JP5706434B2 - エッチング液組成物 - Google Patents
エッチング液組成物 Download PDFInfo
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- JP5706434B2 JP5706434B2 JP2012536649A JP2012536649A JP5706434B2 JP 5706434 B2 JP5706434 B2 JP 5706434B2 JP 2012536649 A JP2012536649 A JP 2012536649A JP 2012536649 A JP2012536649 A JP 2012536649A JP 5706434 B2 JP5706434 B2 JP 5706434B2
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- JP
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- Prior art keywords
- film
- weight
- aluminum
- metal film
- lanthanum
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- 238000005530 etching Methods 0.000 title claims description 54
- 239000000203 mixture Substances 0.000 title claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 239000002184 metal Substances 0.000 claims description 42
- 239000010936 titanium Substances 0.000 claims description 22
- ZWOQODLNWUDJFT-UHFFFAOYSA-N aluminum lanthanum Chemical compound [Al].[La] ZWOQODLNWUDJFT-UHFFFAOYSA-N 0.000 claims description 20
- 229910052719 titanium Inorganic materials 0.000 claims description 20
- 229910052738 indium Inorganic materials 0.000 claims description 19
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 18
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 16
- 229910052731 fluorine Inorganic materials 0.000 claims description 14
- 239000011737 fluorine Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 13
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 12
- 229910000858 La alloy Inorganic materials 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 150000007522 mineralic acids Chemical class 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 4
- PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- 229910052749 magnesium Inorganic materials 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 229910052712 strontium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 2
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000011698 potassium fluoride Substances 0.000 claims description 2
- 235000003270 potassium fluoride Nutrition 0.000 claims description 2
- VBKNTGMWIPUCRF-UHFFFAOYSA-M potassium;fluoride;hydrofluoride Chemical compound F.[F-].[K+] VBKNTGMWIPUCRF-UHFFFAOYSA-M 0.000 claims description 2
- 239000011775 sodium fluoride Substances 0.000 claims description 2
- 235000013024 sodium fluoride Nutrition 0.000 claims description 2
- BFXAWOHHDUIALU-UHFFFAOYSA-M sodium;hydron;difluoride Chemical compound F.[F-].[Na+] BFXAWOHHDUIALU-UHFFFAOYSA-M 0.000 claims description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 description 65
- 238000000034 method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 229910020794 La-Ni Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- -1 fluorine ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
下記表1に記載された成分及び組成比によって、エッチング液組成物が180kgとなるように製造した。
<エッチング特性評価>
試験用基板としては、SiNx層上にa−ITO/Al−La−Ni/Ti三重膜が蒸着されており、一定形態の模様にフォトレジストがパターニングされたものを使用した。
◎:極めて優秀(CD Skew:≦1μm、テーパー角:40°〜80°)
○:優秀(CD Skew:≦1.5μm、テーパー角:40°〜80°)
△:良好(CD Skew:≦2μm、テーパー角:40°〜80°)
×:不良(金属膜の消失及び残渣発生)
Claims (4)
- 組成物の総重量に対して、
過酸化水素1重量%〜15重量%、
硝酸、硫酸、及びこれらの組み合わせよりなる群から選ばれる1種である無機酸0.1重量%〜10重量%、
含フッ素化合物0.01重量%〜5重量%、
及び水残部を含むことを特徴とする、インジウム亜鉛酸化膜(IZO)及びインジウム錫酸化膜(ITO)から選択されるインジウム系金属膜、アルミニウム−ランタニウム系合金膜及びチタニウム系金属膜からなる三重膜用一括エッチング液組成物。 - 組成物の総重量に対して、
過酸化水素2重量%〜12重量%、
無機酸1重量%〜7重量%、
含フッ素化合物0.1重量%〜2重量%、
及び水残部を含むことを特徴とする、請求項1に記載のインジウム系金属膜、アルミニウム−ランタニウム系合金膜及びチタニウム系金属膜からなる三重膜用一括エッチング液組成物。 - 前記含フッ素化合物は、フッ化アンモニウム、フッ化ナトリウム、フッ化カリウム、重フッ化アンモニウム、重フッ化ナトリウム及び重フッ化カリウムよりなる群から選ばれる1種又は2種以上のものであることを特徴とする、請求項1に記載のインジウム系金属膜、アルミニウム−ランタニウム系合金膜及びチタニウム系金属膜からなる三重膜用一括エッチング液組成物。
- 前記アルミニウム−ランタニウム系合金膜は、アルミニウム90原子%以上、La10原子%以下、及び他の金属(X)残部を含むAl−La又はAl−La−Xで表されるアルミニウム−ランタニウム系合金膜であり、ここで、前記他の金属(X)はMg、Zn、In、Ca、Te、Sr、Cr、Co、Mo、Nb、Ta、W、Ni、Nd、Sn、Fe、Si、Ti、Pt及びCよりなる群から選ばれる1種又は2種以上であることを特徴とする、請求項1に記載のインジウム系金属膜、アルミニウム−ランタニウム系合金膜及びチタニウム系金属膜からなる三重膜用一括エッチング液組成物。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0103732 | 2009-10-29 | ||
KR20090103732 | 2009-10-29 | ||
KR1020100098368A KR101804573B1 (ko) | 2009-10-29 | 2010-10-08 | 식각액 조성물 |
KR10-2010-0098368 | 2010-10-08 | ||
PCT/KR2010/006953 WO2011052909A2 (ko) | 2009-10-29 | 2010-10-12 | 식각액 조성물 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013509702A JP2013509702A (ja) | 2013-03-14 |
JP5706434B2 true JP5706434B2 (ja) | 2015-04-22 |
Family
ID=43922758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012536649A Active JP5706434B2 (ja) | 2009-10-29 | 2010-10-12 | エッチング液組成物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5706434B2 (ja) |
KR (1) | KR101804573B1 (ja) |
CN (1) | CN102753652B (ja) |
WO (1) | WO2011052909A2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102092687B1 (ko) * | 2014-03-21 | 2020-03-24 | 동우 화인켐 주식회사 | 액정 표시 장치용 어레이 기판의 제조방법 |
KR102092352B1 (ko) * | 2014-03-31 | 2020-03-23 | 동우 화인켐 주식회사 | 액정 표시 장치용 어레이 기판의 제조방법 |
CN114305069A (zh) * | 2020-10-09 | 2022-04-12 | 武汉苏泊尔炊具有限公司 | 一种烹饪器具及其制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000028119A (ko) * | 1998-10-30 | 2000-05-25 | 윤종용 | 반도체 제조장비 세정액 |
JP2001339072A (ja) * | 2000-03-15 | 2001-12-07 | Advanced Display Inc | 液晶表示装置 |
US6488767B1 (en) * | 2001-06-08 | 2002-12-03 | Advanced Technology Materials, Inc. | High surface quality GaN wafer and method of fabricating same |
KR101337263B1 (ko) * | 2004-08-25 | 2013-12-05 | 동우 화인켐 주식회사 | 인듐 산화막의 식각액 조성물 및 이를 이용한 식각 방법 |
KR100742276B1 (ko) * | 2004-11-10 | 2007-07-24 | 삼성전자주식회사 | 저유전율 유전막을 제거하기 위한 식각 용액 및 이를이용한 저유전율 유전막 식각 방법 |
JP5010873B2 (ja) * | 2006-08-23 | 2012-08-29 | 関東化学株式会社 | チタン、アルミニウム金属積層膜エッチング液組成物 |
-
2010
- 2010-10-08 KR KR1020100098368A patent/KR101804573B1/ko active IP Right Grant
- 2010-10-12 JP JP2012536649A patent/JP5706434B2/ja active Active
- 2010-10-12 WO PCT/KR2010/006953 patent/WO2011052909A2/ko active Application Filing
- 2010-10-12 CN CN201080049723.0A patent/CN102753652B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20110047130A (ko) | 2011-05-06 |
KR101804573B1 (ko) | 2017-12-06 |
JP2013509702A (ja) | 2013-03-14 |
WO2011052909A3 (ko) | 2011-09-01 |
CN102753652A (zh) | 2012-10-24 |
CN102753652B (zh) | 2014-12-10 |
WO2011052909A2 (ko) | 2011-05-05 |
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