JP6023196B2 - Inspection head, working device, and electronic component mounting line - Google Patents

Description

  The present specification relates to an inspection head, a working device, and an electronic component mounting line.

  Japanese Patent Application Laid-Open No. 2011-243484 describes a technique that allows one working device incorporated in an electronic component mounting line to operate as a surface mounter or as an inspection machine. In this technique, the work device can be operated as a surface mounter by attaching a mounting head as a work head of the work device and further attaching a feeder device to the work device. In this technique, the work head attached to the work device is replaced from the mounting head to the inspection head, and the feeder device attached to the work device is replaced with an inspection computer, thereby operating the work device as an inspection machine. Can do. According to this technique, since one working device can be used as a surface mounter or an inspection machine, the electronic component mounting line can be easily recombined.

  In the technique described in Japanese Patent Application Laid-Open No. 2011-243484, when rearranging the working device from the surface mounter to the inspection machine, it is necessary to replace the mounting head with the inspection head and further replace the feeder device with the inspection computer. Recombination work requires time and effort. Even when the work device is recombined from the inspection machine to the surface mounting machine, it is necessary to replace the inspection head with the mounting head, and further to replace the inspection computer with the feeder device, which requires time and labor for the recombination work. A technology that can perform the recombination work from the surface mounter to the inspection machine and the recombination work from the inspection machine to the surface mounter with less effort is expected.

  The present specification discloses an inspection head for inspecting a surface state of a substrate that can be attached as a work head to a working device for performing work on the substrate. The inspection head captures image data and inspection reference data acquired from the camera in accordance with a camera that shoots a substrate and acquires image data, a storage medium that can store an inspection processing program and inspection reference data, and an inspection processing program. And a control unit that executes an inspection process based on the control unit.

  By attaching the inspection head as described above to the work apparatus as a work head, the work apparatus can be operated as an inspection machine without separately attaching an inspection computer. Therefore, when the work device is rearranged from the surface mounter to the inspection machine, the work of replacing the feeder device with the inspection computer is not required. Furthermore, when the work device is rearranged from the inspection machine to the surface mounter, the work of removing the inspection computer is not required. By using the inspection head as described above, the recombination work from the surface mounting machine to the inspection machine and the recombination work from the inspection machine to the surface mounting machine can be performed with less effort.

  The inspection head may be configured such that the control unit can communicate with a computer external to the work device and output inspection result data indicating the inspection result to a computer external to the work device. .

  The inspection head may be configured to further include photographing illumination that irradiates the substrate with photographing light.

  The present specification also discloses a working device in which the inspection head is attached as a working head. Furthermore, the present specification also discloses an electronic component mounting line in which the above-described working device is arranged on the downstream side of a working device in which a mounting head for mounting an electronic component on a substrate is attached as a working head.

  Details of the technology disclosed in this specification will be described in the following embodiments of the invention.

It is a figure which shows the structure of the electronic component mounting line 2 of an Example. It is a block diagram which shows the structure of the working device 6 of an Example. It is a cross-sectional view which shows the outline of the mechanical structure of the working device 6 of an Example. It is a block diagram which shows the structure of the working apparatus 10 of an Example.

(Example)
The electronic component mounting line 2 shown in FIG. 1 mainly includes a screen printing machine 4, a plurality of work devices 6, 8, 10, a reflow furnace 12, and a main controller 14. The screen printer 4 screen-prints cream solder on the substrate. The work devices 6, 8, and 10 perform mounting of electronic components on the substrate and inspection of the surface state of the substrate. The reflow furnace 12 heats the substrate to melt the cream solder. The main controller 14 controls the operation of each device of the electronic component mounting line 2 including the screen printing machine 4, the work devices 6, 8, 10 and the reflow furnace 12.

  The work devices 6, 8, and 10 are modularized, and can be operated as a surface mounter or an inspection machine by changing the type of the work head. As an example, in this embodiment, a case will be described in which the working devices 6 and 8 operate as a surface mounter that mounts electronic components on a substrate, and the working device 10 operates as an inspection machine that inspects the surface state of the substrate.

  As shown in FIG. 2, the working device 6 that is a surface mounting machine includes a mounting head 30, a holder 20, a holder driving device 22, a feeder device 24, a substrate transfer device 26, and a module controller 28. . The substrate transfer device 26 carries in the substrate from the upstream production device (screen printer 4 in the case of the work device 6) and holds the substrate at the work position, and then the downstream production device (of the work device 6). In this case, the substrate is carried out to the working device 8). The feeder device 24 supplies electronic components to be mounted on the board. The feeder device 24 is detachable from the working device 6. A working head such as a mounting head 30 or an inspection head 32 described later can be attached to the holder 20. In the present embodiment, since the working device 6 operates as a surface mounter, a mounting head 30 is attached to the holder 20.

  The mounting head 30 includes a nozzle 34, a nozzle driving device 36, an attachment / detachment switching device 38, and a head controller 40. The nozzle 34 sucks an electronic component by generating a negative pressure at its tip, and releases the suction of the electronic component by generating a positive pressure at its tip. The nozzle driving device 36 adjusts the relative position and posture of the nozzle 34 with respect to the holder 20. The attachment / detachment switching device 38 switches between attachment / detachment of electronic components to / from the nozzle 34 by switching between a state in which the negative pressure path communicates with the tip of the nozzle 34 and a state in which the positive pressure path communicates with the tip of the nozzle 34. The head controller 40 controls the operation of the nozzle driving device 36 and the attachment / detachment switching device 38.

  As shown in FIG. 3, the holder driving device 22 reciprocates the holder 20 between the feeder device 24 and the substrate transfer device 26. The mounting head 30 is moved above the feeder device 24, the electronic component at the component supply position is attracted to the tip of the nozzle 34, and then the mounting head 30 is moved above the substrate transport device 26 to be at the component mounting position. By detaching the electronic component from the tip of the nozzle 34, the electronic component can be mounted on the substrate.

  The module controller 28 in FIG. 2 controls operations of the mounting head 30, the holder driving device 22, the feeder device 24, and the substrate transfer device 26. The module controller 28 can communicate with the head controller 40 via a communication line such as a serial bus, a wired LAN, or a wireless LAN. The head controller 40 can communicate with the main controller 14 via a communication line such as a wired LAN or a wireless LAN. The module controller 28 reads a production job from the main controller 14 and controls the operation of the work device 6 according to the read production job. Further, the module controller 28 transmits the work status and the like in the work device 6 to the main controller 14.

  As shown in FIG. 4, the working device 10 that is an inspection machine includes an inspection head 32, a holder 20, a holder driving device 22, a substrate transport device 26, and a module controller 28. The configurations of the holder 20, the holder driving device 22, the substrate transfer device 26, and the module controller 28 are the same as those of the work device 6. In the present embodiment, since the working device 10 operates as an inspection machine, an inspection head 32 is attached to the holder 20 as a work head.

  The inspection head 32 includes a camera 42, a photographing illumination 44, and a head controller 46 (corresponding to a control unit). The camera 42 images the substrate held at the work position by the substrate transfer device 26 and outputs image data to the head controller 46. The photographing illumination 44 irradiates the substrate held at the work position by the substrate transport device 26 with photographing light. The head controller 46 controls the operation of the camera 42 and the photographing illumination 44.

  The head controller 46 includes a CPU, ROM, RAM, flash memory, and the like. An inspection processing program and inspection reference data are stored in advance in the ROM, RAM, flash memory, and the like (corresponding to a storage medium) of the head controller 46. The head controller 46 can communicate with the module controller 28 via a communication line such as a serial bus, a wired LAN, or a wireless LAN. Further, the head controller 46 can communicate with the main controller 14 (corresponding to a computer outside the work apparatus 10) via a communication line such as a wired LAN or a wireless LAN. The module controller 28 reads a production job from the main controller 14 and controls the operation of the work apparatus 10 according to the read production job. The head controller 46 controls the camera 42 and the photographing illumination 44 to acquire image data, and performs substrate inspection processing based on the acquired image data and inspection reference data. In the inspection process performed by the head controller 46, for example, image data acquired by the camera 42 is compared with inspection reference data indicating an image of a non-defective substrate, and whether or not the solder printed on the substrate is shifted or missing, the substrate It is possible to determine whether there is a shortage of electronic components mounted on the device, the presence / absence of a position / angle shift, the presence / absence of foreign matter, and the like. The head controller 46 transmits inspection result data indicating the inspection result to the main controller 14. The head controller 46 may be configured to transmit the inspection result data for each substrate each time. Alternatively, the head controller 46 may aggregate the inspection results for a plurality of substrates and transmit the totaled inspection result data. You may comprise.

  In the inspection head 32 of the present embodiment, the head controller 46 stores an inspection processing program and inspection reference data, performs inspection processing based on image data and inspection reference data obtained from the camera 42, and outputs inspection result data. Transmit to the main controller 14. Therefore, it is not necessary to transmit / receive large-capacity image data between the inspection head 32 and the main controller 14 or between the inspection head 32 and the module controller 28. For this reason, the load on the communication line between the inspection head 32 and the main controller 14 or between the inspection head 32 and the module controller 28 can be reduced. Further, it is possible to reduce the load of communication processing in the main controller 14 and the module controller 28 and to stabilize the operation of these controllers. Furthermore, since the transmission path of the image data is short, the image data to be inspected is hardly affected by noise and signal deterioration, and the reliability of the inspection process can be improved. The inspection processing program and inspection reference data stored in the head controller 46 can be rewritten from the main controller 14.

  The head controller 46 may read the production job from the main controller 14, and the head controller 46 may be configured to control the operation of each unit of the production apparatus 10 via the module controller 28.

  In the electronic component mounting line 2, there are cases where it is desired to change the arrangement of the surface mounting machine and the inspection machine. In such a case, in the working devices 6, 8, and 10 of this embodiment, recombination from the surface mounter to the inspection machine and recombination from the inspection machine to the surface mounter can be easily performed.

  For example, when the work device 8 is changed from a surface mounter to an inspection machine, the mounting head 30 attached to the holder 20 is replaced with an inspection head 32. Thereby, the working device 8 can be operated as an inspection machine. Note that the feeder device 24 attached when the working device 8 is operated as a surface mounter does not affect the operation as an inspection machine, and therefore may be left attached to the working device 8 or removed. Good. Or you may utilize as a stand of the feeder apparatus 24, or an adjustment stand. According to the present embodiment, the working device 8 can be rearranged from the surface mounter to the inspection machine by a simple replacement work.

  When the work apparatus 10 is changed from an inspection machine to a surface mounting machine, the inspection head 32 attached to the holder 20 is replaced with the mounting head 30. In addition, a feeder device 24 for supplying electronic components to be mounted on the substrate is newly attached to the work device 10. According to the present embodiment, the working device 10 can be rearranged from the inspection machine to the surface mounting machine by a simple replacement work.

  Representative and non-limiting specific examples of the present invention have been described in detail with reference to the drawings. This detailed description is intended merely to present those skilled in the art with the details for practicing the preferred embodiments of the present invention and is not intended to limit the scope of the invention. In addition, the disclosed additional features and inventions can be used separately from or in conjunction with other features and inventions to provide further improved inspection heads, work devices, and electronic component mounting lines.

  Further, the combinations of features and steps disclosed in the above detailed description are not indispensable when practicing the present invention in the broadest sense, and are only for explaining representative specific examples of the present invention. It is described. Moreover, various features of the representative embodiments described above, as well as various features of those set forth in the independent and dependent claims, are described herein in providing additional and useful embodiments of the invention. They do not have to be combined in the specific examples or in the order listed.

  All features described in this specification and / or claims, apart from the configuration of the features described in the examples and / or claims, are individually disclosed as limitations on the original disclosure and claimed specific matters. And are intended to be disclosed independently of each other. Further, all numerical ranges and group or group descriptions are intended to disclose intermediate configurations thereof as a limitation to the original disclosure and claimed subject matter.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

Claims (5)

An inspection head for inspecting a surface state of a substrate that can be attached as a work head to a working device for performing work on the substrate,
A camera that captures image data by photographing the substrate;
A storage medium capable of storing an inspection processing program and inspection reference data;
A first control unit that executes inspection processing based on image data acquired from the camera and inspection reference data in accordance with the inspection processing program;
The working device has a second control unit for controlling the operation with respect to the substrate of this the working device,
The first control unit can communicate with a computer outside the work device and the second control unit,
The first control unit can communicate with the second control unit without going through a computer outside the work device,
The first control unit reads a production program for the work device stored in a computer outside the work device, and outputs output information based on the production program for the work device to a computer outside the work device. An inspection head configured to control the operation of the working device by outputting to the second control unit without intervention.   The inspection head according to claim 1, wherein the first control unit outputs inspection result data indicating an inspection result to a computer outside the work apparatus.   The inspection head according to claim 1, further comprising a photographing illumination for irradiating the substrate with photographing light.   A working apparatus to which the inspection head according to claim 1 is attached as a working head. An electronic component mounting line in which the working device according to claim 4 is arranged downstream of a working device in which a mounting head for mounting an electronic component on a substrate is attached as a working head.

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