CN104472031A - Inspection head, work apparatus, and electronic-component mounting line - Google Patents
Inspection head, work apparatus, and electronic-component mounting line Download PDFInfo
- Publication number
- CN104472031A CN104472031A CN201280074753.6A CN201280074753A CN104472031A CN 104472031 A CN104472031 A CN 104472031A CN 201280074753 A CN201280074753 A CN 201280074753A CN 104472031 A CN104472031 A CN 104472031A
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- CN
- China
- Prior art keywords
- work
- inspection
- head
- substrate
- check
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Provided is a feature capable of decreasing the labor required to perform an operation for reconfiguring from a surface-mounting apparatus of a work apparatus to an inspection apparatus thereof, and an operation for reconfiguring from the inspection apparatus thereof to the surface-mounting apparatus thereof. The description of the present application discloses an inspection head for inspecting the surface state of a substrate and capable of attachment as a work head to a work apparatus for performing work on the substrate. This inspection head incorporates the following therein: a camera for imaging the substrate and obtaining image data; a recording medium capable of recording an inspection processing program and inspection reference data; and a control unit for executing the inspection processing on the basis of the image data obtained from the camera and the inspection reference data, and in accordance with the inspection processing program.
Description
Technical field
This specification relates to inspection head, apparatus for work and electronic component mounting production line.
Background technology
Following technology is described: the apparatus for work action as surface mounting apparatus enabling to be encased in electronic component mounting production line, or the action as inspection machine in Japanese Unexamined Patent Publication 2011-243884 publication.In the art, the operation head of mounting head as apparatus for work is installed, and to apparatus for work, loader device is installed, apparatus for work action as surface mounting apparatus can be made thus.And, in the art, the operation head being installed on apparatus for work is replaced by inspection head from mounting head, and the loader device being installed on apparatus for work is replaced by inspection computer, apparatus for work action as inspection machine can be made thus.According to this technology, an apparatus for work can use as surface mounting apparatus, also can use as inspection machine, therefore, it is possible to easily carry out the replacing of electronic component mounting production line.
Summary of the invention
In the technology that Japanese Unexamined Patent Publication 2011-243884 publication is recorded, when apparatus for work is replaced by inspection machine from surface mounting apparatus, need mounting head to be replaced by the operation checking head and loader device is replaced by inspection computer, changing operation needs time and manpower.When apparatus for work is replaced by surface mounting apparatus from inspection machine, also need inspection to be changed to mounting head and inspection computer to be replaced by the operation of loader device first watch, changing operation needs time and manpower.Expect a kind of technology can carrying out the replacing operation from surface mounting apparatus to inspection machine and the replacing operation from inspection machine to surface mounting apparatus with less manpower.
Subject description discloses a kind of apparatus for work that can be installed on for carrying out operation to substrate as operation head to check the inspection head of the surface state of substrate.This inspection head is equipped with: camera, takes substrate and obtains view data; Storage medium, can store check processing program and check reference data; And control part, according to check processing program, perform check processing based on the view data obtained from camera and inspection reference data.
By inspection head as described above is installed on apparatus for work as operation head, need not installation check computer separately, apparatus for work can be made to carry out action as inspection machine.Therefore, when being changed from surface mounting apparatus to inspection machine by apparatus for work, do not need the operation changed to inspection computer by loader device.And, when being changed from inspection machine to surface mounting apparatus by apparatus for work, do not need the operation of being pulled down by inspection computer.By using inspection head as described above, can carry out from the surface mounting apparatus of apparatus for work to the replacing operation of inspection machine and the replacing operation from inspection machine to surface mounting apparatus with less manpower.
Above-mentioned inspection head can be configured to, and above-mentioned control part can communicate with the computer of the outside of above-mentioned apparatus for work, and will represent the computer export of inspection result data to the outside of above-mentioned apparatus for work of check result.
Above-mentioned inspection head can be configured to, and is also equipped with the illumination for shooting of irradiating light for shooting to substrate.
This specification also discloses and is provided with the apparatus for work of above-mentioned inspection head as operation head.And this specification also discloses and is being provided with the mounting head to substrate installing electronic elements and is configured with as the downstream of the apparatus for work of operation head the electronic component mounting production line of above-mentioned apparatus for work.
The detailed content of technology disclosed in this specification is described by following working of an invention mode.
Accompanying drawing explanation
Fig. 1 is the figure of the structure of the electronic component mounting production line 2 representing embodiment.
Fig. 2 is the block diagram of the structure of the apparatus for work 6 representing embodiment.
Fig. 3 is the transverse sectional view of the outline of the mechanical structure of the apparatus for work 6 representing embodiment.
Fig. 4 is the block diagram of the structure of the apparatus for work 10 representing embodiment.
Embodiment
(embodiment)
Electronic component mounting production line 2 shown in Fig. 1 mainly possess screen process press 4, multiple apparatus for work 6,8,10, reflow ovens 12, master controller 14.Cream solder is carried out silk screen printing to substrate by screen process press 4.Apparatus for work 6,8,10 carries out the inspection of electronic component to the surface state of the installation of substrate or substrate.Reflow ovens 12 pairs of substrates heat and cream solder are melted.Master controller 14 to comprise screen process press 4, apparatus for work 6,8,10, the action of each device of the electronic component mounting production line 2 of reflow ovens 12 controls.
Apparatus for work 6,8,10, by modularization, by the kind of change operation head, both can carry out action as surface mounting apparatus, also can carry out action as inspection machine.As an example, in the present embodiment, illustrates that apparatus for work 6,8 carries out action as the surface mounting apparatus to substrate installing electronic elements and apparatus for work 10 carries out the situation of action as the inspection machine of surface state of inspection substrate.
As shown in Figure 2, the apparatus for work 6 as surface mounting apparatus possesses mounting head 30, retainer 20, retainer drive unit 22, loader device 24, substrate transfer apparatus 26, module controller 28.Substrate transfer apparatus 26 moves into the substrate of the process units (being screen process press 4 when apparatus for work 6) from upstream side, after substrate is held in job position, the process units (being apparatus for work 8 when apparatus for work 6) to downstream takes out of substrate.Loader device 24 supplies the electronic component installed to substrate.Loader device 24 can load and unload relative to apparatus for work 6.The operation heads such as mounting head 30 or inspection described later 32 can be installed on retainer 20.In the present embodiment, apparatus for work 6 carries out action as surface mounting apparatus, therefore mounting head 30 is installed on retainer 20.
Mounting head 30 possesses suction nozzle 34, suction nozzle drive unit 36, handling switching device shifter 38, head controller 40.Suction nozzle 34 carrys out stick electronic components by producing negative pressure in its front end, by removing the absorption to electronic component in its front end generation malleation.Suction nozzle drive unit 36 adjusts suction nozzle 34 relative to the relative position of retainer 20 and posture.Handling switching device shifter 38 is communicated with between the state in negative pressure path to be communicated with malleation path state with the front end of suction nozzle 34 in the front end of suction nozzle 34 and switches, and switches the handling of electronic component relative to suction nozzle 34 thus.Head controller 40 controls the action of suction nozzle drive unit 36 and handling switching device shifter 38.
As shown in Figure 3, retainer drive unit 22 makes retainer 20 reciprocating action between loader device 24 and substrate transfer apparatus 26.Mounting head 30 is moved to the top of loader device 24, the electronic component being in component feeding position is adsorbed in the front end of suction nozzle 34, then mounting head 30 is made to move to the top of substrate transfer apparatus 26, make at component installation location place electronic component depart from from the front end of suction nozzle 34, the installation of electronic component to substrate can be carried out thus.
The action of module controller 28 pairs of mounting heads 30 of Fig. 2, retainer drive unit 22, loader device 24, substrate transfer apparatus 26 controls.Module controller 28 can be communicated with head controller 40 by communication loops such as universal serial bus, wired lan, WLAN.Head controller 40 can be communicated with master controller 14 by the communication loop such as wired lan or WLAN.Module controller 28 reads production operation from master controller 14, controls the action of apparatus for work 6 according to the production operation read.And module controller 28 sends the situation etc. of the operation of apparatus for work 6 to master controller 14.
As shown in Figure 4, as the apparatus for work 10 of inspection machine possess check 32, retainer 20, retainer drive unit 22, substrate transfer apparatus 26, module controller 28.The structure of retainer 20, retainer drive unit 22, substrate transfer apparatus 26, module controller 28 is same with apparatus for work 6.In the present embodiment, apparatus for work 10 carries out action as inspection machine, therefore inspection 32 is installed on retainer 20 as operation head.
Check that 32 possess camera 42, illumination for shooting 44, head controller 46 (being equivalent to control part).The substrate remained on by substrate transfer apparatus 26 on job position taken by camera 42, and view data exported to head controller 46.Illumination 44 for shooting irradiates light for shooting to the substrate being held in job position by substrate transfer apparatus 26.The action of head controller 46 pairs of cameras 42 and illumination for shooting 44 controls.
Head controller 46 possesses CPU, ROM, RAM, flash memory etc.In ROM, the RAM, flash memory etc. (being equivalent to storage medium) of head controller 46, be previously stored with check processing program and check reference data.Head controller 46 can be communicated with module controller 28 by communication loops such as universal serial bus, wired lan, WLAN.And head controller 46 can be communicated with master controller 14 (being equivalent to the computer of the outside of apparatus for work 10) by the communication loop such as wired lan or WLAN.Module controller 28 reads production operation from master controller 14, controls the action of apparatus for work 10 according to the production operation read.Head controller 46 pairs of cameras 42 and illumination for shooting 44 carry out control to obtain view data, and implement the check processing of substrate based on the view data obtained and inspection reference data.In the check processing that head controller 46 carries out, such as by the view data obtained by camera 42 is compared with representing as the inspection reference data of the image of the substrate of qualified product, can to the solder be printed onto on substrate with or without skew or defect, be installed to electronic component on substrate with or without disappearance or position/angles deviation, have foreign etc. to judge.Head controller 46 will represent that the inspection result data of check result sends to master controller 14.In addition, the inspection result data for each substrate can send by head controller 46 at every turn respectively, also the check result for multiple substrate can be carried out gather and send the inspection result data after aggregation process.
In the inspection of the present embodiment 32, head controller 46 stores check processing program and checks reference data, based on the view data obtained from camera 42 with check that reference data implements check processing, and inspection result data is sent to master controller 14.Therefore, in inspection between 32 and master controller 14 or check between 32 and module controller 28, without the need to receiving and dispatching jumbo view data.Therefore, it is possible to alleviate the load checking between 32 and master controller 14 or check the communication loop between 32 and module controller 28.And, the load of communication process of master controller 14, module controller 28 can be alleviated, make the having stable behavior of these controllers.And the transfer path of view data can shorten, the view data therefore becoming the object of check processing is difficult to the impact being subject to noise, Signal Degrade, can improve the reliability of check processing.Be stored in the check processing program of head controller 46 and check that reference data can be rewritten from master controller 14.
In addition, Ke Yishi, head controller 46 reads production operation from master controller 14, and head controller 46 carrys out the action of each several part of production control device 10 by module controller 28.
In electronic component mounting production line 2, sometimes want the configuration of changing surface mounting apparatus and inspection machine.Under these circumstances, in the apparatus for work 6,8,10 of the present embodiment, easily can carry out the replacing from surface mounting apparatus to inspection machine, from inspection machine to the replacing of surface mounting apparatus.
Such as, when apparatus for work 8 is changed from surface mounting apparatus to inspection machine, the mounting head 30 being installed on retainer 20 is replaced by and checks 32.Thereby, it is possible to make apparatus for work 8 action as inspection machine.In addition, impact to the action as inspection machine at the loader device 24 making apparatus for work 8 install during action as surface mounting apparatus, therefore can intactly be installed on apparatus for work 8, also can pull down.Or can utilize as the mounting table of loader device 24 or adjustment platform.According to the present embodiment, by simply changing operation, apparatus for work 8 can be replaced by inspection machine from surface mounting apparatus.
When being changed from inspection machine to surface mounting apparatus by apparatus for work 10, the inspection 32 being installed on retainer 20 is replaced by mounting head 30.And the loader device 24 of electronic component supply should installed to substrate is reinstalled to apparatus for work 10.According to the present embodiment, by simply changing operation, apparatus for work 10 can be replaced by surface mounting apparatus from inspection machine.
About representativeness of the present invention and the concrete example of indefiniteness, be illustrated in detail with reference to accompanying drawing.This detailed description merely wants the details being used for implementing preferred example of the present invention to show to those skilled in the art, is not to limit scope of the present invention.And, disclosed additional feature and invention in order to provide inspection head, apparatus for work and electronic component mounting production line after improving further, can separate with other features or invent or together with use.
In addition, feature disclosed in above-mentioned detailed description, operation be combined in the most widely the meaning in be not implement the present invention be necessary, only in order to illustrate that representational concrete example of the present invention is recorded.And, the various features of the structure of the various feature of above-mentioned representational concrete example and independence and dependent claims record, when providing additional and useful execution mode of the present invention, are not must combine as the concrete example recorded at this or as enumerated sequentially.
Whole feature of recording of this specification and/or claim is different from the structure of the feature that embodiment and/or claim are recorded and be intended to as to apply for disclosing and the restriction of specific item of prescription originally, distinguishes and independently of each other openly.And, about the record of whole number range and group or group as the restriction of the specific item to application open and prescription originally, there is the intention of the structure of the centre disclosing them.
Above, although understand concrete example of the present invention in detail, they only illustrate, and do not limit the scope of claim.The technology that claims are recorded comprises the technology of above illustrative concrete example being carried out to various distortion, change.The technology essential factor illustrated in this specification or accompanying drawing separately or play technology serviceability by various combination, the combination that when not being defined as application, claim is recorded.And this specification or the technology illustrated in accompanying drawing can realize multiple object simultaneously, realize one of them object self and just to possess skills serviceability.
Claims (5)
1. check a head, the apparatus for work that can be installed on for carrying out operation to substrate as operation head, to check the surface state of substrate,
Described inspection head is equipped with:
Camera, takes substrate and obtains view data;
Storage medium, can store check processing program and check reference data; And
Control part, according to check processing program, performs check processing based on the view data obtained from camera and inspection reference data.
2. inspection head according to claim 1, wherein,
Described control part can communicate with the computer of the outside of described apparatus for work, and will represent the computer export of inspection result data to the outside of described apparatus for work of check result.
3. inspection head according to claim 1, wherein,
Described inspection head is also equipped with the illumination for shooting of irradiating light for shooting to substrate.
4. an apparatus for work, is provided with inspection head according to any one of claims 1 to 3 as operation head.
5. an electronic component mounting production line, is configured with apparatus for work according to claim 4 as the downstream of the apparatus for work of operation head being provided with the mounting head to substrate installing electronic elements.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/068231 WO2014013572A1 (en) | 2012-07-18 | 2012-07-18 | Inspection head, work apparatus, and electronic-component mounting line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104472031A true CN104472031A (en) | 2015-03-25 |
| CN104472031B CN104472031B (en) | 2017-08-15 |
Family
ID=49948427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280074753.6A Active CN104472031B (en) | 2012-07-18 | 2012-07-18 | Check head, apparatus for work and electronic component mounting production line |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6023196B2 (en) |
| CN (1) | CN104472031B (en) |
| WO (1) | WO2014013572A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557938A (en) * | 2018-05-30 | 2019-12-10 | 松下知识产权经营株式会社 | Component mounting device |
| CN110622632A (en) * | 2017-06-01 | 2019-12-27 | 雅马哈发动机株式会社 | Inspection result reporting method, inspection result reporting device, and component mounting system |
| CN112602385A (en) * | 2018-08-28 | 2021-04-02 | 株式会社富士 | Control program inspection device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019180861A1 (en) * | 2018-03-22 | 2019-09-26 | 株式会社Ｆｕｊｉ | Constitutive device quality determination server, inspection system, inspection system terminal device, and inspection device |
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| JP2012089552A (en) * | 2010-10-15 | 2012-05-10 | Fuji Mach Mfg Co Ltd | Component mounting system and component inspection method using the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5117479B2 (en) * | 2009-12-03 | 2013-01-16 | パナソニック株式会社 | Component mounting system |
| JP5773474B2 (en) * | 2010-05-20 | 2015-09-02 | 富士機械製造株式会社 | Component mounting system |
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- 2012-07-18 CN CN201280074753.6A patent/CN104472031B/en active Active
- 2012-07-18 WO PCT/JP2012/068231 patent/WO2014013572A1/en active Application Filing
- 2012-07-18 JP JP2014525605A patent/JP6023196B2/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110622632A (en) * | 2017-06-01 | 2019-12-27 | 雅马哈发动机株式会社 | Inspection result reporting method, inspection result reporting device, and component mounting system |
| CN110622632B (en) * | 2017-06-01 | 2021-04-13 | 雅马哈发动机株式会社 | Inspection result reporting method, inspection result reporting device, and component mounting system |
| CN110557938A (en) * | 2018-05-30 | 2019-12-10 | 松下知识产权经营株式会社 | Component mounting device |
| CN112602385A (en) * | 2018-08-28 | 2021-04-02 | 株式会社富士 | Control program inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6023196B2 (en) | 2016-11-09 |
| CN104472031B (en) | 2017-08-15 |
| JPWO2014013572A1 (en) | 2016-06-30 |
| WO2014013572A1 (en) | 2014-01-23 |
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Address after: Aichi Japan vertical city Patentee after: Fuji Corporation Address before: Aichi Japan vertical city Patentee before: Fuji Machinery Manufacturing Co., Ltd. |