CN104472031B - Check head, apparatus for work and electronic component mounting production line - Google Patents
Check head, apparatus for work and electronic component mounting production line Download PDFInfo
- Publication number
- CN104472031B CN104472031B CN201280074753.6A CN201280074753A CN104472031B CN 104472031 B CN104472031 B CN 104472031B CN 201280074753 A CN201280074753 A CN 201280074753A CN 104472031 B CN104472031 B CN 104472031B
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- China
- Prior art keywords
- work
- inspection
- head
- substrate
- check
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 238000007689 inspection Methods 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000012545 processing Methods 0.000 claims abstract description 15
- 238000003860 storage Methods 0.000 claims abstract description 5
- 238000009434 installation Methods 0.000 claims description 10
- 238000005286 illumination Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 abstract description 13
- 230000009471 action Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 230000006854 communication Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
A kind of technology is provided, can be carried out with less manpower from the surface mounting apparatus of apparatus for work to the replacement operation of check machine and from check machine to the replacement operation of surface mounting apparatus.It can be installed on subject description discloses a kind of as operation head for carrying out the apparatus for work of operation to substrate to check the inspection head of the surface state of substrate.Inspection head is equipped with：Camera, shoots substrate and obtains view data；Storage medium, can store inspection processing routine and check reference data；And control unit, according to processing routine is checked, inspection processing is performed based on the view data and inspection reference data that are obtained from camera.
Description
Technical field
This specification is related to inspection head, apparatus for work and electronic component mounting production line.
Background technology
Following technology has been recorded in Japanese Unexamined Patent Publication 2011-243884 publications：Make to be encased in electronic component installation life
One apparatus for work of producing line can be acted as surface mounting apparatus, or be acted as check machine.In the art, install
There is operation head of the mounting head as apparatus for work, and loader device is installed to apparatus for work, thus enable that apparatus for work
Acted as surface mounting apparatus.Moreover, in the art, the operation head of apparatus for work will be installed on and be replaced by inspection from mounting head
Head is looked into, and the loader device for being installed on apparatus for work is replaced by inspection computer, thus enables that apparatus for work is made
Acted for check machine.According to the technology, an apparatus for work can be used as surface mounting apparatus, can also be used as inspection
Machine and use, therefore, it is possible to easily carry out the replacing of electronic component mounting production line.
The content of the invention
In the technology that Japanese Unexamined Patent Publication 2011-243884 publications are recorded, changed by apparatus for work from surface mounting apparatus
, it is necessary to which mounting head to be replaced by the operation for checking head and loader device being replaced by inspection computer during for check machine,
Replacement operation needs time and manpower.When apparatus for work is replaced by into surface mounting apparatus from check machine, it is also desirable to head will be checked
It is replaced by mounting head and inspection is replaced by the operation of loader device with computer, replacement operation needs time and manpower.
Expect a kind of replacement operation that can be carried out with less manpower from surface mounting apparatus to check machine and pacify from check machine to surface
The technology of the replacement operation of installation.
The apparatus for work for carrying out operation to substrate can be installed on subject description discloses a kind of as operation head
With the inspection head for the surface state for checking substrate.Inspection head is equipped with：Camera, shoots substrate and obtains view data；Storage
Medium, can store inspection processing routine and check reference data；And control unit, according to processing routine is checked, based on from camera
The view data and inspection reference data of acquirement are handled to perform inspection.
By being installed on apparatus for work using inspection head as described above as operation head, calculated without separately installation check
Machine, can be such that apparatus for work is acted as check machine.Therefore, changed by apparatus for work from surface mounting apparatus to check machine
When, it is not necessary to the operation for changing loader device with computer to inspection.Moreover, by apparatus for work from check machine to surface
When fitting machine is changed, it is not necessary to the operation for pulling down inspection with computer., can be with more by using inspection head as described above
Few manpower carries out the surface mounting apparatus from apparatus for work to the replacement operation of check machine and from check machine to surface mounting apparatus
Replacement operation.
Above-mentioned inspection head is configured to, and above-mentioned control unit can be carried out with the computer of the outside of above-mentioned apparatus for work
Communication, and the inspection result data of inspection result will be represented to the computer export of the outside of above-mentioned apparatus for work.
Above-mentioned inspection head is configured to, and also carries the illumination for shooting that oriented substrate irradiates light for shooting.
This specification also discloses that the apparatus for work for being provided with above-mentioned inspection head as operation head.Moreover, this specification
Also disclose that and be configured with the mounting head for installing oriented substrate installation electronic component as the downstream of the apparatus for work of operation head
The electronic component mounting production line of above-mentioned apparatus for work.
The detailed content of the technology of this disclosure is illustrated by the embodiment of following invention.
Brief description of the drawings
Fig. 1 is the figure of the structure for the electronic component mounting production line 2 for representing embodiment.
Fig. 2 is the block diagram of the structure for the apparatus for work 6 for representing embodiment.
Fig. 3 is the transverse sectional view of the outline of the mechanical structure for the apparatus for work 6 for representing embodiment.
Fig. 4 is the block diagram of the structure for the apparatus for work 10 for representing embodiment.
Embodiment
(embodiment)
Electronic component mounting production line 2 shown in Fig. 1 is main possess screen process press 4, multiple apparatus for work 6,8,10, return
Flow stove 12, master controller 14.Cream solder is carried out silk-screen printing by screen process press 4 to substrate.Apparatus for work 6,8,10 is carried out
Installation from electronic component to substrate or substrate surface state inspection.Reflow ovens 12 are heated to substrate and make cream solder
Fusing.14 pairs of master controller includes screen process press 4, apparatus for work 6,8,10, the electronic component mounting production line 2 of reflow ovens 12
The action of each device be controlled.
Apparatus for work 6,8,10 is modular, and by the species of change operation head, can both be carried out as surface mounting apparatus
Action, can also be acted as check machine.As one, in the present embodiment, illustrate that apparatus for work 6,8 is used as to substrate
The surface mounting apparatus of installation electronic component is acted and apparatus for work 10 enters as the check machine for the surface state for checking substrate
The situation that action is made.
As shown in Fig. 2 possessing mounting head 30, retainer 20, retainer driving dress as the apparatus for work 6 of surface mounting apparatus
Put 22, loader device 24, substrate transfer apparatus 26, module controller 28.Substrate transfer apparatus 26 is moved into from upstream side
The substrate of process units (being screen process press 4 in the case of apparatus for work 6), is held in after job position by substrate,
Downstream the process units (being apparatus for work 8 in the case of apparatus for work 6) of side takes out of substrate.Loader device 24 supply to
The electronic component that substrate is installed.Loader device 24 can be loaded and unloaded relative to apparatus for work 6.It can pacify on retainer 20
Fill mounting head 30 or the first 32 grade operation head of inspection described later.In the present embodiment, apparatus for work 6 enters action as surface mounting apparatus
Make, therefore mounting head 30 is installed on retainer 20.
Mounting head 30 possesses suction nozzle 34, suction nozzle drive device 36, handling switching device 38, head controller 40.Suction nozzle 34 leads to
Cross and carry out stick electronic components in its front end generation negative pressure, the absorption to electronic component is released by producing malleation in its front end.
Suction nozzle drive device 36 adjusts relative position and posture of the suction nozzle 34 relative to retainer 20.Switching device 38 is loaded and unloaded in suction nozzle 34
Front end connection negative pressure path state with the front end of suction nozzle 34 connect the state in malleation path between switch over, thus cut
Change handling of the electronic component relative to suction nozzle 34.Head controller 40 controls suction nozzle drive device 36 and loads and unloads the dynamic of switching device 38
Make.
As shown in figure 3, retainer drive device 22 make retainer 20 loader device 24 and substrate transfer apparatus 26 it
Between reciprocating action.Mounting head 30 is moved to the top of loader device 24, the electronic component in component feeding position is inhaled
The front end of suction nozzle 34 is invested, mounting head 30 is moved to the top of substrate transfer apparatus 26, makes at component installation location
Electronic component departs from from the front end of suction nozzle 34, thus, it is possible to carry out installation of the electronic component to substrate.
Fig. 2 module controller 28 is filled to mounting head 30, retainer drive device 22, loader device 24, board carrying
The action for putting 26 is controlled.Module controller 28 can by communication loops such as universal serial bus, wired lan, WLANs with
Head controller 40 is communicated.Head controller 40 can by communication loops such as wired lan or WLANs with master controller 14
Communicated.Module controller 28 reads production operation from master controller 14, controls operation to fill according to the production operation of reading
Put 6 action.Moreover, module controller 28 sends situation of operation of apparatus for work 6 etc. to master controller 14.
As shown in figure 4, possessing inspection first 32, retainer 20, retainer drive device as the apparatus for work 10 of check machine
22nd, substrate transfer apparatus 26, module controller 28.Retainer 20, retainer drive device 22, substrate transfer apparatus 26, module
The structure of controller 28 and apparatus for work 6 are same.In the present embodiment, apparatus for work 10 is acted as check machine, therefore
First 32 will be checked as operation head and be installed on retainer 20.
Check that first 32 possess camera 42, illumination 44 for shooting, head controller 46 (equivalent to control unit).Camera 42 shoot by
Substrate transfer apparatus 26 is maintained at the substrate on job position, and view data is exported to head controller 46.Illumination for shooting
44 irradiate light for shooting to the substrate that job position is held in by substrate transfer apparatus 26.Head controller 46 to camera 42 and
The action of illumination 44 for shooting is controlled.
Head controller 46 possesses CPU, ROM, RAM, flash memory etc..ROM, RAM, flash memory of head controller 46 etc. (equivalent to
Storage medium) in be previously stored with inspection processing routine and check reference data.Head controller 46 can by universal serial bus, have
The communication loops such as line LAN, WLAN and communicated with module controller 28.Moreover, head controller 46 can be by wired
The communication loop such as LAN or WLAN and communicated with master controller 14 (equivalent to the computer of the outside of apparatus for work 10).
Module controller 28 reads production operation from master controller 14, and the dynamic of apparatus for work 10 is controlled according to the production operation of reading
Make.Head controller 46 is controlled to obtain view data, and the picture number based on acquirement to camera 42 and illumination 44 for shooting
Handled according to the inspection with reference data is checked to implement substrate.In the inspection processing that head controller 46 is carried out, such as by inciting somebody to action
The inspection reference data of the image of substrate of the view data obtained by camera 42 with being denoted as certified products is compared, can
Whether there is skew or defect, the electronic component being installed on substrate whether there is missing or position/angles to the solder being printed onto on substrate
Deviation, there is foreign etc. to be judged.Head controller 46 will represent the inspection result data of inspection result to master controller 14
Send., can also be by addition, head controller 46 will can be respectively transmitted every time for the inspection result data of each substrate
Inspection result for multiple substrates is collected and sends the inspection result data after aggregation process.
In the inspection first 32 of the present embodiment, head controller 46 storage check processing routine and check reference data, based on from
View data that camera 42 is obtained and check reference data to implement inspection processing, and by inspection result data to master controller 14
Send.Therefore, checking between first 32 and master controller 14 or checking between first 32 and module controller 28, it is big without transmitting-receiving
The view data of capacity.First 32 and module controller 28 are checked between first 32 and master controller 14 or check therefore, it is possible to mitigate
Between communication loop load.Moreover, master controller 14, the load of the communication process of module controller 28 can be mitigated, make
The having stable behavior of these controllers.Moreover, the transmitting path of view data can shorten, therefore as the object for checking processing
View data is difficult to be influenceed by noise, Signal Degrade, it is possible to increase check the reliability of processing.It is stored in head controller 46
Inspection processing routine and check reference data can be rewritten from master controller 14.
Furthermore it is possible to be, head controller 46 reads production operation from master controller 14, and head controller 46 passes through module control
Device 28 controls the action of each several part of process units 10.
In electronic component mounting production line 2, the configuration of surface mounting apparatus to be changed and check machine is occasionally wanted to.Such
In the case of, in the apparatus for work 6,8,10 of the present embodiment, can easily carry out replacing from from surface mounting apparatus to check machine,
From check machine to the replacing of surface mounting apparatus.
For example, in the case where apparatus for work 8 is changed from surface mounting apparatus to check machine, retainer 20 will be installed on
Mounting head 30 is replaced by inspection first 32.Thereby, it is possible to make apparatus for work 8 be acted as check machine.In addition, making apparatus for work
The 8 loader devices 24 installed when being acted as surface mounting apparatus will not be impacted as the action of check machine, because
This can intactly be installed on apparatus for work 8, can also pull down.Or can as loader device 24 mounting table or
Adjust platform and utilized., can be by apparatus for work 8 from surface mounting apparatus by simple replacement operation according to the present embodiment
It is replaced by check machine.
When apparatus for work 10 is changed from check machine to surface mounting apparatus, by the inspection first 32 for being installed on retainer 20 more
It is changed to mounting head 30.Moreover, the loader device 24 of electronic component that should be installed to substrate will be supplied to apparatus for work 10 again
Install.According to the present embodiment, by simple replacement operation, apparatus for work 10 can be replaced by surface from check machine and installed
Machine.
On the representative and non-limiting concrete example of the present invention, it is illustrated in detail referring to the drawings.This is detailed
Illustrate merely to want to show the details of the preferred example for implementing the present invention to those skilled in the art, be not limit
Determine the scope of the present invention.Moreover, disclosed additional feature and invention fill to provide the inspection head after further improving, operation
Put and electronic component mounting production line, can separately or together be used with other features or invention.
In addition, the combination of the feature, process disclosed in above-mentioned detailed description is not real in the widest meaning
It is necessary to apply the present invention, merely to illustrating the representational concrete example of the present invention and recording.Moreover, above-mentioned generation
The various features for the structure that the various features and independence and dependent claims of the concrete example of table are recorded are providing the present invention
Addition and during useful embodiment, it is not essential however to enter as the concrete example recorded herein or as enumerating order
Row combination.
The feature that whole features that this specification and/or claim are recorded are recorded with embodiment and/or claim
Structure is different and is intended to as the restriction to application disclosure originally and the specific item of prescription, respectively and independently of each other
It is open.Moreover, the record on whole number ranges and group or group is as to applying for disclosure originally and prescription
The restriction of specific item, the intention of the structure with the centre for disclosing them.
More than, although the concrete example of the present invention is described in detail by, but they are only illustrated, and not limiting right will
The scope asked.The concrete example that the technology that claims are recorded includes illustrating to more than carries out various modifications, the technology of change.
The technology essential factor illustrated in this specification or accompanying drawing individually or by various combinations plays technology serviceability, is not defined to Shen
Please when claim record combination.Moreover, this specification or the technology illustrated in accompanying drawing can realize multiple purposes simultaneously, it is real
Existing one of purpose itself just has technology serviceability.
Claims (5)
1. one kind checks head, the apparatus for work for carrying out operation to substrate can be installed on as replaceable operation head,
To check the surface state of substrate, the apparatus for work includes：Installation exercise device and Inspection device,
The inspection head is equipped with：
Camera, shoots substrate and obtains view data；
Storage medium, can store inspection processing routine and check reference data；And
Control unit, according to processing routine is checked, inspection is performed based on the view data and inspection reference data that are obtained from camera
Processing.
2. inspection head according to claim 1, wherein,
The control unit can be communicated with the computer of the outside of the apparatus for work, and the inspection that will represent inspection result
Computer export from result data to the outside of the apparatus for work.
3. inspection head according to claim 1, wherein,
It is described to check that head also carries the illumination for shooting that oriented substrate irradiates light for shooting.
4. a kind of apparatus for work, is provided with inspection head according to any one of claims 1 to 3 as operation head.
5. a kind of electronic component mounting production line, the work of operation head is used as in the mounting head for installing oriented substrate installation electronic component
The downstream of industry device is configured with the apparatus for work described in claim 4.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/068231 WO2014013572A1 (en) | 2012-07-18 | 2012-07-18 | Inspection head, work apparatus, and electronic-component mounting line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104472031A CN104472031A (en) | 2015-03-25 |
| CN104472031B true CN104472031B (en) | 2017-08-15 |
Family
ID=49948427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280074753.6A Active CN104472031B (en) | 2012-07-18 | 2012-07-18 | Check head, apparatus for work and electronic component mounting production line |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6023196B2 (en) |
| CN (1) | CN104472031B (en) |
| WO (1) | WO2014013572A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018220788A1 (en) * | 2017-06-01 | 2018-12-06 | ヤマハ発動機株式会社 | Inspection result notification method, inspection result notification apparatus, and component mounting system |
| WO2019180861A1 (en) * | 2018-03-22 | 2019-09-26 | 株式会社Ｆｕｊｉ | Constitutive device quality determination server, inspection system, inspection system terminal device, and inspection device |
| JP7149456B2 (en) * | 2018-05-30 | 2022-10-07 | パナソニックＩｐマネジメント株式会社 | Component mounter |
| EP3846604A4 (en) * | 2018-08-28 | 2021-09-15 | Fuji Corporation | Control program checking device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6375503A (en) * | 1986-09-19 | 1988-04-05 | Toshiba Corp | Positioning device for parts with lead |
| JP3903910B2 (en) * | 2002-11-21 | 2007-04-11 | 松下電器産業株式会社 | Image reading apparatus and image reading method |
| CN101360415A (en) * | 2007-08-01 | 2009-02-04 | Juki株式会社 | surface mount device |
| CN102293076A (en) * | 2009-01-23 | 2011-12-21 | 松下电器产业株式会社 | Component assembly line and component assembly method |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003015491A1 (en) * | 2001-08-08 | 2003-02-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic parts |
| JP4163452B2 (en) * | 2002-05-31 | 2008-10-08 | 松下電器産業株式会社 | Component mounting board production equipment |
| JP2006214820A (en) * | 2005-02-02 | 2006-08-17 | Yamaha Motor Co Ltd | Device and method for inspecting substrate |
| JP4852516B2 (en) * | 2007-11-22 | 2012-01-11 | パナソニック株式会社 | Substrate inspection method and substrate inspection apparatus |
| JP2011082243A (en) * | 2009-10-05 | 2011-04-21 | Panasonic Corp | Component mounting device, and mounting-state inspection method in the same |
| JP5117479B2 (en) * | 2009-12-03 | 2013-01-16 | パナソニック株式会社 | Component mounting system |
| JP5773474B2 (en) * | 2010-05-20 | 2015-09-02 | 富士機械製造株式会社 | Component mounting system |
| JP5787504B2 (en) * | 2010-10-15 | 2015-09-30 | 富士機械製造株式会社 | Component mounting system and component inspection method in component mounting system |
-
2012
- 2012-07-18 CN CN201280074753.6A patent/CN104472031B/en active Active
- 2012-07-18 WO PCT/JP2012/068231 patent/WO2014013572A1/en active Application Filing
- 2012-07-18 JP JP2014525605A patent/JP6023196B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6375503A (en) * | 1986-09-19 | 1988-04-05 | Toshiba Corp | Positioning device for parts with lead |
| JP3903910B2 (en) * | 2002-11-21 | 2007-04-11 | 松下電器産業株式会社 | Image reading apparatus and image reading method |
| CN101360415A (en) * | 2007-08-01 | 2009-02-04 | Juki株式会社 | surface mount device |
| CN102293076A (en) * | 2009-01-23 | 2011-12-21 | 松下电器产业株式会社 | Component assembly line and component assembly method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104472031A (en) | 2015-03-25 |
| JP6023196B2 (en) | 2016-11-09 |
| JPWO2014013572A1 (en) | 2016-06-30 |
| WO2014013572A1 (en) | 2014-01-23 |
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