JP4767995B2 - Component mounting method, component mounting machine, mounting condition determining method, mounting condition determining apparatus, and program - Google Patents

Description

  The present invention relates to a component mounting method for mounting a component on a substrate.

  A mounting board production system that produces a component mounting board with components mounted on the board is a printing machine that prints solder on the board, a component mounting machine that mounts parts on the printed board, and solders the mounted parts. It consists of a reflow machine.

  A board to be mounted by a component is transported through the mounting board production system by a series of conveyors and produced as a mounting board by a flow operation. That is, in each machine, each process of printing solder on the board, mounting a large number of components of various sizes on the board, and soldering is performed on the board. The mounting board is produced through a series of production processes by such machines. The mounting board produced in this way is mounted on a final product such as a home appliance.

  In the mounting board production system, a defective part mounting board may be produced. There are various causes of poor quality, and one of them is poor solder printing. For example, even if there is a defect in solder printing, executing a process following the board, that is, mounting a component and soldering, use of a mounting board production system, consumption of the component, etc. Cause waste.

  In order to reduce the production quantity of defective products and reduce the execution of useless processes in the mounting board production system, when a defect occurs in the middle of a series of production processes, technology that detects the occurrence of the defect early and takes measures Is effective.

Conventionally, a technique for inspecting a printed state with an inspection apparatus disposed in a subsequent process for a board on which solder is printed by a printing machine, and an inspection apparatus disposed in a subsequent process for a board on which components are mounted by a component mounting machine Inspecting the mounting state of the component by using a camera mounted on the component mounting machine, and also checking the printed state of the solder before mounting the component based on the image taken from above, and the position of the detected solder A technique for correcting the mounting position of a component based on a deviation has been proposed (see, for example, Patent Document 1). In addition, if the solder misalignment is so large that it cannot be dealt with by correction of the mounting position, it may be possible to remove the board from the passage and terminate the subsequent processes for the board by the same technique.
Japanese Patent No. 3656533

  However, if the inspection device is arranged between machines such as component mounting machines as in the above technology, the inspection accuracy is improved and the incidence of defective products is reduced, but the mounting board production system itself is long and the time required for inspection Will adversely affect throughput.

  In addition, a defect occurring in the same machine can be inspected only after the entire process in the machine is completed. For example, this is a case where a component falls on the substrate during mounting and an unnecessary portion is short-circuited. Note that even if a technique for inspecting the printing state with a camera provided in a component mounting machine as described in Patent Document 1 is used, it is not possible to detect a drop of a component being mounted.

  Furthermore, a fine component may fall during mounting, and the fine component may be sandwiched between a relatively large component such as a CSP (Chip Size Package) that is mounted thereafter and the substrate. Such a defect in which a large component pinches a fine component (hereinafter referred to as “pinching defect”) may be difficult only by judging based on an image captured from above the produced mounting board. Many. For this reason, the mounting board may be incorporated into a final product such as a home electric appliance even though it passes through the mounting board production system as a good product and there is a pinching defect. Then, it is detected that the mounting board is defective at the stage of inspecting the function as a home appliance. This wastes not only the process in the mounting board production system after mounting a large component but also all processes related to the final product on which the board is mounted. As described above, the pinching failure often causes many processes to be performed after the failure occurs, which causes a reduction in production efficiency.

  Also, pinching failure may destroy large parts and make reuse impossible. For example, a large part such as a CSP may be short-circuited and destroyed due to a small part sandwiched between them. Since the destroyed parts cannot be reused, pinching failure causes cost loss.

  The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a component mounting method capable of improving production efficiency by early detection of the cause of a quality defect of a component mounting board. To do.

  In order to achieve the above object, a component mounting method according to the present invention is a component mounting method for mounting a component on a board, in which a mounting step for repeatedly mounting the component on a predetermined board and a component to be mounted are predetermined. A determination step for determining whether or not the component is a predetermined component, and when it is determined in the determination step that the component to be mounted is the predetermined component, (i) after the predetermined component has been mounted, An inspection step of performing at least one of inspecting the mounting state of the component, and (ii) inspecting the mounting surface state of the predetermined component until mounting of the predetermined component is started. It is characterized by that.

  In this way, the surface state of the substrate is inspected during the mounting in the component mounting machine. Thereby, the surface state of the substrate can be inspected at an arbitrary timing. Therefore, it is possible to immediately detect the cause and defect of a defect that occurs during component mounting.

  Also inspect during adsorption or transport. Thereby, mounting and inspection can be executed in parallel. For this reason, it is possible to perform inspection with almost no change in the time required for component mounting in the component mounting machine.

  In addition, immediately before a predetermined component such as a CSP is mounted, it is inspected whether or not another component has dropped near the position where the predetermined component is mounted. As a result, when a fall of a component is detected, it is possible to take measures such as removing the board from the production line, and it is possible to prevent a defect due to the component being caught.

  Preferably, the component mounting method is applied to a component mounting machine including a mounting head that mounts components on a substrate and is movable independently of each other, and an inspection head that inspects the surface state of the substrate. The mounting head is a multi-nozzle head that can hold a plurality of components at a time. In the mounting step, the mounting head sucks the components to be held at a time and conveys the sucked components to the upper side of the substrate. In the case where a task is a series of actions for mounting the conveyed parts on the board, the task is repeated by the mounting head, and in the inspection step, the inspection head is after the task is finished, The mounting state of the predetermined component, which is one of the surface states of the substrate, is inspected during the suction or transfer of the component performed by the mounting head.

  In this way, the inspection step is executed after the end of each task included in the mounting step. Thereby, the inspection head can inspect the surface state of the substrate while the mounting head adsorbs the components. In other words, the substrate can be inspected while the mounting head is not performing a process on the substrate. Therefore, it is possible to reduce the quality defect of the component mounting board without changing the time required for component mounting in the component mounting machine.

  In the inspection step, the component mounting state is inspected as the surface state of the substrate. Thereby, it is possible to detect a shift in the mounting position of the component mounted in each task, whether or not the component to be mounted in each task is actually mounted. Therefore, it is possible to correct the mounting position of the next task by feeding back the detected deviation amount. Therefore, it is possible to correct the positional deviation in real time. If it is detected that no component is mounted, nozzle replacement, mounting retry, etc. can be executed.

  More preferably, the component mounting method is a component mounter including a mounting head that mounts a component on a substrate and is movable independently of each other, and an inspection head that inspects the surface state of the substrate. The mounting head is a multi-nozzle head that can hold a plurality of components at a time. In the mounting step, the mounting head sucks the components to be held at a time and conveys the sucked components to the upper part of the substrate. Then, when a series of actions of mounting the conveyed components on the board is a task, the task is repeated by the mounting head. In the inspection step, the inspection head is before the start of the task. The mounting surface state on which the predetermined component, which is one of the surface states of the substrate, is to be inspected during the suction or transfer of the component performed by the mounting head. It is characterized in.

  Thus, the surface condition of the substrate is inspected before the start of each task executed by the multi-nozzle head. As a result, it is possible to inspect the presence or absence of a component that has dropped near the mounting position of a plurality of components to be mounted in the next task. If a falling component is detected near the mounting position of the component to be mounted in the next task, remove the falling component before mounting it, or mount it on the board in the next task. It is possible to respond such as not implementing the implementation. This makes it possible to prevent pinching defects.

  More preferably, the component mounting method is a component mounter including a mounting head that mounts a component on a substrate and is movable independently of each other, and an inspection head that inspects the surface state of the substrate. Applied, in the mounting step, when the mounting head picks up the components to be held at one time, transports the sucked components to the upper part of the board, and sets the transported parts on the board as a task Further, the task is repeated by the mounting head, and in the inspection step, the part immediately before the predetermined part is mounted in the middle of each task being executed by the mounting head in the mounting step. Until the predetermined component is mounted, the inspection head should be mounted with the predetermined component, which is one of the surface states of the substrate. Characterized by checking the mounting surface state.

  Thus, the mounting state is inspected immediately after the predetermined part is mounted. As a result, the cause of the failure occurring at the time of mounting can be detected immediately after mounting, and early failure detection becomes possible.

  Note that the present invention can also be realized as a component mounter using steps included in such a component mounting method as means. Moreover, it can also be realized as a program for causing a computer to execute the steps included in the component mounting method. Such a program can be distributed via a recording medium such as a CD-ROM (Compact Disc-Read Only Memory) or a communication network such as the Internet.

  The “task” includes a series of operations in which the multi-nozzle head holds a plurality of components, conveys the held components to a mounting position, and mounts the conveyed components on a substrate. The conveyance and mounting in one task are repeated until the mounting of the parts held in the task is completed.

  “CSP” refers to a chip size package (DIP), which is a type of electronic component, DIP (Dual In-Line Package), SOP (Small Outline Package), BGA (Ball Grid Array). Etc.

  According to the present invention, it is possible to detect the cause of a defect or the occurrence of a defect during mounting, and early defect detection is possible. Therefore, it becomes possible to improve the production efficiency.

An embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing an external appearance of a component mounter.

  The component mounting machine 100 is a machine that mounts components on the substrate 20 conveyed in the X direction by a conveyor (not shown) and inspects the surface state of the substrate 20. The component mounting machine 100 is one of a group of machines constituting an apparatus for producing a component mounting board as a semi-finished product on which components are mounted.

  The component mounter 100 includes a display unit 102 for displaying a result of inspecting the surface state of the substrate 20. The display unit 102 is a CRT (Cathode-Ray Tube), an LCD (Liquid Crystal Display), or the like.

FIG. 2 is a plan view showing an outline of a mechanism provided in the component mounter.
The component mounting machine 100 includes a mounting head 108 that mounts components on the substrate 20, an inspection head 110 that inspects the surface of the substrate 20, and a component supply unit 106a that supplies components.

  The mounting head 108 is a multi-nozzle head that picks up a group of components supplied from the component supply unit 106a, transports the sucked components while moving by a mechanism that moves them in the XY directions, and mounts the transported components on the substrate 20. .

  The inspection head 110 is a camera that picks up an image on the substrate 20 by being moved by a mechanism for moving in the XY directions.

  The mounting head 108 and the inspection head 110 are disposed on substantially the same horizontal plane so as to face each other across the conveyance path of the substrate 20. Further, the mounting head 108 and the inspection head 110 can move independently.

  A plurality of feeders 106 capable of sequentially supplying components are attached to the component supply unit 106a.

The mounting head 108 will be described with reference to FIG.
FIG. 3 is a perspective view showing the external appearance of the mounting head 108 and the feeder 106.

  The feeder 106 is a device to which a component reel 107 around which a component tape holding a large number of components is wound is attached, and the components held on the component tape are sequentially supplied to a suction position by the mounting head 108. Note that a component tray that holds a large number of components may be attached to the component supply unit 106a.

  The mounting head 108 includes a nozzle group 108a at the tip thereof. Each nozzle constituting the nozzle group 108a sucks the component supplied to the component supply unit 106a by vacuum suction. One component can be held for each nozzle, and the mounting head 108 can hold a number of components corresponding to the number of nozzles constituting the nozzle group 108a at a time. Since the nozzle group 108a of the mounting head 108 shown in the figure includes ten nozzles, it can hold a maximum of ten parts at a time. Further, by changing the shape and size of each nozzle constituting the nozzle group 108a attached to the mounting head 108 according to the size, weight, and shape of the component, components of various sizes and shapes are held by the mounting head 108. be able to.

Next, the inspection head 110 will be described with reference to FIGS.
FIG. 4 is a perspective view showing the appearance of the inspection head 110.

FIG. 5 is a side view showing the inside of the inspection head 110 in a partial cross section.
The inspection head 110 includes a base 120 and includes two cameras 112 and 116 attached to the base 120. The first camera 112 and the second camera 116 have different resolutions. The first camera 112 is a low-resolution camera, and the second camera 116 is a high-resolution camera. The first camera 112 and the second camera 116 each include a ring illumination 118 at the tip.

  The first camera 112 and the second camera 116 are selectively used according to the size of the parts. When inspecting whether a small component whose size is equal to or smaller than a predetermined threshold has dropped on the substrate, or when inspecting a displacement of the mounting position of the small component, the second high resolution camera is used. A camera 116 is used. Further, when inspecting the displacement of the mounting position of a large component whose size exceeds a predetermined threshold, the first camera 112, which is a low-resolution camera, is used.

  In general, a low resolution camera has a wider field of view than a high resolution camera. Therefore, by properly using cameras with different resolutions according to the component size, it is possible to achieve both an accurate inspection for small components and an efficient inspection with a wide field of view.

  Note that the first camera 112 and the second camera 116 may be realized by a single camera including a zoom mechanism.

  In addition, the ring illumination 118 included in each of the first camera 112 and the second camera 116 is an LED (which is arranged in a ring shape so as to surround the lenses of the first camera 112 and the second camera 116, respectively). (Light Emitting Diode). The ring illumination 118 can adjust the amount of light. The amount of light of the ring illumination 118 is adjusted according to the resolution of the camera and the state of the subject such as the substrate 20 or the component 22 at the time of inspection by the camera 116 (112).

  As a result, an image suitable for the inspection can be taken, and the inspection accuracy can be improved.

FIG. 6 is a block diagram illustrating a configuration included in the component mounter 100.
The component mounter 100 includes an input unit 103, a mechanism unit 130, a storage unit 134, a control unit 132, a communication I / F unit 136, and a display unit 102.

  The input unit 103 is an interface that can input and change inspection conditions, which will be described later, such as a keyboard, a touch panel, and a mouse.

  The storage unit 134 is a storage medium that stores mounting data 134a including information on components to be mounted on the board, inspection conditions 134b including conditions for specifying the inspection area by the inspection head 110, the type of camera to be used, and the like. .

FIG. 7 is a diagram showing a part of the mounting data 134a.
The mounting data 134a shown in the drawing is information regarding components mounted in one mounting process, that is, components mounted on one substrate 20 in one component mounting machine 100, and includes “mounting number” and “task number”. And “part type”, “mounting point coordinates”, and “part size”. The mounting head 108 performs a component mounting operation according to the mounting data 134a.

“Mounting number” is information for identifying each mounting point.
The “task number” is information for identifying each task included in one mounting process. Here, the “task” refers to a series of operations for picking up the components to be held at one time by the mounting head, transporting the sucked components to the upper part of the substrate, and mounting the conveyed components on the substrate, or the series of operations. A group of components mounted on the substrate 20.

  The “component type” is information indicating the type of component mounted at each mounting point (mounting number).

  “Mounting point coordinates” is information indicating the position on the board on which each component is to be mounted. “Mounting point coordinates” indicate the position on the board where the center of the component is to be mounted.

  “Part size” is information indicating the size of a part.

  It is possible to calculate the area on the board on which the component is to be mounted, that is, the area occupied by the component on the board, by combining the “mounting point coordinates” and the “part size”. Information ”may be included in the mounting data 134a. The mounting data 134a may include a component library in addition to the information shown in the drawing.

  In this drawing, only a part of the component group to be mounted in each task is illustrated, and each task includes mounting data 134a regarding the component group mounted by the nozzle group 108a provided in the mounting head 108. In this embodiment, since the nozzle group 108a of the mounting head 108 includes ten nozzles as described above, each task includes mounting data 134a corresponding to a maximum of ten mounting positions.

  In the mounting data 134a shown in the figure, for example, for a component having “1” as the “mounting number”, “10” millimeters in the X direction from the reference position on the board in the task whose “task number” is “1”. , Indicating that it is mounted at a position of “20” millimeters in the Y direction. In addition, the part whose “mounting number” is “1” has “part type” of “A1”, and its size is “0.3” millimeters in the X direction and “0.6” millimeters in the Y direction. Indicates that there is.

  By referring to such mounting data 134a, inspecting the mounting state of a component that has been mounted and inspecting which part on the substrate in the inspection of the mounting surface state that is the surface state of the substrate on which the component will be mounted. It becomes possible to judge whether it should do.

FIG. 8 is a diagram illustrating an example of the inspection condition 134b.
The inspection condition is a condition for specifying the inspection timing, inspection area, and the like by the inspection head 110 as described above. The inspection conditions include, for example, information for specifying a part to be inspected in the pre-mounting inspection and the post-mounting inspection.

  In the inspection condition 134b of the present embodiment, the “target part type” as information for specifying the part to be inspected for the pre-mounting inspection is “CSP1”, and the inspection area is “ "Mounting position" and its "around 3 mm" (millimeters). In other words, the inspection area of the pre-mounting inspection according to the present embodiment is an area that is further extended by 3 mm to the outside of the component outer shape with the mounting position as the center. As described above, by setting the target parts for the pre-mounting inspection, the pre-mounting inspection is performed only for the set target part type “CSP1”, but the pre-mounting inspection is not performed for other parts. be able to.

  Further, in the inspection condition 134b, the “target component type” as information for specifying the component to be inspected for the post-mounting inspection is “A1”, and the inspection area is the “mounting position” of the specified component. It is shown that. As described above, by setting the target parts for the post-mounting inspection, the post-mounting inspection is performed only for the set target part type “A1”, but for the other parts, the post-mounting inspection is not performed. be able to.

  Note that the inspection condition 134b may set an inspection condition for only one of the pre-mounting inspection and the post-mounting inspection. In that case, regarding the inspection on the side where the inspection condition is not set, there may be no parts to be inspected, or all parts may be parts to be inspected.

  FIG. 9 is a diagram illustrating an example of an inspection region on the substrate 20 specified by the inspection condition 134b. When one “CSP1” is mounted on the mounting position 24 on the substrate 20, the inspection area is inside the outer dotted line frame 26 indicating 3 mm around the mounting position 24 (the outer shape of the mounted component).

  Such an inspection condition 134 b is information input from the input unit 103. The inspection condition 134b may be set in advance or may be information acquired via a network.

From here, the function with which the component mounting machine 100 is provided is demonstrated with reference to FIG.
The mechanism unit 130 includes the mounting head 108 and the inspection head 110 described above.

  The control unit 132 is a processing unit that controls the component mounter 100, and is, for example, a CPU (Central Processing Unit). The control unit 132 refers to the information stored in the storage unit 134, controls the mechanism unit 130, causes the mounting head 108 to mount components on the substrate 20, and causes the inspection head 110 to inspect the surface state of the substrate 20. Details of the processing executed by the control unit 132 will be described later.

  The communication I / F (interface) unit 136 is an interface for communicating with other machines constituting the mounting board production system, a host computer (not shown), and the like, for example, with a LAN (Local Area Network) adapter or the like. is there.

The display unit 102 displays the result of inspecting the surface state of the substrate 20 as described above.
Since the component mounter 100 has the functions as described above, the surface state of the substrate 20 can be inspected during the mounting.

A flow of processing executed by the component mounter 100 will be described with reference to the drawings.
FIG. 10 is a diagram illustrating a flow of processing executed by the component mounter 100.

  This figure shows a process in which the component mounting machine 100 mounts components on the board 20 based on the mounting data 134a shown in FIG.

  Moreover, the inspection condition of this Embodiment is the inspection condition 134b shown in FIG. According to the inspection condition 134b shown in FIG. 8, the “target component type (target component type for pre-mounting inspection)” is “CSP1”, and the “target component type (target component type for post-mounting inspection)” is “A1”. It is. As can be seen from the mounting data 134a shown in FIG. 7, the component size of “CSP1” which is the “target component type” of the pre-mounting inspection is larger than the component sizes of other component types such as “A1” and “B1”. large.

  Based on such inspection conditions, in the pre-mounting inspection, the control unit 132 identifies each “mounting position” of each component group whose component type is “CSP1” and each “around 3 mm” as an inspection region. . Here, the outer dotted line frame 26 shown in FIG. 9 indicates an inspection region related to one component in the component group whose component type is “CSP1”. In the post-mounting inspection, the control unit 132 specifies each “mounting position” of the component group whose component type is “A1” as the inspection region.

  The control unit 132 refers to the mounting data 134 a stored in the storage unit 134, and executes the task whose “task number” is “1” first.

  In the first executed task, a component whose “component type” is “A1” (hereinafter referred to as “component A1” as appropriate) is mounted. In accordance with the inspection condition 134b shown in FIG. 8, since the component type “A1” is the target component type for post-mounting inspection, the component A1 is inspected after the task is completed.

  The first component group of the task to be executed first is attracted to the mounting head 108. The sucked components are conveyed above the substrate, repeatedly moved and mounted, mounted on the substrate 20, and moved to the component supply unit 106a to suck the next component group. On the other hand, the inspection head 110 starts moving toward the upper side of the substrate 20 almost simultaneously with the mounting head 108 moving to the component supply unit 106a, and inspection processing is performed on the plurality of components A1 mounted in the first task. The

  As described above, the mounting state of the component can be inspected using the time when the mounting head 108 moves toward the component supply unit 106a, that is, the time when the mounting head 108 does not directly contribute to the mounting of the component. Since the state is only inspected for one task (up to 10 places in the present embodiment), the quality of the mounting board can be improved without greatly sacrificing the tact time.

  In addition, the components are mounted in such an order that the mounting head 108 moves as little as possible. Therefore, if the inspection is performed in the mounting order, the order in which the movement of the inspection head 110 decreases as much as possible. It becomes possible to inspect.

Here, details of the post-mounting inspection process will be described with reference to the drawings.
FIG. 11 is a flowchart illustrating details of the post-mounting inspection process executed by the control unit 132 included in the component mounter 100. The post-mounting inspection process is a process of inspecting a mounted state after mounting a component.

  The control unit 132 determines whether or not the mounting of one task is completed (S1). This determination is made based on a signal from the mechanism unit 130.

  When it is determined that the mounting has not ended (No in S1), that is, when the mounting end signal for the last mounting command of one task has not returned from the mechanism unit 130, the control unit 132 performs the mounting end determination process. Continue (S1).

  When it is determined that the mounting has been completed (Yes in S1), that is, when the mounting completion signal is returned, the control unit 132 includes a predetermined component in the task for which the mounting process has been completed based on the inspection condition. It is judged whether or not (S2). For example, at the time when the first task is completed, the control unit 132 indicates that the component type of the component mounted in the first task is “A1”, and the “target component type” of the inspection after mounting in the inspection condition. Therefore, it is determined that the predetermined component A1 is included in the task for which the mounting process has been completed.

  When it is determined that the predetermined part is not included (No in S2), the control unit 132 continues the mounting end determination process (S1).

  When it is determined that the predetermined part is included (Yes in S2), the control unit 132 causes the inspection head 110 to inspect the mounting state of each predetermined part based on the mounting data 134a of the task for which the mounting process is completed (S3). (Note that if the mounting completion signal is returned, the mounting head goes to the component supply unit 106a for the next task). For example, the control unit 132 inspects the mounting state of the component A1 at each mounting position by causing the inspection head 110 to image each mounting position of the component A1 in the first task. In this case, the control unit 132 moves the inspection head 110 to a visual field position including a plurality of mounting positions. Thereby, based on one image obtained from the inspection head 110, it is possible to inspect the mounting state of the component A1 at a plurality of mounting positions. Therefore, the mounting state can be inspected at high speed. Note that the control unit 132 may move the inspection head 110 for each mounting position. Thereby, the inspection of the mounting state of the component A1 at one mounting position can be performed based on one image obtained from the inspection head 110. According to this method, a high-resolution image can be obtained at each mounting position, and the mounting state of the component A1 can be inspected with high accuracy.

  Based on the image indicating the mounting state obtained from the inspection head 110, the control unit 132 determines whether a component is mounted at the mounting position (S4).

  If no component is mounted at the mounting position, that is, if there is a missing component (Yes in S4), the control unit 132 ends the processing for the substrate 20. In addition, a message to that effect is displayed on the display unit 102 and transmitted to the devices constituting the mounting board production system and the host computer via the communication I / F unit 136. Further, the component type and mounting position of the missing component are transmitted to the host computer. As a result, the processes performed in the steps after the component mounting machine 100 are canceled, and the presence / absence of a defect and the amount of deviation are recorded in the host computer. The host computer may statistically process the deviation and use it for feedback control.

  Based on the image indicating the mounting state obtained from the inspection head 110, the control unit 132 determines whether or not the mounting position shift exceeds the allowable range (S5). Here, the allowable range of the displacement of the mounting position is set in advance, and the component mounter 100 stores and holds it as one of the mounting data 134a.

  When it is determined that there is a mounting position shift exceeding the allowable range (Yes in S5), the control unit 132 ends the process for the substrate 20. In addition, a message to that effect is displayed on the display unit 102 and transmitted to the devices constituting the mounting board production system and the host computer via the communication I / F unit 136. Further, the deviation amount is transmitted to the host computer. As a result, the processing after the component mounting machine 100 is canceled, and the presence / absence of a defect and the amount of deviation are recorded in the host computer. The host computer may statistically process the deviation and use it for feedback control.

  If it is determined that there is no mounting position deviation that exceeds the allowable range (No in S5), it is determined whether all tasks in the component mounter 100 have been completed (S6).

  When it is determined that all tasks have been completed (Yes in S6), the control unit 132 ends the process for the substrate 20.

  If it is determined that all tasks have not been completed (No in S6), the control unit 132 returns to the attachment completion determination process (S1).

  As described above, it is possible to detect immediately after mounting whether or not there is a shortage of a minute part that may fall into a mounting position of a large part (for example, CSP) to be mounted later and cause a pinching failure. it can. For this reason, a pinching defect can be avoided.

  In addition, for components that require high mounting accuracy (for example, minute components, narrow lead pitch components), it is possible to detect immediately after mounting whether or not misalignment has occurred. For this reason, it is possible to avoid waste of work to be performed in a subsequent process on a substrate having a misalignment.

  Furthermore, since the post-mounting inspection is performed only for the predetermined parts as described above, and the post-mounting inspection is not performed for the other components, the post-mounting inspection can be performed as necessary. For this reason, useless inspection can be eliminated and efficient component mounting can be performed.

  In the post-mounting inspection process, the cause of another defect or the presence / absence of a defective state may be determined based on the image indicating the mounted state, instead of the mounting position shift or in addition to the mounting position shift. For example, it may be determined whether or not a component to be mounted has dropped on the substrate 20.

  In addition, according to the present invention, when a component to be mounted is dropped on the substrate 20, the user can display the drop position information indicating where the component is dropped on the substrate 20 on the display unit 102 or the like. Can let you know.

  Further, in the post-mounting inspection process shown in FIG. 11, the post-mounting inspection of the predetermined component is performed collectively after the completion of each task. However, the next component is mounted immediately after the predetermined component is mounted, that is, after the predetermined component is mounted. It may be one that performs an inspection after mounting a predetermined component individually before mounting. In this case, an inspection tact is added as compared with the case where the predetermined parts are collectively inspected after mounting, but a mounting failure of the predetermined parts can be detected immediately after mounting. For this reason, it is no longer necessary to mount components that are scheduled to be mounted after detection of mounting failure, and waste of these components can be avoided.

The process executed by the component mounter 100 will be described again with reference to FIG.
In the first task to be executed, the component type to be mounted is not “CSP1”. Therefore, the pre-mounting inspection is not performed by the pre-mounting inspection process described later.

  Next, the control unit 132 refers to the mounting data 134 a stored in the storage unit 134, and executes the task whose “task number” is “2” second.

  In the task executed second, a component whose “component type” is “CSP1” is mounted.

A part group is adsorbed to the mounting head 108 at the beginning of the second task to be executed.
At this time, the control unit 132 executes the pre-mounting inspection process by the inspection head 110 before the second task in parallel with the suction by the mounting head 108. As described above, the suction that is a part of the process executed by the mounting head 108 and the inspection by the inspection head 110 are executed in parallel. Thereby, the board | substrate 20 can be test | inspected, changing almost the time required for component mounting, and it becomes possible to reduce the quality defect of a component mounting board | substrate.

Here, details of the pre-mounting inspection process will be described with reference to the drawings.
FIG. 12 is a flowchart showing the pre-mounting inspection process executed by the control unit 132 included in the component mounter 100. The pre-mounting inspection process is a process of inspecting the mounting surface state of the inspection area of the board specified from the inspection conditions before mounting a specific component in each task.

  Based on the inspection condition, the control unit 132 determines whether or not a part to be mounted is a predetermined part (S11). Since the part type to be mounted is “CSP1” and is the same as “CSP1” which is the “target part type” of the pre-mounting inspection in the inspection condition 134b, the control unit 132 is the predetermined part. It is judged that.

  When it is determined that the component is a predetermined component (Yes in S11), the control unit 132 inspects each mounting position of the predetermined component by causing the inspection head 110 to image the mounting position of the predetermined component (S12). That is, the control unit 132 moves the inspection head 110 to a predetermined position on the substrate 20 (mounting position of the target component for inspection before mounting), and images the mounting surface state. Then, based on the obtained image information indicating the mounting surface state of the inspection area of the board 20, it is determined whether or not the component can be mounted. The determination is performed by pattern matching between the image printed normally and the acquired image, and determining whether or not the image can be mounted from the difference between the two images.

  In the mounting position inspection process (S12), when the control unit 132 detects a drop of a component to the inspection area on the board 20 or a solder positional deviation exceeding an allowable value, it determines that mounting is not possible. (No in S13), the process for the substrate 20 is terminated. More specifically, for example, the control unit 132 stops the substrate production system. The substrate 20 is removed from the substrate production system line by an operator or automatically.

  Further, the control unit 132 determines that mounting is possible when no component drop or solder positional deviation exceeding the allowable value is detected in the inspection area on the substrate 20 (Yes in S13), and the mounting head 108 is determined. It is determined whether or not the mounting of parts for one task is completed (S14). Even when it is determined that the component to be mounted is not a predetermined component (No in S11), the control unit 132 executes a mounting end determination process (S14).

  When it is determined that the mounting of components for one task has not been completed (No in S14), the control unit 132 continues the predetermined component determination process (S11).

  When it is determined that the mounting of the components for one task has been completed (Yes in S14), the control unit 132 determines whether all the tasks in the component mounter 100 have been completed (S15).

  When it is determined that all tasks have not been completed (No in S15), the control unit 132 continues the predetermined component determination process (S11).

  When it is determined that all tasks have been completed (Yes in S15), the control unit 132 ends the processing for the substrate 20.

  As described above, the pre-mounting inspection process described with reference to FIG. 12 performs the pre-mounting inspection for the predetermined component individually for each predetermined component immediately before mounting the predetermined component. In this way, by performing a pre-mounting inspection for a predetermined component individually, tact loss due to the inspection occurs, but the mounting position can be inspected immediately before component mounting. For this reason, it is possible to avoid the pinching failure due to the drop of the minute parts due to the previous mounting.

  Note that the pre-mounting inspection may be performed on all predetermined parts included in the task before the start of each task. FIG. 13 is a flowchart showing the pre-mounting inspection process executed by the control unit 132 included in the component mounter 100 before the start of the task.

  Based on the inspection condition, the control unit 132 determines whether or not the predetermined component is included in the task to be started (S21). For example, when the task to be started is the second task, the component type of the component mounted in the second task is “CSP1”, and the “target component type” of the inspection before mounting in the inspection condition. Since it is the same as “CSP1”, it is determined that the predetermined component CSP1 is included in the task to be started.

  When it is determined that the predetermined part is included (Yes in S21), the control unit 132 inspects each mounting position by causing the inspection head to image the mounting position of the predetermined part (S22). The mounting position inspection process (S22) is the same process as the mounting position inspection process (S12 in FIG. 12). However, similarly to the post-mounting inspection process described with reference to FIG. 11, it is possible to pick up images at a plurality of mounting positions at a time and perform the inspection. It may be a thing.

  In the mounting position inspection process (S22), when the control unit 132 detects a drop of a component to the inspection area on the substrate 20 or a solder positional deviation exceeding an allowable value, it determines that mounting is not possible. (No in S23), the process for the substrate 20 is terminated. More specifically, for example, the control unit 132 stops the substrate production system. The substrate 20 is removed from the substrate production system line by an operator or automatically.

  Further, the control unit 132 determines that mounting is possible when no component drop or solder positional deviation exceeding the allowable value is detected in the inspection area on the substrate 20 (Yes in S23), and the mounting head 108 is determined. The process waits until the mounting of parts for one task is completed (S24).

  When it is determined that the mounting of the components for one task has been completed (Yes in S24), the control unit 132 determines whether all the tasks in the component mounter 100 have been completed (S25).

  When it is determined that all tasks have not been completed (No in S25), the control unit 132 continues the predetermined component determination process (S21).

  When it is determined that all tasks have been completed (Yes in S25), the control unit 132 ends the pre-mounting inspection process for the substrate 20.

  As described above, the pre-mounting inspection process described with reference to FIG. 13 collectively performs pre-mounting inspections for predetermined parts before the start of a task. In this way, by performing the pre-mounting inspection for the predetermined component before the start of the task, the mounting head 108 sucks the component and the recognition camera recognizes the component sucked by the mounting head 108. 110 enables inspection before mounting. For this reason, tact loss due to performing the pre-mounting inspection does not occur.

  Whether the pre-mounting inspection is performed for each predetermined component immediately before mounting the predetermined component according to the flowchart shown in FIG. 12, or the pre-mounting inspection for the predetermined component is collectively performed before starting the task according to the flowchart shown in FIG. This determination may be made as follows. That is, when mounting a microchip component before mounting a predetermined component within the same task, a pre-mounting inspection is performed for each predetermined component immediately before mounting the predetermined component in order to reliably detect pinching. You can do it. In addition, if a small chip part is not mounted before mounting a predetermined part in the same task, the problem of pinching is unlikely to occur. Therefore, a pre-mounting inspection for a predetermined part should be performed before starting the task. Also good.

  As described above, in the pre-mounting inspection process, whether or not the component has dropped in the mounting area (occupied area) of the component to be mounted next, and whether or not the printed state of the solder at the mounting position where the component is mounted next is not defective. Whether or not is inspected based on an image obtained from the inspection head 110.

  If there is no drop of the component in the inspection area and the solder printing state is good, the component is transported and mounted by the mounting head 108. Thereafter, the solder inspection process, conveyance and mounting are repeated until all the sucked parts are mounted.

  The control unit 132 refers to the mounting data 134a stored in the storage unit 134 and repeatedly executes such task processing up to the task whose “task number” is “N”. After the task is executed for all the components that the component mounter 100 intends to mount on the substrate 20, the mounting process for the substrate 20 in the component mounter 100 ends.

  As described above, the pre-mounting inspection process is executed during the mounting of the components in the task or before the mounting of the components in the task. As a result, it is possible to prevent pinching of small parts and to detect a defect such as a displacement of the mounting position for each task.

  Further, the mounting position in the next task can be corrected by the shift of the mounting position detected in the post-mounting inspection process. As described above, since the misalignment can be corrected in real time, it can be mounted at an accurate position.

  Further, by performing a pre-mounting inspection only on a predetermined component, a large component (for example, CSP) that may cause a pinch failure due to a minute component dropping to the mounting position of the predetermined component is immediately before mounting. Pre-installation inspection can be performed. For this reason, a pinching defect can be avoided.

  Further, since the pre-mounting inspection is performed only for the predetermined parts and the pre-mounting inspection is not performed for the other parts, the pre-mounting inspection can be performed as necessary. For this reason, useless inspection can be eliminated and efficient component mounting can be performed.

  The component mounting machine and the component mounting method according to the embodiment of the present invention have been described above, but the present invention is not limited to this embodiment.

For example, the mounting head may mount only one component.
For example, the mounting head may include a chuck instead of a nozzle, thereby holding the component.

  For example, in the embodiment, the number of components to be mounted in one task is one, but a plurality of different types of components may be held by the mounting head and sequentially mounted on the substrate.

  The timing for executing the predetermined component determination process (S11) and the mounting position inspection process (S12) in the pre-mounting inspection described with reference to FIG. 12 may be any of the following.

  The predetermined part determination process (S11) and the mounting position inspection process (S12) may be collectively executed for all the parts to be inspected among the mounted parts in the task. A flowchart of this process is shown in FIG.

  By collectively executing the inspection target parts in the task in this way, it is possible to suppress tact loss caused by executing the predetermined part determination process (S11) and the mounting position inspection process (S12).

  In addition, the predetermined component determination process (S11) and the mounting position inspection process (S12) in the pre-mounting inspection described with reference to FIG. 12 may be performed immediately before each component to be inspected is mounted. Here, “immediately before mounting a component” refers to a period from when a component immediately before a component to be inspected (hereinafter referred to as “inspection target component”) is mounted until the component to be inspected is mounted. Say. A flowchart of this process is shown in FIG.

  In this way, the predetermined component determination process (S11) and the mounting position inspection process (S12) are executed every time immediately before mounting. As a result, when a component to be mounted before the component to be inspected falls at or near the mounting position of the component to be inspected, it is possible to detect the falling of those components. Accordingly, it is possible to reliably detect the drop of the component to the mounting position.

  Furthermore, the predetermined part determination process (S11) and the mounting position inspection process (S12) in the pre-mounting inspection described with reference to FIG. 12 are performed for all the parts to be inspected among the mounted parts in the task. After executing and mounting the inspection target component included in the task first, a component that is not the inspection target may be mounted.

  As described above, by collectively executing the parts to be inspected in the task, it is possible to suppress the tact loss caused by executing the predetermined part determination process (S11) and the mounting position inspection process (S12). In addition, since the number of parts mounted on the board can be minimized after the condition of the board surface is determined, there is a risk that the parts will fall to the board mounting position before the parts to be inspected are mounted. It can be minimized.

  For example, the inspection condition (the inspection condition for the pre-mounting inspection or the post-mounting inspection) may include a component size threshold as information for specifying the component to be inspected. For example, it is difficult for a large component to detect the pinching of the component after mounting. By setting the threshold value of the component size as an inspection condition, a component larger than the threshold value can be set as an inspection target as a predetermined component. Therefore, it is possible to prevent a failure caused by a large component sandwiching another small component with the substrate.

  In the present embodiment, the CSP is exemplified as the component to be inspected before mounting, but the target component is not limited to this, and may be, for example, a QFP (Quad Flat Package). In this case, for example, the inspection condition may include a component type of a component that is a QFP (Quad Flat Package) as information for specifying a component to be inspected. Furthermore, a threshold value for drawing the vicinity thereof may be included. Thus, before the QFP is mounted, it is possible to inspect for the presence or absence of a component falling in the vicinity of the QFP mounting position, the state of solder, and the like. Therefore, it is possible to prevent a defect caused by a short circuit between the QFP lead and the component. It should be noted that any component other than CSP or QFP can be inspected before mounting as long as it is a large component that may cause a short circuit if a microchip component falls in the region around the mounting position. be able to.

  In addition to the component type of a component that is a QFP (Quad Flat Package), the inspection condition includes information indicating whether or not another component is mounted in a region near the mounting position of the component. Also good. Here, the vicinity region refers to a region that is widened outward by a preset length from the component mounting position. Furthermore, the other parts are particularly preferably small parts that are sandwiched between QFPs.

  Thus, a QFP in which a component is mounted in the vicinity is likely to be caught due to a mounting error in a nearby component. In this way, efficient inspection is possible by inspecting only the region where pinching is likely to occur.

  For example, the inspection condition may include a threshold value related to a pitch, which is a lead interval between components, as information for specifying a component to be inspected. In this case, the mounting data 134a further includes information indicating the pitch of each component. As a result, it is possible to inspect the printing failure of the solder particularly in a part having a narrow pitch. Therefore, it is possible to prevent a defect caused by a short circuit caused by solder, which is likely to occur in a component having a narrow pitch.

  In addition, although the inspection was performed between the end of the previous task and the start of the next task, it is not limited to this. For example, even in the middle of a task, an inspection may be performed immediately before the next timing when a predetermined part is mounted.

  In this case, even if a component that would have been mounted in front of the predetermined component within the same task has dropped and caused the pinching, the state can be detected.

  Moreover, it does not matter immediately after. For example, it is possible to detect the presence or absence of a drop in real time by inspecting the mounting state immediately after mounting a part with a high drop rate, and to cancel the subsequent process if a failure occurs. .

  Further, when the post-mounting inspection for the task immediately after the end and the pre-mounting inspection for the task to be started are performed, the post-mounting inspection and the pre-mounting inspection may be performed together. That is, while the mounting head 108 sucks components and the recognition camera recognizes the components sucked by the mounting head 108, the post-mounting inspection and the pre-mounting inspection are performed. At this time, if the inspection area for the post-mounting inspection and the inspection area for the pre-mounting inspection fall within the same field of view of the inspection head 110, based on an image obtained by imaging the substrate surface with one field of view including both inspection areas. A pre-mounting inspection and a post-mounting inspection are performed. In addition, the movement path of the inspection head 110 including the set visual field position is calculated such that the movement path of the inspection head 110 that images the target area for the post-mounting inspection and the target area for the pre-mounting inspection is the shortest. The inspection head 110 moves according to the calculated route.

  Further, in the present embodiment, the component mounting process has been described by taking the component mounting machine 100 in which the mounting head 108 and the inspection head 110 operate alternately as an example. However, the component mounting machine targeted by the present embodiment is described. Is not limited to the component mounting machine 100. In other words, if it is determined whether or not a part included in a task is a predetermined part and a pre-mounting inspection or post-mounting inspection is performed when it is determined as a predetermined part, the inspection is performed while operating independently of the mounting head. The inspection head is not limited, and any inspection means may be used for inspection. For example, an inspection camera may be provided in the mounting head, the inspection head may move the mounting head to a position where the inspection target area can be imaged, and the inspection camera may perform pre-mounting inspection and post-mounting inspection. .

  The present embodiment can also be applied to a component mounting method for mounting the second component on the top surface of the mounted first component called POP mounting. That is, it is possible to perform the pre-mounting inspection on the second component by using the upper surface of the first component as the inspection region before mounting the second component and inspecting the inspection region for any foreign matter or abnormality.

  The present invention can also be realized as a mounting condition determining apparatus that determines the mounting conditions of the mounting method described in the above embodiment. The mounting condition determining apparatus is realized by executing a program on a normal computer including a CPU, a memory, and the like.

  The present invention can be applied to a component mounting machine.

It is a perspective view which shows the external appearance of a component mounting machine. It is a top view which shows the outline | summary of the mechanism with which a component mounting machine is provided. It is a perspective view which shows the external appearance of a mounting head and a feeder. It is a perspective view which shows the external appearance of a test | inspection head. It is a side view which shows the detail of an inspection head. It is a block diagram which shows the structure with which a component mounting machine is provided. It is a figure which shows a part of mounting data. It is a figure which shows an example of test | inspection conditions. It is a figure which shows an example of the test | inspection area | region on the board | substrate 20 specified by test | inspection conditions. It is the figure which put together the flow of the process which a component mounting machine performs. It is a flowchart which shows the detail of the inspection process after mounting which the control part with which a component mounting machine is provided performs. It is a flowchart which shows the solder inspection process which the control part with which a component mounting machine is provided performs. It is a flowchart which shows the solder inspection process which the control part with which a component mounting machine is provided performs.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Board | substrate 100 Component mounting machine 102 Display part 103 Input part 106 Feeder 107 Component reel 108 Mounting head 110 Inspection head 130 Mechanism part 132 Control part 134 Memory | storage part 136 Communication I / F part

Claims (12)

A component mounting method for mounting a component on a board,
A mounting step that repeats mounting of components on a predetermined board;
A determination step of determining whether or not a component to be mounted is a predetermined component;
When it is determined in the determination step that the component to be mounted is the predetermined component, (i) the mounting state of the predetermined component is inspected after mounting of the predetermined component is completed; and (ii) An inspection step of performing at least one of inspecting a mounting surface state related to the predetermined component until mounting of the predetermined component is started,
In the determination step, whether the predetermined component is in accordance with the inspection condition indicating “information for identifying a component” and “information indicating whether or not another component is mounted in a region near the mounting position of the component”. A component mounting method characterized by determining whether or not. The component mounting method is applied to a component mounter including a mounting head that mounts components on a substrate and is movable independently and arranged opposite to each other, and an inspection head that inspects the surface state of the substrate,
The mounting head is a multi-nozzle head capable of holding a plurality of components at once,
In the mounting step, when the mounting head sucks the components to be held at one time, transports the sucked components to the upper part of the substrate, and sets a task of mounting the transported components on the substrate as a task, The task is repeated by the mounting head,
In the inspection step, the inspection head is mounted after mounting the predetermined component, which is one of the surface states of the substrate, after the task is completed and during the suction or conveyance of the component performed by the mounting head. The component mounting method according to claim 1, wherein: The component mounting method is applied to a component mounter including a mounting head that mounts components on a substrate and is movable independently and arranged opposite to each other, and an inspection head that inspects the surface state of the substrate,
The mounting head is a multi-nozzle head capable of holding a plurality of components at once,
In the mounting step, when the mounting head sucks the components to be held at one time, transports the sucked components to the upper part of the substrate, and sets a task of mounting the transported components on the substrate as a task, The task is repeated by the mounting head,
In the inspection step, the predetermined component which is one of the surface states of the substrate is mounted on the inspection head before the start of the task and during the suction or conveyance of the component performed by the mounting head. The component mounting method according to claim 1, wherein a mounting surface state to be inspected is inspected. The component mounting method is applied to a component mounter including a mounting head that mounts components on a substrate and is movable independently and arranged opposite to each other, and an inspection head that inspects the surface state of the substrate,
In the mounting step, when the mounting head sucks the components to be held at one time, transports the sucked components to the upper part of the substrate, and sets a task of mounting the transported components on the substrate as a task, The task is repeated by the mounting head,
In the inspection step, in the middle of each task being executed by the mounting head in the mounting step, from when the component immediately before the predetermined component is mounted to when the component of the predetermined component is mounted The component mounting method according to claim 1, wherein the inspection head inspects a mounting surface state on which the predetermined component which is one of the surface states of the substrate is to be mounted. The component mounting method is applied to a component mounter including a mounting head that mounts components on a substrate and is movable independently and arranged opposite to each other, and an inspection head that inspects the surface state of the substrate,
In the inspection step, the inspection head inspects the mounting state of the predetermined component, which is one of the surface states of the substrate, during the suction or conveyance of the component performed by the mounting head, and the surface state of the substrate The component mounting method according to claim 1, wherein a mounting surface state on which the predetermined component which is one of the components is to be mounted is inspected. In the determination step, in accordance with the “information for identifying the component”, the component to be mounted is a first predetermined component for inspecting the mounting state of the component or a second predetermined inspecting the mounting surface state for the component. To determine whether it falls under
In the inspection step, when the component to be mounted is determined to be the first predetermined component in the determination step, the mounting state of the first predetermined component after the mounting of the first predetermined component If the component to be mounted is determined to be the second predetermined component in the determining step, the mounting surface related to the second predetermined component is mounted before mounting the second predetermined component. The component mounting method according to claim 1, wherein the state is inspected. The component mounting method according to claim 1, wherein the inspection condition is input from an input unit. The component mounting method according to claim 7, wherein the inspection condition is acquired via a network. A component mounter for mounting components on a board,
Mounting means for repeatedly mounting components on a predetermined board;
Determining means for determining whether a component to be mounted is a predetermined component;
And (ii) inspecting the mounting state of the predetermined component after the mounting of the predetermined component is completed when the determination unit determines that the component to be mounted is the predetermined component; and (ii) An inspection unit that performs at least one of inspecting a mounting surface state related to the predetermined component until mounting of the predetermined component is started,
The determination means determines whether the predetermined component is in accordance with an inspection condition indicating “information for identifying a component” and “information indicating whether or not another component is mounted in a region near the component mounting position”. A component mounter characterized by determining whether or not. A mounting condition determination method for determining a mounting condition when mounting a component on a board,
A mounting step for repeatedly mounting components on a predetermined board;
A determination step for determining whether or not a component to be mounted is a predetermined component;
When it is determined that the component to be mounted is the predetermined component, (i) the mounting state of the predetermined component is inspected after the mounting of the predetermined component is completed, and (ii) the predetermined component An inspection step of performing at least one of inspecting the mounting surface state of the predetermined component until the mounting of is started,
In the-size Teisu step "for specifying component information" and the predetermined in accordance with test conditions indicates "parts mounting position other in the vicinity area of the part information indicating whether or not mounted" mounting condition determination method characterized by Ru to determine component or not. A mounting condition determining device for determining mounting conditions when mounting components on a board,
Mounting means for repeatedly mounting components on a predetermined board;
Determination means for determining whether or not a component to be mounted is a predetermined component;
When it is determined that the component to be mounted is the predetermined component, (i) the mounting state of the predetermined component is inspected after the mounting of the predetermined component is completed, and (ii) the predetermined component An inspection unit that executes at least one of inspecting the mounting surface state of the predetermined component until the mounting of the is started,
Wherein-size Teite stage "for specifying component information" and the predetermined in accordance with test conditions indicates "parts mounting position other in the vicinity area of the part information indicating whether or not mounted" mounting condition determining apparatus characterized by Ru to determine component or not. A program for determining mounting conditions when mounting components on a board,
A mounting step for repeatedly mounting components on a predetermined board;
A determination step for determining whether or not a component to be mounted is a predetermined component;
When it is determined that the component to be mounted is the predetermined component, (i) the mounting state of the predetermined component is inspected after the mounting of the predetermined component is completed, and (ii) the predetermined component Until the mounting of is started, causing the computer to execute an inspection step of performing at least one of inspecting the mounting surface state of the predetermined component,
In the-size Teisu step "for specifying component information" and the predetermined in accordance with test conditions indicates "parts mounting position other in the vicinity area of the part information indicating whether or not mounted" program for executing that Ru is determined whether part or not in the computer, wherein.

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