KR101804573B1 - 식각액 조성물 - Google Patents

식각액 조성물 Download PDF

Info

Publication number: KR101804573B1
Authority: KR; South Korea
Prior art keywords: aluminum; weight; film; metal film; based metal
Prior art date: 2009-10-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

KR1020100098368A

Other languages

English (en)

Korean (ko)

Other versions

KR20110047130A (ko

Inventor

이석준

신혜라

권오병

이유진

Original Assignee

동우 화인켐 주식회사

삼성디스플레이 주식회사

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-10-29

Filing date

2010-10-08

Publication date

2017-12-06

2010-10-08 Application filed by 동우 화인켐 주식회사, 삼성디스플레이 주식회사 filed Critical 동우 화인켐 주식회사

2010-10-08 Priority to KR1020100098368A priority Critical patent/KR101804573B1/ko

2010-10-12 Priority to PCT/KR2010/006953 priority patent/WO2011052909A2/ko

2010-10-12 Priority to CN201080049723.0A priority patent/CN102753652B/zh

2010-10-12 Priority to JP2012536649A priority patent/JP5706434B2/ja

2011-05-06 Publication of KR20110047130A publication Critical patent/KR20110047130A/ko

2017-12-06 Application granted granted Critical

2017-12-06 Publication of KR101804573B1 publication Critical patent/KR101804573B1/ko

Status Active legal-status Critical Current

2030-10-08 Anticipated expiration legal-status Critical

Links

239000000203 mixture Substances 0.000 title claims abstract description 35
238000005530 etching Methods 0.000 title description 29
229910052751 metal Inorganic materials 0.000 claims abstract description 35
239000002184 metal Substances 0.000 claims abstract description 35
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 26
239000010936 titanium Substances 0.000 claims abstract description 23
229910000858 La alloy Inorganic materials 0.000 claims abstract description 22
ZWOQODLNWUDJFT-UHFFFAOYSA-N aluminum lanthanum Chemical compound [Al].[La] ZWOQODLNWUDJFT-UHFFFAOYSA-N 0.000 claims abstract description 22
229910052719 titanium Inorganic materials 0.000 claims abstract description 20
RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 19
150000007522 mineralic acids Chemical class 0.000 claims abstract description 10
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
150000002222 fluorine compounds Chemical class 0.000 claims abstract description 8
229910052738 indium Inorganic materials 0.000 claims description 14
238000000034 method Methods 0.000 claims description 13
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 10
NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 claims description 8
PUZPDOWCWNUUKD-UHFFFAOYSA-M sodium fluoride Chemical compound [F-].[Na+] PUZPDOWCWNUUKD-UHFFFAOYSA-M 0.000 claims description 8
150000001875 compounds Chemical class 0.000 claims description 6
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 5
229910017604 nitric acid Inorganic materials 0.000 claims description 5
DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 claims description 4
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
239000011698 potassium fluoride Substances 0.000 claims description 4
235000003270 potassium fluoride Nutrition 0.000 claims description 4
239000011775 sodium fluoride Substances 0.000 claims description 4
235000013024 sodium fluoride Nutrition 0.000 claims description 4
229910052782 aluminium Inorganic materials 0.000 claims description 3
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
229910052804 chromium Inorganic materials 0.000 claims description 3
229910052742 iron Inorganic materials 0.000 claims description 3
229910052749 magnesium Inorganic materials 0.000 claims description 3
229910052750 molybdenum Inorganic materials 0.000 claims description 3
229910052758 niobium Inorganic materials 0.000 claims description 3
229910052710 silicon Inorganic materials 0.000 claims description 3
229910052712 strontium Inorganic materials 0.000 claims description 3
229910052715 tantalum Inorganic materials 0.000 claims description 3
229910052718 tin Inorganic materials 0.000 claims description 3
229910052725 zinc Inorganic materials 0.000 claims description 3
229910052779 Neodymium Inorganic materials 0.000 claims description 2
229910045601 alloy Inorganic materials 0.000 claims description 2
239000000956 alloy Substances 0.000 claims description 2
229910052746 lanthanum Inorganic materials 0.000 claims description 2
229910052759 nickel Inorganic materials 0.000 claims description 2
229910052721 tungsten Inorganic materials 0.000 claims description 2
UZQSJWBBQOJUOT-UHFFFAOYSA-N alumane;lanthanum Chemical class [AlH3].[La] UZQSJWBBQOJUOT-UHFFFAOYSA-N 0.000 claims 1
239000010408 film Substances 0.000 description 53
230000000052 comparative effect Effects 0.000 description 20
229920002120 photoresistant polymer Polymers 0.000 description 7
229910020794 La-Ni Inorganic materials 0.000 description 4
238000011156 evaluation Methods 0.000 description 3
239000000758 substrate Substances 0.000 description 3
KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
239000002313 adhesive film Substances 0.000 description 2
238000004140 cleaning Methods 0.000 description 2
239000008367 deionised water Substances 0.000 description 2
229910021641 deionized water Inorganic materials 0.000 description 2
239000011701 zinc Substances 0.000 description 2
DHKVCYCWBUNNQH-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,5,7-tetrahydropyrazolo[3,4-c]pyridin-6-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)C=NN2 DHKVCYCWBUNNQH-UHFFFAOYSA-N 0.000 description 1
AWFYPPSBLUWMFQ-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,6,7-tetrahydropyrazolo[4,3-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=C2 AWFYPPSBLUWMFQ-UHFFFAOYSA-N 0.000 description 1
NEAPKZHDYMQZCB-UHFFFAOYSA-N N-[2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]ethyl]-2-oxo-3H-1,3-benzoxazole-6-carboxamide Chemical compound C1CN(CCN1CCNC(=O)C2=CC3=C(C=C2)NC(=O)O3)C4=CN=C(N=C4)NC5CC6=CC=CC=C6C5 NEAPKZHDYMQZCB-UHFFFAOYSA-N 0.000 description 1
VCUFZILGIRCDQQ-KRWDZBQOSA-N N-[[(5S)-2-oxo-3-(2-oxo-3H-1,3-benzoxazol-6-yl)-1,3-oxazolidin-5-yl]methyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C1O[C@H](CN1C1=CC2=C(NC(O2)=O)C=C1)CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F VCUFZILGIRCDQQ-KRWDZBQOSA-N 0.000 description 1
229910004205 SiNX Inorganic materials 0.000 description 1
229910001069 Ti alloy Inorganic materials 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000015572 biosynthetic process Effects 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000008034 disappearance Effects 0.000 description 1
238000001312 dry etching Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000007602 hot air drying Methods 0.000 description 1
AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
239000004615 ingredient Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000012528 membrane Substances 0.000 description 1
239000007800 oxidant agent Substances 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
239000003002 pH adjusting agent Substances 0.000 description 1
238000001020 plasma etching Methods 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
239000004065 semiconductor Substances 0.000 description 1
238000004544 sputter deposition Methods 0.000 description 1
239000004094 surface-active agent Substances 0.000 description 1
239000010409 thin film Substances 0.000 description 1
238000004148 unit process Methods 0.000 description 1
238000001039 wet etching Methods 0.000 description 1
YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Inorganic Chemistry (AREA)
ing And Chemical Polishing (AREA)
Weting (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

KR1020100098368A 2009-10-29 2010-10-08 식각액 조성물 Active KR101804573B1 (ko)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
KR1020100098368A KR101804573B1 (ko)	2009-10-29	2010-10-08	식각액 조성물
PCT/KR2010/006953 WO2011052909A2 (ko)	2009-10-29	2010-10-12	식각액 조성물
CN201080049723.0A CN102753652B (zh)	2009-10-29	2010-10-12	蚀刻液组成物
JP2012536649A JP5706434B2 (ja)	2009-10-29	2010-10-12	エッチング液組成物

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
KR1020090103732		2009-10-29
KR20090103732		2009-10-29
KR1020100098368A KR101804573B1 (ko)	2009-10-29	2010-10-08	식각액 조성물

Publications (2)

Publication Number	Publication Date
KR20110047130A KR20110047130A (ko)	2011-05-06
KR101804573B1 true KR101804573B1 (ko)	2017-12-06

Family

ID=43922758

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
KR1020100098368A Active KR101804573B1 (ko)	2009-10-29	2010-10-08	식각액 조성물

Country Status (4)

Country	Link
JP (1)	JP5706434B2 (ja)
KR (1)	KR101804573B1 (ja)
CN (1)	CN102753652B (ja)
WO (1)	WO2011052909A2 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR102092687B1 (ko) *	2014-03-21	2020-03-24	동우 화인켐 주식회사	액정 표시 장치용 어레이 기판의 제조방법
KR102092352B1 (ko) *	2014-03-31	2020-03-23	동우 화인켐 주식회사	액정 표시 장치용 어레이 기판의 제조방법
CN114305069A (zh) *	2020-10-09	2022-04-12	武汉苏泊尔炊具有限公司	一种烹饪器具及其制作方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20000028119A (ko) *	1998-10-30	2000-05-25	윤종용	반도체 제조장비 세정액
JP2001339072A (ja) *	2000-03-15	2001-12-07	Advanced Display Inc	液晶表示装置
US6488767B1 (en) *	2001-06-08	2002-12-03	Advanced Technology Materials, Inc.	High surface quality GaN wafer and method of fabricating same
KR101337263B1 (ko) *	2004-08-25	2013-12-05	동우 화인켐 주식회사	인듐 산화막의 식각액 조성물 및 이를 이용한 식각 방법
KR100742276B1 (ko) *	2004-11-10	2007-07-24	삼성전자주식회사	저유전율 유전막을 제거하기 위한 식각 용액 및 이를이용한 저유전율 유전막 식각 방법
JP5010873B2 (ja) *	2006-08-23	2012-08-29	関東化学株式会社	チタン、アルミニウム金属積層膜エッチング液組成物

2010
- 2010-10-08 KR KR1020100098368A patent/KR101804573B1/ko active Active
- 2010-10-12 WO PCT/KR2010/006953 patent/WO2011052909A2/ko active Application Filing
- 2010-10-12 CN CN201080049723.0A patent/CN102753652B/zh active Active
- 2010-10-12 JP JP2012536649A patent/JP5706434B2/ja active Active

Also Published As

Publication number	Publication date
CN102753652A (zh)	2012-10-24
WO2011052909A2 (ko)	2011-05-05
CN102753652B (zh)	2014-12-10
KR20110047130A (ko)	2011-05-06
JP2013509702A (ja)	2013-03-14
WO2011052909A3 (ko)	2011-09-01
JP5706434B2 (ja)	2015-04-22

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