JP7017723B2 - Inspection method - Google Patents

Description

The present invention relates to an inspection method applied to a component mounting machine for mounting an electronic component on a circuit board.

As shown in Patent Document 1, the component mounting machine sucks an electronic component at a supply position by a suction nozzle, and mounts the electronic component at a predetermined coordinate position (mounting position) on a circuit board. A circuit board on which a plurality of electronic components are mounted by a component mounting machine is automatically inspected for the mounting state of the electronic components by a visual inspection device located on the downstream side of the component mounting machine on a production line (see Patent Document 2). The mounting state of the electronic component includes the amount of displacement of the electronic component with respect to the mounting position, the posture of the electronic component, and the presence or absence of damage.

Further, the inspection of the circuit board includes an automatic inspection by the visual inspection device for the mounted circuit board as described above, and a visual inspection by the operator for the circuit board being mounted. Visual inspection is required, for example, when an electronic component that requires particularly high mounting accuracy or an electronic component that is easily damaged is mounted. In the visual inspection, the operator visually inspects the electronic component to be inspected mounted on the circuit board and judges whether the mounted state is good or bad.

Patent Document 1: Japanese Patent Application Laid-Open No. 2013-026278 Patent Document 2: Japanese Patent Application Laid-Open No. 2002-299900

However, in the visual inspection of the component mounting machine, it may not be easy to determine whether the mounted state is good or bad depending on factors such as the fineness of the electronic component. Then, the time required for the visual inspection becomes long, and the inspection time may affect the production efficiency of the component mounting machine.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an inspection method for improving the efficiency of inspection of the mounting state of electronic components in a component mounting machine.

The inspection method according to claim 1 is a circuit board using a camera provided on the same moving table as the mounting head in a component mounting machine provided with a mounting head that supports a plurality of suction nozzles for holding electronic components. It is an inspection method that inspects the mounting state of electronic components mounted in the upper mounting position.
The mounting head moves the camera from the current position to above the mounting position so that the electronic component mounted at the mounting position can be imaged, and the imaging process of the camera is controlled so that the electronic component is stored. The step to acquire the obtained image data and
During the period from the acquisition of the image data to the input of the inspection result, the preliminary operation of moving the suction nozzle from the current position to the upper side of the next mounting position is executed in parallel, and the suction is performed. The step of raising and lowering the nozzle to stop the mounting operation of mounting the electronic component held by the suction nozzle to the mounting position and the subsequent step of lowering the suction nozzle when the result of the inspection is judged to be good. It has a step of performing a mounting operation.

According to the configuration of the invention according to claim 1, the inspection support device enables inspection of the mounting state based on image data taken by an image taken by a camera provided in the machine of the component mounting machine. Further, during the period from the acquisition of the image data to the input of the inspection result, the preliminary operation of moving the suction nozzle from the current position to the upper side of the next mounting position is executed in parallel, and the suction nozzle is executed. Is raised and lowered to stop the mounting operation of mounting the electronic component held by the suction nozzle at the mounting position . As a result, it is possible to improve the efficiency of inspection of the mounted state and prevent waste of parts .

It is an overall view which shows the component mounting machine in an embodiment. It is a block diagram which shows the control device of the component mounting machine to which an inspection support device is applied. It is a figure which shows the operation of the component transfer apparatus in the mounting operation. It is a figure which shows the operation of the component transfer apparatus in the image pickup operation. It is a flowchart which shows the mounting process by a component mounting machine. It is a flowchart which shows the optimization process of the execution order of a mounting operation and an image pickup operation. It is a figure which shows the relationship between the execution order of a mounting operation and an image pickup operation, and the moving distance of a moving table.

Hereinafter, embodiments that embody the inspection method of the present invention will be described with reference to the drawings. The inspection method is applied to the component mounting machine and supports the inspection in the component mounting machine. The component mounting machine is a device that sucks an electronic component at a supply position by a suction nozzle and mounts the electronic component at a predetermined coordinate position (mounting position) on a circuit board.

<Embodiment> (1. Overall configuration of component mounting machine 1) The configuration of the component mounting machine 1 will be described with reference to FIG. As shown in FIG. 1, the component mounting machine 1 includes a board transfer device 11, a component supply device 12, a component transfer device 13, a component camera 15, a substrate camera 16, and a control device 30. In the following description, the horizontal width direction of the component mounting machine 1 (direction from the upper left to the lower right in FIG. 1) is defined as the X-axis direction, and the horizontal longitudinal direction of the component mounting machine 1 (direction from the upper right to the lower left in FIG. 1). Is the Y-axis direction, and the vertical direction (horizontal direction in FIG. 1) perpendicular to the X-axis and the Y-axis is the Z-axis direction.

The substrate transfer device 11 is composed of a belt conveyor or the like, and sequentially conveys the circuit board 40 in the transfer direction. The board transfer device 11 positions the circuit board 40 at a predetermined position in the component mounting machine 1. Then, the board transfer device 11 carries out the circuit board 40 to the outside of the component mounting machine 1 after the mounting process by the component mounting machine 1 is executed.

The component supply device 12 supplies the electronic components mounted on the circuit board 40 to the supply position Sp. In the present embodiment, the electronic component includes an electronic component housed in a carrier tape at a predetermined pitch and a chip obtained by cutting a wafer Wf in component units. The carrier tape is fed and moved by a feeder detachably set in a plurality of slots of the component supply device 12. As a result, the component supply device 12 supplies the electronic component at the take-out portion on the tip end side of the feeder.

Further, the component supply device 12 includes a wafer supply device 12a that supplies chips of the wafer Wf. A large number of chips are formed in a grid pattern on a wafer body, for example, and are formed by being cut into component units by a laser cutter or the like while being attached to an adhesive sheet. The electronic component housed in the carrier tape and the chip of the wafer Wf correspond to the "electronic component" of the present invention.

The component transfer device 13 is configured to be movable in the X-axis direction and the Y-axis direction. The component transfer device 13 is arranged from the rear side (upper right side in FIG. 1) in the longitudinal direction of the component mounting machine 1 to the upper side of the component supply device 12 on the front side. The component transfer device 13 includes a head drive device 21, a moving table 22, and a mounting head 23. The head drive device 21 is configured so that the moving table 22 can be moved in the XY axis direction by a linear motion mechanism.

The mounting head 23 is detachably provided on the moving table 22 of the head driving device 21. Further, the mounting head 23 supports a plurality of suction nozzles 24 detachably provided on the plurality of nozzle holders. The mounting head 23 supports the suction nozzle 24 so as to be rotatable and ascending / descending around the R axis parallel to the Z axis.

Each of the suction nozzles 24 is controlled in the elevating position (position in the Z-axis direction), the angle, and the supply state of the negative pressure with respect to the mounting head 23. By being supplied with a negative pressure, the suction nozzle 24 sucks and holds the electronic components supplied at the take-out portion of the feeder and the chips of the wafer Wf supplied by the wafer supply device 12a.

The component camera 15 and the substrate camera 16 are digital image pickup devices having an image pickup device such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The component camera 15 and the board camera 16 take an image within a range within the field of view of the camera based on a control signal from the control device 30 connected communicably, and send the image data acquired by the image pickup to the control device 30.

The component camera 15 is fixed to the base 2 of the component mounting machine 1 so that the optical axis is in the vertical direction (Z-axis direction), and can be imaged from below the component transfer device 13. More specifically, the component camera 15 is configured to be capable of capturing an image of the lower surface of the electronic component held by the suction nozzle 24. Specifically, the lens unit of the component camera 15 is set so as to focus on an object at a certain distance from the image sensor. Further, the camera field of view of the lens unit of the component camera 15 is set to a size that accommodates all the suction nozzles 24 supported by the mounting head 23.

The substrate camera 16 (corresponding to the "camera" of the present invention) is provided on the moving table 22 of the component transfer device 13 so that the optical axis is in the vertical direction (Z-axis direction). The board camera 16 is configured so that the circuit board 40 can be imaged. The control device 30 that has acquired the image data from the board camera 16 recognizes the positioning state of the circuit board 40 by the board transfer device 11 by recognizing, for example, the positioning mark attached to the board by image processing. Then, the control device 30 corrects the position of the moving table 22 according to the positioning state of the circuit board 40, and controls the mounting process so as to mount the electronic components.

Further, in the present embodiment, the substrate camera 16 executes an image pickup process for acquiring image data used for inspection in the component mounting machine 1. In this inspection, among the electronic components mounted on the circuit board 40, the inspection component 50 to be inspected is targeted, and the quality of the mounted state of the electronic component is determined. That is, the board camera 16 is used not only for acquiring the image data used for the mounting process but also for acquiring the image data used for the inspection. The board camera 16 constitutes an inspection support device 90 that supports inspection of the mounted state. The above inspection includes an automatic inspection and a visual inspection by an operator.

The control device 30 is mainly composed of a CPU, various memories, and a control circuit, and controls the mounting process of electronic components on the circuit board 40 based on the image data acquired by the image pickup of the component camera 15 and the substrate camera 16. As shown in FIG. 2, the control device 30 has an input / output interface 36 connected to a mounting control unit 31, an image processing unit 32, an image pickup control unit 33, a display control unit 34, and a storage device 35 via a bus. ing. A motor control circuit 37 and an image pickup control circuit 38 are connected to the input / output interface 36.

The mounting control unit 31 controls the position of the mounting head 23 and the operation of the suction mechanism via the motor control circuit 37. More specifically, the mounting control unit 31 inputs information output from various sensors provided in the component mounting machine 1 and the results of various recognition processes. Then, the mounting control unit 31 sends a control signal to the motor control circuit 37 based on the control program stored in the storage device 35, the information by various sensors, and the results of image processing and recognition processing. As a result, the position and rotation angle of the suction nozzle 24 supported by the mounting head 23 are controlled.

The image processing unit 32 acquires image data obtained by imaging the component camera 15 and the substrate camera 16 via the image pickup control circuit 38, and executes image processing according to the application. This image processing may include, for example, binarization of image data, filtering, hue extraction, super-resolution processing, and the like.

The image pickup control unit 33 sends a control signal to each device so that a predetermined object is imaged by the component camera 15 and the board camera 16. Specifically, when the image pickup control unit 33 acquires the image data containing the positioning mark attached on the circuit board 40, the board camera 16 provided on the mobile table 22 with respect to the component supply device 12. A control signal is sent to move the camera above the positioning mark. Then, the image pickup control unit 33 sends a control signal so as to execute the image pickup process to the substrate camera 16 that has moved above the positioning mark.

In the present embodiment, the image pickup control unit 33 controls the image pickup process for acquiring the image data used for the inspection in the component mounting machine 1. Further, the image pickup control unit 33 optimizes the timing of executing the image pickup process of the substrate camera 16 which is also used for acquiring the image data used for the inspection. The details of the above optimization process by the image pickup control unit 33 will be described later.

The display control unit 34 causes the display device 17 to display the image data captured by the substrate camera 16. The display device 17 is, for example, a liquid crystal monitor or a touch screen arranged on the operation panel of the control device 30 (see FIG. 4B). The display control unit 34 displays image data that has been subjected to various image processing by the image processing unit 32.

The storage device 35 is composed of an optical drive device such as a hard disk device, a flash memory, or the like. The storage device 35 contains a control program for operating the component mounting machine 1, image data transferred from the component camera 15 and the board camera 16 to the control device 30 via a bus or a communication cable, and processing by the image processing unit 32. Temporary data etc. are stored. The input / output interface 36 intervenes between the CPU or the storage device 35 and the control circuits 76 and 77, and adjusts the data format conversion and signal strength.

The motor control circuit 37 is used for controlling each axis motor provided in the component transfer device 13 based on the control signal by the mounting control unit 31. As a result, the mounting head 23 is positioned in each axial direction. Further, by controlling the motor of each axis, the elevating position (position in the Z-axis direction) and the rotation angle of the predetermined suction nozzle 24 are determined.

The image pickup control circuit 38 controls the image pickup by the component camera 15 and the substrate camera 16 based on the image pickup control signal transmitted by the image pickup control unit 33. Further, the image pickup control circuit 38 acquires the image data obtained by the image pickup of the component camera 15 and the board camera 16 and stores the image data in the storage device 35 via the input / output interface 36.

(2. Configuration of Inspection Support Device 90) In the present embodiment, the inspection support device 90 that supports inspection includes a board camera 16 in the component mounting machine 1 and an image pickup control unit 33. The inspection support device 90 supports automatic inspection or visual inspection of the mounted state of the target inspection component 50 among the electronic components mounted on the circuit board 40 by the component mounting machine 1. Specifically, the inspection support device 90 supports the above inspection by optimizing the operation order of the plurality of mounting operations and the plurality of imaging operations.

(2-1. Definition of mounting operation and imaging operation) Here, the suction nozzle 24 is moved from the current position NCp to the upper side of the mounting position Mp, and the suction nozzle 24 is moved up and down to be held by the suction nozzle 24. The operation of the component transfer device 13 for mounting the inspection component 50 at the mounting position Mp is defined as "mounting operation". The mounting operation is executed in the order according to the control program.

Specifically, as shown in FIG. 3, when the suction nozzle 24 is at the first current position NCp1, the mounting operation is an operation in which the suction nozzle 24 moves XY from the first current position NCp1 to above the mounting position Mp. This corresponds to a lowering operation for mounting the inspection component 50 held by the suction nozzle 24 on the circuit board 40 and an ascending operation for returning the suction nozzle 24 to its original height.

The current position NCp of the suction nozzle 24 is a position depending on the immediately preceding operation of the component transfer device 13, and corresponds to the position of the suction nozzle 24 at the time when the immediately preceding operation is completed. Therefore, even in the mounting operation of mounting the inspection component 50 at the predetermined mounting position Mp, if the immediately preceding operation is different, the current position NCp of the suction nozzle 24 may be different. Further, the operation immediately before the component transfer device 13 is changed, for example, when the imaging operation is inserted immediately before the mounting operation.

As a result, the suction nozzle 24 may be located at, for example, different first current positions NCp1 and second current positions NCp2 even in the same mounting operation. Here, if the distance LN1 from the upper position of the mounting position Mp to the first current position NCp1 and the distance LN2 from the upper position of the mounting position Mp to the second current position NCp2 are different, the moving table in the mounting operation. The moving distance of 22 and the operating time (required time) required for the mounting operation are different.

Further, the operation of the component transfer device 13 for moving the board camera 16 from the current position CCp to the upper side of the mounting position Mp so that the board camera 16 can image the inspection component 50 mounted at the mounting position Mp is "imaging operation". Is defined as. Specifically, as shown in FIG. 4, when the board camera 16 is at the first current position CCp1, the image pickup operation is an operation in which the board camera 16 moves XY from the first current position CCp1 to above the mounting position Mp. Corresponds to. In the image pickup operation, the substrate camera 16 does not necessarily have to be moved directly above the mounting position Mp. That is, the substrate camera 16 is moved to the area where the inspection component 50 fits in the field of view of the camera by the image pickup operation.

The current position CCp of the board camera 16 is a position depending on the immediately preceding operation of the component transfer device 13, and corresponds to the position of the board camera 16 at the time when the immediately preceding operation is completed. Therefore, even in the imaging operation of imaging the inspection component 50 mounted at the predetermined mounting position Mp, if the immediately preceding operation is different, the current position CCp of the board camera 16 may be different. Further, the operation immediately before the component transfer device 13 is changed, for example, when another image pickup operation is inserted immediately before the image pickup operation.

As a result, the substrate camera 16 may be located at different first current position CCp1, second current position CCp2, or the like even in the same imaging operation. Here, if the distance LC1 from the position above the mounting position Mp to the first current position CCp1 and the distance LC2 from the position above the mounting position Mp to the second current position CCp2 are different, the moving table in the imaging operation is performed. The moving distance of 22 and the operating time (required time) required for the imaging operation are different.

(2-2. Mounting Process by Component Mounting Machine 1) The mounting process of electronic components by the component mounting machine 1 will be described with reference to FIG. In the mounting process, the mounting control unit 31 first sucks electronic components sequentially on a plurality of suction nozzles 24 to hold the electronic components (step 11 (hereinafter, “step” is referred to as “S”)). To execute. Next, the image pickup control unit 33 moves the mounting head 23 above the component camera 15 by the operation of the component transfer device 13, and executes an image pickup process (S12) for imaging a plurality of adsorbed electronic components.

After that, the mounting control unit 31 executes a mounting process (S13) in which the electronic components are sequentially mounted on the circuit board 40. Then, the mounting control unit 31 determines whether or not the mounting process of all the electronic components is completed based on the control program (S14). The control device 30 repeatedly executes the above processes (S11 to S13) until the mounting process is completed.

Further, in the mounting process by the component mounting machine 1, the mounting control unit 31 controls the movement of the suction nozzle 24 according to the suction state of the electronic component by the suction nozzle 24 in order to improve the mounting accuracy. Therefore, the mounting control unit 31 performs image processing on the image data acquired by the image pickup process (S12) in the image processing unit 32 so as to recognize the suction state of the electronic component by the suction nozzle 24.

Here, in order to execute the operation (S11 to S13) from the holding of a plurality of supplied electronic parts to the completion of the repeated mounting operation for the number of times equal to the held quantity. The operation of the component transfer device 13 is defined as a "mounting cycle". When the mounting head 23 supports the 12 suction nozzles 24, the operation from sucking up to 12 electronic components to the completion of mounting all of these electronic components is defined as one mounting cycle. ..

(2-3. Optimization processing by the inspection support device 90) The optimization processing of the mounting operation and the execution order of the imaging operation by the image pickup control unit 33 constituting the inspection support device 90 will be described with reference to FIGS. 6 and 7. do. In the present embodiment, the image pickup control unit 33 optimizes the execution order for the mounting operation included in one mounting cycle and the imaging operation corresponding to the mounting operation. Further, in the mounting cycle, all of the 12 suction nozzles 24 supported by the mounting head 23 suck and hold the electronic components, and each electronic component is mounted at a different mounting position Mp.

First, the image pickup control unit 33 acquires the mounting position Mp corresponding to the 12 mounting operations and the execution order of the mounting operations based on the control program (S21). The first mounting operation MV1 to the twelfth mounting operation MV12 in the mounting cycle are continuously as shown in the uppermost stage of FIG. 7 when the imaging operation for acquiring the image data used for the inspection is not considered. It is executed sequentially.

Here, the width of each of the mounting operations MV1 to MV12 in FIG. 7 indicates the moving distance of the moving table 22 in each mounting operation when the mounting processes are continuously executed in this execution order. That is, in the fifth mounting operation MV5 to the eighth mounting operation MV8 having a relatively small width, the corresponding mounting positions Mp are close to each other. On the other hand, in the ninth mounting operation MV9 to the twelfth mounting operation MV12 having a relatively large width, the corresponding mounting positions Mp are at a distance from each other.

Next, the inspection support device 90 identifies the inspection component to be inspected among the electronic components held in each suction nozzle 24 based on the inspection information stored in the storage device 35 of the control device 30 (. S22). Here, it is assumed that all 12 electronic components are subject to inspection. Therefore, the image pickup control unit 33 determines in what order the first image pickup operation IV1 to the twelfth image pickup operation IV12 corresponding to the first attachment operation MV1 to the twelfth attachment operation MV12 are executed in the attachment cycle. Determined by the processing of.

The image pickup control unit 33 calculates an execution order pattern (hereinafter referred to as “execution pattern”) of the 12 times of mounting operations MV1 to MV12 and the 12 times of image pickup operations IV1 to IV12 (S23). Here, in order for the above execution pattern to be established, it is a condition that the imaging operation IVn corresponding to the nth mounting operation MVn is executed after the mounting operation MVn. It is permissible for the mounting operation to be continuous in the order according to the control program, and for the imaging operation to be continuous under the above conditions.

With respect to the execution pattern calculated as a candidate for the optimum execution order, the image pickup control unit 33 determines the moving distance of the moving table 22 in the execution order (including the mounting operation and the imaging operation), or the mounting operations MV1 to MV12 and the mounting operations MV1 to MV12 in the execution order. The operation time required for the imaging operations IV1 to IV12 is calculated. In the present embodiment, the image pickup control unit 33 calculates the moving distance of the moving table 22 for each execution pattern (S24).

Specifically, assuming that the mounting operations MV1 to MV12 and the imaging operations IV1 to IV12 are executed in a specific order, the current position NCp of the suction nozzle 24 and the current position CCp of the substrate camera 16 in each operation are mounted. By adding the distance to the position Mp, the moving distance in the execution pattern is calculated. The image pickup control unit 33 determines whether or not the moving distance of the moving table 22 has been calculated for all the execution patterns (S25), and repeats the above process (S24) until the calculation of the moving distance of the moving table 22 is completed.

Subsequently, the image pickup control unit 33 selects the most efficient execution pattern from the plurality of execution patterns based on the movement distance of the moving table 22 calculated for each execution pattern (S26). As a result, the execution order of the 12 times of mounting operations MV1 to MV12 and the 12 times and 12 times of imaging operations IV1 to IV12 is optimized.

The execution pattern of the execution order optimized by the above processing will be described below. Here, a continuous mounting operation among a plurality of mounting operations included in the mounting cycle is referred to as a “mounting group”. If the mounting operations executed in the order according to the control program have already been optimized, the execution order of the imaging operations in the mounting group is as follows: (1) The imaging operations are executed in the same order after the mounting operations are executed. , (2) The imaging operation is executed in the reverse order after the mounting operation is executed, and (3) the mounting operation and the imaging operation are alternately executed.

The "same order" in the above pattern (1) means that the order is the same as the execution order of the plurality of mounting operations, and the "reverse order" in the pattern (2) is the reverse order of the execution order of the plurality of mounting operations. It means that. In FIG. 7, the above patterns (1) to (3) are shown for each mounting group.

As shown in the upper part of FIG. 7, the first mounting group Mg1 including the first mounting operation MV1 to the fourth mounting operation MV4 has a pattern (2), that is, the first mounting operation MV1 to the fourth mounting operation VM4. When the first imaging operation IV1 to the fourth imaging operation IV4 corresponding to these are executed in a series and in the reverse order of the mounting operation, the moving distance of the moving table 22 becomes the shortest.

Further, as shown in the middle part of FIG. 7, the second mounting group Mg2 including the fifth mounting operation MV5 to the eighth mounting operation MV8 has a pattern (1), that is, the fifth mounting operation MV5 to the eighth mounting operation VM8. When the fifth imaging operation IV5 to the eighth imaging operation IV8 corresponding to these are executed in a series and in the same order as the mounting operation, the moving distance of the moving table 22 becomes the shortest.

Further, in the third mounting group Mg3 including the ninth mounting operation MV9 to the twelfth mounting operation MV12, as shown in the lower part of FIG. 7, the pattern (3), that is, the mounting operation and the imaging operation are alternately performed as a set. When executed, the moving distance of the moving table 22 becomes the shortest. Therefore, the execution order optimized by the above processing is the "pattern (2) of the first mounting group Mg1", the "pattern (1) of the second mounting group Mg2", and the "pattern of the third mounting group Mg3 (3). It corresponds to the execution order in which "3)" is concatenated.

In this way, the moving distance of the moving table 22 varies by appropriately exchanging the execution order of the mounting operation and the imaging operation in each mounting group. This is due to the relationship between the mounting position Mp corresponding to each and the distance from the suction nozzle 24 to the optical axis of the substrate camera 16. Therefore, the image pickup control unit 33 sets a plurality of mounting groups based on the mounting position Mp corresponding to each mounting operation MV1 to MV12 acquired in S21 and the execution order of the mounting operation, and calculates the execution pattern (S23). May be done. This makes it possible to calculate the moving distance (S24) more efficiently than calculating all the execution patterns.

(2-4. Interruption of imaging process for inspection in mounting process) The inspection support device 90 has a plurality of mounting operations and a plurality of mounting operations based on preset conditions during execution of the mounting process by the mounting control unit 31. The process of optimizing the execution order of the imaging operations of each time is executed. Here, the above-mentioned preset conditions are, in the present embodiment, the type of parts to be mounted, the current time, the number of mounting operations performed, or the time from the previous inspection to the present.

That is, when at least one of these conditions is satisfied, the image pickup control unit 33 of the inspection support device 90 executes the optimization process. The "part type to be installed" is a condition that the electronic component of the specific part type is to be inspected and the electronic component of the part type is scheduled to be installed in the period from the present to the specified time. Further, when the mounting process by the component mounting machine 1 reaches the execution of the mounting cycle including the mounting of the inspection component, the image pickup control unit 33 performs the image pickup process of the board camera 16 according to the execution order of the optimized image pickup operation. Interrupt the implementation process.

Here, in the automatic inspection or the visual inspection of the component mounting machine 1, if it is determined that the mounting state is defective, the subsequent mounting operation may be canceled from the viewpoint of preventing waste of electronic components. .. That is, after the image data of the inspection component 50 is acquired by the image pickup control unit 33, the mounting operation is temporarily stopped until the quality inspection result is input. The inspection support device 90 utilizes this period to execute a preliminary operation for the next mounting operation.

More specifically, when the inspection in the component mounting machine 1 is a visual inspection by an operator, the display control unit 34 of the control device 30 first displays the image data acquired by the control of the image pickup process by the image pickup control unit 33. Displayed on the device 17. The operator refers to the displayed image data, determines whether the inspection component 50 is in a mounted state, and inputs the result of the determination. At this time, the image pickup control unit 33 moves the suction nozzle 24 from the current position NCp to above the mounting position Mp in the next mounting operation during the period from the acquisition of the above image data to the input of the inspection result. Move it.

By executing the preliminary operation for the next mounting operation during the inspection in this way, for example, when the result that the mounting condition is good is input, the suction nozzle is lowered to promptly move to the next electronic component. The mounting operation can be performed. On the other hand, when the result that the mounting state is defective is input, the subsequent mounting operation is canceled, so that the waste of electronic components is prevented.

(3. Effect of the configuration of the embodiment) In the embodiment, the inspection support device 90 holds the electronic component supplied to the supply position S and transfers the electronic component to the mounting position Mp on the circuit board 40. It is applied to the component mounting machine 1 provided with the mounting device (component transfer device 13). The inspection support device 90 supports an inspection of the mounting state of electronic components mounted on the circuit board 40. The transfer device has a moving table 22 that is supported so as to be relatively movable with respect to the base 2, and a mounting head 23 that supports a plurality of suction nozzles 24 for holding electronic components and is provided on the moving table 22. The inspection support device 90 includes a camera (board camera 16) provided on the mobile table 22 so that the circuit board 40 can be imaged, and an inspection component 50 among electronic components to be inspected in the mounting process by the component mounting machine 1. It is provided with an image pickup control unit 33 that controls the image pickup process of the camera when mounted on the circuit board 40 and acquires the image data containing the inspection component 50. By the operation of the transfer device that moves the suction nozzle 24 from the current position NCp to the upper side of the mounting position Mp and raises and lowers the suction nozzle 24 to mount the inspection component 50 held by the suction nozzle 24 on the mounting position Mp. Therefore, the operation executed in the order according to the control program is defined as the mounting operation. The operation of the transfer device that moves the camera from the current position CCp to the upper side of the mounting position Mp so that the inspection component 50 mounted on the mounting position Mp can be imaged is defined as an imaging operation. The image pickup control unit 33 determines the execution order of the plurality of mounting operations and the plurality of imaging operations based on the moving distance of the moving table 22 in the execution order or the operation time required for the mounting operation and the imaging operation in the execution order. Optimize.

Further, in the inspection method in the embodiment, the execution order of the plurality of mounting operations and the plurality of imaging operations is set to the moving distance of the moving table 22 in the execution order, or the operation time required for the mounting operation and the imaging operation in the execution order. When the inspection component 50 to be inspected among the electronic components in the mounting process by the component mounting machine 1 is mounted on the circuit board 40, the image pickup process of the camera (board camera 16) is controlled. Then, the image data containing the inspection component 50 is acquired.

According to such a configuration, the inspection support device 90 and the inspection support methods (S21 to S26) enable the inspection of the mounting state based on the image data obtained by the imaging of the board camera 16 provided in the machine of the component mounting machine 1. .. Here, in order to acquire the image data containing the inspection component 50, the image pickup process of the substrate camera 16 is executed after the inspection component 50 is mounted on the circuit board 40. In this imaging process, it is necessary to move the moving table 22 so that the inspection component 50 fits in the camera field of view of the substrate camera 16.

However, if the mounting operation and the imaging operation are executed in a series, or the mounting operation and the imaging operation are alternately executed, the mounting position Mp corresponding to each of the multiple mounting operations, the suction nozzle 24, and the substrate camera are used. It has been found that the moving distance of the moving table 22 becomes longer and the efficiency of the imaging process decreases depending on the relationship with the distance to the optical axis of 16.

Therefore, the inspection support device 90 and the inspection support method are based on the moving distance of the moving table 22 in the execution pattern with respect to the mounting operations executed in the order preset by the control program, as illustrated in the present embodiment. Therefore, the timing for executing the imaging operation is optimized. As a result, the necessary image data is efficiently acquired, so that the efficiency of the inspection of the wearing state can be improved.

Further, the operation from holding a plurality of supplied electronic parts by the transfer device (part transfer device 13) to the end of repeated mounting operations equal to the number of times held is defined as a mounting cycle. The image pickup control unit 33 optimizes the execution order for the mounting operation included in the mounting cycle and the imaging operation corresponding to the mounting operation. According to such a configuration, the execution order of a plurality of mounting operations and a plurality of imaging operations is optimized with the mounting cycle as one unit. Therefore, when a plurality of inspection parts 50 are included in the electronic components mounted by one mounting cycle, the necessary imaging is performed while suppressing the influence on the mounting process in the mounting cycle without affecting the other mounting cycles. Processing can be executed.

Further, a plurality of imaging operations (first mounting group Mg1 and second mounting group Mg2) corresponding to each of the plurality of continuous mounting operations in the mounting cycle are executed in series after the plurality of mounting operations are completed. According to such a configuration, for example, when the mounting positions Mp of the plurality of inspection parts 50 mounted by the second mounting group Mg2 are relatively close to each other, the mounting operations corresponding to these inspection parts 50 are executed in a series. After that, a plurality of imaging operations are collectively executed in a series. As a result, the moving distance of the moving table 22 due to the execution of the imaging process can be shortened.

Further, the plurality of imaging operations corresponding to each of the plurality of mounting operations are executed in the reverse order of the execution order of the plurality of mounting operations. According to such a configuration, for example, in a state where the suction nozzle 24 is located above the mounting position Mp corresponding to the final mounting operation in the first mounting group Mg1, the position of the substrate camera 16 in this state is the first mounting. When the mounting position Mp corresponding to the position Mp is closer to the mounting position Mp corresponding to the final mounting operation, the mounting operations corresponding to these inspection parts 50 are executed in the reverse order of the mounting operations. As a result, the moving distance of the moving table 22 due to the execution of the imaging process can be shortened.

Further, a plurality of imaging operations (third mounting group Mg3) corresponding to each of the plurality of continuous mounting operations in the mounting cycle are executed after the corresponding mounting operations are executed. According to such a configuration, when the mounting positions Mp of the plurality of inspection components 50 mounted by the mounting group Mg3 are relatively far, the mounting operation and the imaging operation corresponding to these inspection components 50 are alternately executed. As a result, it is possible to prevent the moving distance of the moving table 22 from being extended by executing the imaging process.

Further, the image pickup control unit 33 executes a process of optimizing the execution order of a plurality of mounting operations and a plurality of imaging operations based on preset conditions during the execution of the mounting process by the component mounting machine 1. Then, the image pickup process of the camera (board camera 16) is interrupted by the mounting process. According to such a configuration, it is possible to inspect electronic parts of a part type in which mounting accuracy is particularly required, or to perform regular inspections. Therefore, the quality of the circuit board 40 product is maintained.

The preset conditions are the type of parts to be mounted, the current time, the number of mounting operations performed, or the time from the previous inspection to the present. According to such a configuration, the inspection can be performed by the operator at any timing. As a result, the quality of the circuit board 40 product is suitably maintained.

Further, the image pickup control unit 33 reserves moving the suction nozzle 24 from the current position NCp to above the mounting position Mp in the next mounting operation during the period from the acquisition of the image data to the input of the inspection result. Perform the action. As a result, for example, when a result that the mounting state is good is input, the suction nozzle 24 can be lowered to promptly execute the mounting operation related to the next electronic component. Therefore, the decrease in throughput associated with the execution of the imaging process is suppressed. Further, when the result that the mounting state is defective is input, the subsequent mounting operation is canceled, so that the waste of electronic components can be prevented.

<Modification of the Embodiment> In the embodiment, the image pickup control unit 33 of the inspection support device 90 calculates the movement distance of the moving table 22 in the execution order of the mounting operation and the image pickup operation for the plurality of execution patterns calculated in S23. (S24). On the other hand, the image pickup control unit 33 may calculate the operation time (required time) required for the mounting operations MV1 to MV12 and the image pickup operations IV1 to IV12 in the execution order for the plurality of execution patterns.

That is, in S26, the image pickup control unit 33 selects the optimum execution order based on the required time when each execution order is executed instead of the moving distance of the moving table 22. Here, there is a correlation between the moving distance of the moving table 22 and the required time, but it is not necessarily a proportional relationship. This includes the time required for acceleration and deceleration in the operation of the component transfer device 13, the movement operation of the moving table 22 and the operation of the mounting head 23 (for example, the indexing operation of the suction nozzle 24). Is due to the fact that can be executed in parallel.

Therefore, the image pickup control unit 33 may be configured to optimize the execution order based on the required time. This makes it possible to more accurately optimize the execution order of the mounting operation and the imaging operation as compared with the case based on the moving distance of the moving table 22. Further, from the viewpoint of reducing the processing load due to optimization, the embodiment exemplified in the embodiment is preferable.

Further, in the embodiment, the inspection support device 90 targets one mounting cycle for optimization. On the other hand, the inspection support device 90 may collectively target a plurality of mounting cycles for optimization, or may target a mounting group that is a part of the mounting cycle for optimization. With such a configuration, the same effect as that of the embodiment is obtained.

1: Parts mounting machine 2: Base 13: Parts transfer device (transfer device) 22: Moving table, 23: Mounting head, 24: Suction nozzle 16: Board camera (camera) 30: Control device, 33: Imaging Control unit, 40: Circuit board, 50: Inspection component (electronic component) 90: Inspection support device Sp: Supply position, Mp: Mounting position NCp: Current position NCp1: First current position, NCp2: Second current position CCp: Current Position CCp1: First current position, CCp2: Second current position Mg1: First mounting group Mg2: Second mounting group Mg3: Third mounting group

Claims (2)

In a component mounting machine equipped with a mounting head that supports multiple suction nozzles that hold electronic components,
It is an inspection method for inspecting the mounting state of an electronic component mounted at a mounting position on a circuit board by using a camera provided on the same moving table as the mounting head.
The mounting head moves the camera from the current position to above the mounting position so that the electronic component mounted at the mounting position can be imaged, and the imaging process of the camera is controlled so that the electronic component is stored. The step to acquire the obtained image data and
During the period from the acquisition of the image data to the input of the inspection result, the preliminary operation of moving the suction nozzle from the current position to the upper side of the next mounting position is executed in parallel, and the suction is performed. The step of raising and lowering the nozzle to stop the mounting operation of mounting the electronic component held by the suction nozzle to the mounting position and the subsequent step of lowering the suction nozzle when the result of the inspection is judged to be good. An inspection method having a step of performing a mounting operation. In a component mounting machine equipped with a mounting head that supports multiple suction nozzles that hold electronic components,
It is an inspection method for inspecting the mounting state of an electronic component mounted at a mounting position on a circuit board by using a camera provided on the same moving table as the mounting head.
The mounting head moves the camera from the current position to above the mounting position so that the electronic component mounted at the mounting position can be imaged, and the imaging process of the camera is controlled so that the electronic component is stored. The step to acquire the obtained image data and
The step of displaying the acquired image data on the display device, and
During the period from the display of the image data to the input of the inspection result by the operator, the preliminary operation of moving the suction nozzle from the current position to the upper side of the next mounting position is executed in parallel. An inspection method including a step and a step of lowering the suction nozzle and executing a subsequent mounting operation when the result of the inspection is determined to be good.

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