JP7149456B2 - Component mounter - Google Patents

Description

The present invention relates to a component mounting apparatus for mounting components on a substrate.

As a component mounting apparatus for mounting components on a board, a mounting head equipped with a nozzle is horizontally moved by a head movement mechanism, and the nozzle is raised and lowered to take out a component supplied from a component supply unit and place it at a predetermined position on the board. is known (see, for example, Patent Document 1). In the component mounting apparatus described in Patent Document 1, the mounting head is provided with a head control section that controls the up-and-down movement of nozzles in the mounting head, in addition to a control section that controls the operation of each section of the component mounting apparatus, including the head moving mechanism. ing. The head controller is connected to the controller by signal wiring, and controls various operations of the nozzles according to instructions sent from the controller.

JP 2013-179190 A

However, in the prior art including Patent Document 1, since the head control section arranged in the mounting head that moves in the horizontal direction and the control section fixedly arranged in the main body are connected by signal wiring, as described below. I had a problem. That is, in order to connect the signal wiring to the mounting head so as not to interfere with the operation of the mounting head that moves over a wide range in the component mounter, there is a flexible long movable wiring and a member for routing the movable wiring so that the movable wiring does not break. is necessary. In addition, since the movable wiring and the routing member are moved together with the mounting head, a head moving mechanism with high driving capability is required, which makes it difficult to reduce costs.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus capable of reducing the number of movable wirings for transmitting operation instructions to a mounting head that moves in the horizontal direction.

A component mounting apparatus of the present invention is a component mounting apparatus comprising a mounting head for mounting a component on a board by raising and lowering a nozzle attached to a lower end, the component mounting apparatus having a wireless communication section. and a moving unit to which the mounting head is replaceably attached and which moves the mounting head in a horizontal direction, wherein the moving unit wirelessly communicates with the main body control unit for unit communication The body control unit controls the up-and-down operation of the nozzles in the mounting head by transmitting operation instructions to the unit communication unit by wireless communication, and the component mounting apparatus includes a plurality of moving units. Unique unit identification information is assigned to each mobile unit, and the main body control section recognizes the unit communication section of the mobile unit that transmits the operation instruction based on the unit identification information .

According to the present invention, it is possible to reduce the number of movable wirings for transmitting operation instructions to the mounting head that moves horizontally.

1 is a perspective view showing the overall configuration of a component mounting apparatus according to one embodiment of the present invention; (a) and (b) are configuration explanatory diagrams of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to one embodiment of the present invention; FIG.

An embodiment of the present invention will be described in detail below with reference to the drawings. The configuration, shape, and the like described below are examples for explanation, and can be changed as appropriate according to the specifications of the component mounting apparatus and the mounting head. In the following, the same reference numerals are given to the corresponding elements in all the drawings, and redundant explanations are omitted. Hereinafter, the substrate transport direction (vertical direction in FIG. 2) is the X direction, the direction orthogonal to the X direction in the horizontal plane (horizontal direction in FIG. 2) is the Y direction, and the direction orthogonal to the horizontal plane (vertical direction in FIG. 2) is Define the Z direction.

First, with reference to FIGS. 1 and 2, the configuration and functions of the component mounting apparatus 1 will be described. The component mounting apparatus 1 has a function of manufacturing a mounting board by mounting a component on the board. In FIG. 1, a substrate transfer mechanism 2 extending in the X direction is installed on the upper surface of a base 1a. The substrate transport mechanism 2 receives the substrate 3 to be mounted with components from an upstream device (not shown), transports it to a mounting position in the component mounting apparatus 1, and positions and holds it. Further, the board transfer mechanism 2 carries out the board 3 on which the component mounting work is completed to the downstream side.

A component supply unit 4 is installed on both sides of the board transfer mechanism 2 . A plurality of tape feeders 5 are arranged side by side in the X direction in each of the component supply units 4 . The tape feeder 5 has a function of conveying a carrier tape containing components to a component pickup position by a mounting head 10 described below.

Y-axis tables 7 each having a linear driving mechanism are arranged in the Y direction on the upper surfaces of a pair of frame members 6 arranged at both ends in the X direction in the component mounting apparatus 1 . Between the Y-axis tables 7, a beam 8 similarly provided with a linear drive mechanism is installed so as to be freely movable in the Y direction. A moving base 9 is coupled to the beam 8 so as to be freely movable in the X direction. A mounting head 10 is mounted on the moving base 9 . The mounting head 10 is detachable from the moving base 9 .

In FIG. 2A, the mounting head 10 includes a plurality of nozzle units 10a. At the lower end of each nozzle unit 10a, a suction nozzle 10b for vacuum-sucking and holding a component supplied by the tape feeder 5 is attached. Each nozzle unit 10a has an elevation/rotation mechanism that raises and lowers the suction nozzle 10b and rotates it around the Z-axis by θ.

Further, each nozzle unit 10a has a valve for supplying vacuum pressure and compressed air supplied from the apparatus main body to the suction nozzle 10b and stopping the supply. A mounting head controller 11 is incorporated in the mounting head 10 . The mounting head control unit 11 controls the lifting and rotating mechanism to lift and lower the suction nozzle 10b and rotate it by θ. Also. The mounting head control unit 11 controls the valve to cause the suction nozzle 10b to pick up the component, and to release the component from the suction nozzle 10b. That is, the mounting head controller 11 controls various operations of the suction nozzles 10 b in the mounting head 10 .

In FIG. 1, the Y-axis table 7 and the beam 8 constitute a mounting head moving mechanism 12 for moving the mounting head 10 in horizontal directions (X direction and Y direction). The mounting head moving mechanism 12 moves the mounting head 10 in the horizontal direction, lifts and lowers the suction nozzle 10b (nozzle) attached to the lower end, picks up the component from the tape feeder 5, and transfers the retained component to the substrate 3. Mounting.

A body control section 13 having a wireless communication function and controlling each section of the component mounting apparatus 1 is arranged on the base 1a. That is, the main body control section 13 is arranged at a fixed position in the component mounting apparatus 1, and has a function of transmitting an operation instruction to the mounting head control section 11 that moves in the horizontal direction.

FIG. 2(a) shows a cross section of the beam 8 with the mounting head 10 mounted on the moving base 9. FIG. A back surface member 14 is provided on the back surface of the mounting head 10 . As shown in FIG. 2(b), the back member 14 is detachably attached to the moving base 9 coupled to the beam 8 (arrow a).

A plurality of types of mounting heads 10 having different numbers of suction nozzles 10b are prepared in advance according to the shape, size, and the like of components to be mounted on the substrate 3 . A mounting head 10 selected according to the mounting board to be manufactured is mounted on the moving base 9 . It should be noted that the nozzles provided in the mounting head 10 are not limited to the suction nozzles 10b that suck components by vacuum pressure. The mounting head 10 may include a nozzle provided with a body chuck for holding the component, or a nozzle provided with a lead chuck for holding the lead of the lead component.

In FIG. 2(a), the moving base 9 is coupled to the beam 8 via a pair of slide guides 15 so as to be freely movable in the X direction. The moving base 9 is driven in the X direction with respect to the beam 8 by a linear motor 16 (linear drive mechanism). The linear motor 16 has a structure in which a mover 16b coupled to the move base 9 faces a stator 16a arranged in the beam 8 in the X direction. A substrate recognition camera 17 is arranged at the lower end of the moving base 9 with its imaging direction facing downward. The board recognition camera 17 moves horizontally together with the mounting head 10 to pick up an image of a board mark (not shown) provided on the board 3 .

A connector holder 19 is coupled to the upper end of the moving base 9 via a horizontal coupling member 18 . The connector holding portion 19 incorporates a unit communication portion 20 that wirelessly communicates with the body control portion 13 . The unit communication section 20 is connected to the board recognition camera 17 via wiring, and exchanges electrical signals with the board recognition camera 17 . The upper portion of the mounting head 10 and the connector holding portion 19 are connected via a piping connector 21 and a wiring connector 22 . The piping connector 21 has a function of supplying vacuum pressure and compressed air to the mounting head 10 from the apparatus main body. The wiring connector 22 has a function of supplying power to the mounting head 10 from the main body of the apparatus. Further, the mounting head control section 11 and the unit communication section 20 exchange electric signals via the wiring connector 22 .

As shown in FIG. 2B, when the back member 14 is removed from the moving base 9, the head-side connection portions 21a and 22a provided on the mounting head 10 in the pipe connector 21 and the wiring connector 22 are connected to the connector holding portions. 19 are separated from the main body side connecting portions 21b and 22b. When mounting the mounting head 10 on the component mounting apparatus 1, the rear member 14 is fixedly coupled to the moving base 9 of the component mounting apparatus 1, and the head-side connecting portions 21a and 22a are attached to the main body provided in the connector holding portion 19. It is made to fit to the part side connection parts 21b and 22b.

Thus, the moving base 9, the mounting head moving mechanism 12, and the connector holding portion 19 constitute a moving unit 30 (see FIG. 3) to which the mounting head 10 is replaceably attached and which moves the mounting head 10 in the horizontal direction. . The mobile unit 30 has a unit communication section 20 that wirelessly communicates with the body control section 13 . Further, the mobile unit 30 is equipped with a camera (board recognition camera 17 ) that is connected to the unit communication section 20 and captures an image of the lower side.

Although the component mounting apparatus 1 shown in FIG. 1 has one beam 8, the component mounting apparatus 1 includes a plurality of (for example, two) beams 8 between the Y-axis tables 7. may be That is, the component mounting apparatus 1 may be provided with a plurality of moving units 30 and the mounting head 10 may be attached to each of the moving units 30 . Further, the wireless communication between the main body control section 13 and the unit communication section 20 may be communication using light, sound waves, or the like, in addition to communication using radio waves. In other words, it is sufficient if the transmission and reception of signals and data can be realized wirelessly without connecting the main body control section 13 and the unit communication section 20 with a direct wire.

Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 includes a substrate transport mechanism 2 , a component supply section 4 , a mounting head moving mechanism 12 , a body control section 13 and a touch panel 31 . The touch panel 31 displays various information on its display section, and the operator inputs data and operates the component mounting apparatus 1 using operation buttons displayed on the display section.

A moving unit 30 including the mounting head moving mechanism 12 and the connector holding section 19 has a unit communication section 20 . The unit communication section 20 is connected via a wiring connector 22 to a mounting head control section 11 included in the mounting head 10 mounted on the moving base 9 . In addition, the unit communication section 20 is connected by wiring to the board recognition camera 17 arranged on the moving base 9 .

In FIG. 3 , the connector holding section 19 includes a unit storage section 32 in addition to the unit communication section 20 . The unit storage section 32 is a storage device, and stores unit identification information 32a and the like. The unit identification information 32 a is unique information that identifies the mobile unit 30 . That is, when the component mounting apparatus 1 includes a plurality of moving units 30, each moving unit 30 is given different unique unit identification information 32a.

The mounting head 10 includes a nozzle unit 10 a , a mounting head controller 11 , and a mounting head memory 33 . The mounting head storage unit 33 is a storage device, and stores nozzle control data 33a, head identification information 33b, and the like. In the nozzle control data 33a, based on the operation instruction transmitted from the main body control unit 13, the mounting head control unit 11 controls the nozzle unit 10a to raise and lower the suction nozzle 10b, rotate it θ, and attach/detach various parts. Control data for operation are stored. The head identification information 33b is unique information for specifying the mounting head 10, and different head identification information 33b is assigned to each mounting head 10. FIG. That is, each mounting head 10 is provided with different unique head identification information 33b.

In FIG. 3 , the body control unit 13 includes a mounting storage unit 34 , a mounting control unit 35 , a recognition processing unit 36 and a wireless communication unit 37 . The mounting storage unit 34 is a storage device, and stores mounting data including the size of the board 3, the position of the board mark, the type of components to be mounted on the board 3, and the coordinates of the mounting position for each type of mounting board to be manufactured. It is The radio communication section 37 is a radio communication device, and exchanges signals and data with the unit communication section 20 provided in the mobile unit 30 by radio.

When the mounting head 10 is mounted on the moving base 9 and the mounting head control section 11 is connected to the unit communication section 20 , the information is stored in the mounting head storage section 33 via the unit communication section 20 and the wireless communication section 37 . The head identification information 33b is transmitted to the mounting control unit 35. As shown in FIG. Accordingly, the mounting control unit 35 recognizes which mounting head 10 has been mounted to which moving unit 30 . That is, the body control section 13 recognizes the mounting head 10 attached to the moving unit 30 by wirelessly communicating with the unit communication section 20 .

3, the mounting control unit 35 controls the board transport mechanism 2, the component supply unit 4, the mounting head 10, the mounting head moving mechanism 12, and the board recognition camera 17 based on the mounting data stored in the mounting storage unit 34. Then, the component mounting work for mounting the component on the board 3 is executed. In the component mounting work, the mounting control section 35 transmits an operation instruction for the suction nozzle 10 b in the mounting head 10 to the unit communication section 20 of the predetermined moving unit 30 via the wireless communication section 37 .

When the mounting control section 35 transmits an operation instruction to the mounting head 10, it also transmits the unit identification information 32a stored in the unit storage section 32 of the moving unit 30 to which the mounting head 10 is mounted. When the unit communication section 20 receives an operation instruction including the unit identification information 32a assigned to the moving unit 30 to which it belongs, the unit communication section 20 transmits the operation instruction received via the wiring connector 22 to the mounting head control section 11 of the mounting head 10. do. The mounting head control section 11 that has received the operation instruction from the mounting control section 35 controls the nozzle unit 10 a based on the nozzle control data 33 a stored in the mounting head storage section 33 .

In this way, the body control unit 13 (mounting control unit 35) having the wireless communication unit 37 transmits an operation instruction to the unit communication unit 20 by wireless communication, thereby raising and lowering the nozzle (suction nozzle 10b) of the mounting head 10. control behavior. Further, the body control section 13 recognizes the unit communication section 20 of the mobile unit 30 that transmits the operation instruction from the unit identification information 32a. Then, the body control section 13 transmits the unit identification information 32a assigned to the mobile unit 30 transmitting the operation instruction together with the operation instruction. As a result, even in the component mounting apparatus 1 having a plurality of mounting heads 10 each mounted on a plurality of moving units 30, the operation instruction can be appropriately transmitted to each mounting head 10.例文帳に追加

In FIG. 3 , the imaging result of the board mark imaged by the board recognition camera 17 is transmitted to the main body control section 13 via the unit communication section 20 . The imaging result transmitted to the body control unit 13 is subjected to image processing by the recognition processing unit 36 provided in the body control unit 13, and the position of the board mark is recognized. The mounting control unit 35 corrects the mounting position of the component based on the position of the recognized board mark, and mounts the component on the board 3 . In this way, the imaging result of the camera (board recognition camera 17) is wirelessly transmitted to the main body control section 13 by the unit communication section 20. FIG.

As described above, in the component mounting apparatus 1 of the present embodiment, an operation instruction is transmitted to the body control unit 13 whose position is fixed, the mounting head 10 and the substrate recognition camera 17 which move in the horizontal direction, and the imaging result and the like are received. It is flexible and can reduce movable wiring. This reduces the risk of wire breakage and reduces material costs. Furthermore, the weight of the moving unit 30 can be reduced, and the power required for moving the mounting head 10 and the board recognition camera 17 can also be reduced.

As described above, the component mounting apparatus 1 of the present embodiment includes the mounting head 10 that mounts the component on the substrate 3 by raising and lowering the nozzle (suction nozzle 10b) attached to the lower end, and the wireless communication unit 37. A body control unit 13 for controlling each part of the component mounting apparatus 1, and a moving unit 30 (moving base 9, mounting head moving mechanism 12 and a connector holding portion 19). The mobile unit 30 has a unit communication section 20 that wirelessly communicates with the main body control section 13 , and the main body control section 13 transmits an operation instruction to the unit communication section 20 by wireless communication, thereby causing the mounting head 10 to Controls the up-and-down motion of the nozzle. As a result, it is possible to reduce the number of movable wires for transmitting operation instructions to the mounting head 10 that moves in the horizontal direction.

INDUSTRIAL APPLICABILITY The component mounting apparatus of the present invention has the effect of being able to reduce movable wiring for transmitting operation instructions to a mounting head that moves in the horizontal direction, and is useful in the field of mounting components on substrates.

Reference Signs List 1 component mounting device 3 substrate 10 mounting head 10b suction nozzle (nozzle)
13 Main body control unit 17 Board recognition camera (camera)
20 unit communication section 30 mobile unit 37 wireless communication section

Claims (4)

A component mounting apparatus comprising a mounting head for mounting a component on a substrate by raising and lowering a nozzle attached to a lower end,
a body control unit having a wireless communication unit and controlling each part of the component mounting apparatus;
a moving unit to which the mounting head is replaceably attached and which moves the mounting head in a horizontal direction;
The mobile unit has a unit communication section that wirelessly communicates with the main body control section,
The body control section controls the up-and-down operation of the nozzle in the mounting head by transmitting an operation instruction to the unit communication section by wireless communication.death,
The component mounting apparatus is provided with a plurality of moving units,
Each mobile unit is given a unique unit identification information,
The main body control section recognizes the unit communication section of the mobile unit that transmits the operation instruction based on the unit identification information. , component mounting equipment. Unique head identification information is given to the mounting head,
2. The component mounting apparatus according to claim 1, wherein said body control section recognizes said mounting head attached to said moving unit by wirelessly communicating with said unit communication section. 3. The component mounting apparatus according to claim 1, wherein said body control unit transmits unit identification information assigned to a moving unit to which said operation instruction is transmitted together with said operation instruction. The mobile unit is equipped with a camera that captures an image below,
4. The component mounting apparatus according to any one of claims 1 to 3 , wherein the imaging result of said camera is transmitted to said main body control section by said unit communication section.

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