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7361595B2 (ja) * 2019-12-19 2023-10-16 株式会社ディスコ 保持テーブル
CN113017241B (zh) * 2021-03-17 2023-08-25 安徽三和刷业股份有限公司 一种刷板自动分切打磨一体化装置
CN113909579A (zh) * 2021-11-04 2022-01-11 扬州市金马机电制造有限公司 一种具有工件固定结构的切割机

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050268763A1 (en) 2001-08-24 2005-12-08 Peng Neo C Method and apparatus for cutting semiconductor wafers
JP2009297855A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd フランジの端面修正方法
JP2011011299A (ja) 2009-07-02 2011-01-20 Disco Abrasive Syst Ltd マウントフランジの端面修正方法
JP2011255458A (ja) 2010-06-09 2011-12-22 Disco Corp 切削加工装置
JP2012223848A (ja) 2011-04-19 2012-11-15 Disco Corp フランジの端面修正方法
JP2013198944A (ja) 2012-03-23 2013-10-03 Toshiba Corp ダイシング装置及びダイシング方法
JP2016162973A (ja) 2015-03-04 2016-09-05 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2017152442A (ja) 2016-02-22 2017-08-31 株式会社ディスコ 加工方法
JP2018037511A (ja) 2016-08-31 2018-03-08 株式会社ディスコ 基板の分割方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19814805A1 (de) * 1998-04-02 1999-10-07 Bosch Gmbh Robert Beschichtungsverfahren eines Wischergummis
JP5350908B2 (ja) * 2009-06-24 2013-11-27 株式会社ディスコ ドレスボード保持テーブルおよび切削装置
JP5285672B2 (ja) * 2010-09-07 2013-09-11 三菱重工業株式会社 歯車研削盤
JP2012096274A (ja) * 2010-11-04 2012-05-24 Disco Corp レーザー加工装置
JP5996260B2 (ja) * 2012-05-09 2016-09-21 株式会社ディスコ 被加工物の分割方法
JP6087565B2 (ja) * 2012-10-03 2017-03-01 株式会社ディスコ 研削装置および研削方法
JP6527034B2 (ja) * 2015-06-29 2019-06-05 株式会社ディスコ 端面接触確認器具
JP6832666B2 (ja) * 2016-09-30 2021-02-24 株式会社ディスコ 半導体パッケージの製造方法
JP6791581B2 (ja) * 2016-11-11 2020-11-25 株式会社ディスコ パッケージ基板切断用治具テーブル

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050268763A1 (en) 2001-08-24 2005-12-08 Peng Neo C Method and apparatus for cutting semiconductor wafers
JP2009297855A (ja) 2008-06-16 2009-12-24 Disco Abrasive Syst Ltd フランジの端面修正方法
JP2011011299A (ja) 2009-07-02 2011-01-20 Disco Abrasive Syst Ltd マウントフランジの端面修正方法
JP2011255458A (ja) 2010-06-09 2011-12-22 Disco Corp 切削加工装置
JP2012223848A (ja) 2011-04-19 2012-11-15 Disco Corp フランジの端面修正方法
JP2013198944A (ja) 2012-03-23 2013-10-03 Toshiba Corp ダイシング装置及びダイシング方法
JP2016162973A (ja) 2015-03-04 2016-09-05 Ｔｏｗａ株式会社 製造装置及び製造方法
JP2017152442A (ja) 2016-02-22 2017-08-31 株式会社ディスコ 加工方法
JP2018037511A (ja) 2016-08-31 2018-03-08 株式会社ディスコ 基板の分割方法

Also Published As

Publication number Publication date
KR102681934B1 (ko) 2024-07-04
TW202003149A (zh) 2020-01-16
TWI797333B (zh) 2023-04-01
CN110497270A (zh) 2019-11-26
JP2019198944A (ja) 2019-11-21
KR20190132203A (ko) 2019-11-27
CN110497270B (zh) 2023-04-25

Similar Documents

Publication Publication Date Title
US10297488B2 (en) Workpiece support jig
KR102228487B1 (ko) 피가공물의 절삭 방법
KR20190134467A (ko) 반송용 지그 및 절삭 블레이드의 교환 방법
JP5717571B2 (ja) 切削装置
JP7043346B2 (ja) 切削装置
JP2017152442A (ja) 加工方法
JP5340832B2 (ja) マウントフランジの端面修正方法
KR20210123212A (ko) 절삭 장치
JP5975723B2 (ja) 切削装置
JP2018060912A (ja) 加工方法
TW202305923A (zh) 加工裝置
JP6486785B2 (ja) 端面修正治具および端面修正方法
JP7060943B2 (ja) 切削装置
JP6305245B2 (ja) チャックテーブル
TWI827831B (zh) 附基台刀片
JP7152882B2 (ja) 被加工物ユニットの保持方法
CN106997864B (zh) 卡盘工作台
JP6812079B2 (ja) 被加工物の加工方法
TW202110573A (zh) 法蘭盤端面修正裝置、切斷裝置、法蘭盤端面修正方法以及切斷品的製造方法
JP3222726U (ja) 切削装置
JP7126751B2 (ja) 被加工物の研削方法
JP6934395B2 (ja) 分割装置及び分割方法
JP6736217B2 (ja) 切削装置
JP2024137795A (ja) 切削ブレード、マウンタ及びブレードユニット
TW202116482A (zh) 切割裝置之卡盤台

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210302

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20220131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220222

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220316

R150 Certificate of patent or registration of utility model

Ref document number: 7043346

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250