JP3354474B2 - Manufacturing method of flex-rigid multilayer wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board, and more particularly, to an outer core on both surfaces of an FPC inner core substrate.
Substrate is laminated to a manufacturing method of so-called flex-rigid multilayer wiring board having a FPC cable layer fraction drawn from the multilayer wiring portion and its multilayered wiring portion.

[0002]

2. Description of the Related Art FIG. 7 is a view showing a conventional flex-rigid multilayer wiring board, FIG. 7 (a) is a schematic cross-sectional view thereof, and FIG. 7 (b) is unnecessary covering an FPC cable layer. FIG. 9 is a diagram illustrating a state in which a proper outer layer core material is removed.

In FIG. 7A, a conventional flex-rigid multilayer wiring board 50 has an inner FPC cable layer 5.
Outer core substrate (glass epoxy resin etc.) 5 outside of 1
2 are bonded and laminated by an adhesive layer 53.
The inner FPC cable layer 51 includes an area 51a required as an FPC cable and an area 51 remaining as an inner layer.
The adhesive layer (adhesive sheet layer) 53 in the portion 51a is hollowed out so that the outer core substrate 52 does not adhere.

[0004] Next, a half cut 54 is made on an edge portion between the FPC cable layer of the outer core material and the multilayer wiring portion (hard core material portion). At this time, it was difficult to control the depth of the half cut, and in some cases, the portion of the FPC cable was damaged and a defect occurred. Thereafter, the unnecessary outer core material covering the FPC cable layer was peeled off to expose the FPC, and then the backing reinforcing plate 56 was attached as necessary.

In FIG. 7B, reference numeral 52a denotes an unnecessary outer core material covering the FPC cable layer, 54 denotes a half-cut portion applied to the outer core material 52, and 55 denotes an inner layer formed by the half-cut process. Reference numeral 56 denotes a portion where the FPC cable layer 51 is damaged, and 56 denotes a backing reinforcing plate attached to the FPC cable layer 51.

FIG. 8 is a view illustrating a printed wiring board in a process of externally processing an FPC cable layer in a conventional example when viewed from directly above, and FIG. 8A shows an FPC before multi-layer lamination processing. FIG. 8 is a diagram showing a state of a cable layer, and FIG.
(B) and FIG. 8 (c) are views for explaining a state in which multi-layer lamination is performed by applying pressure.

In FIG. 8A, the outer shape of the FPC cable layer 51 is previously slit in the FPC layer before the multilayer lamination is performed by die punching or the like. Thereafter, the outer core material 52 is laminated via an adhesive layer (adhesive sheet layer) 53 by the method described with reference to FIG.

FIG. 8 (b) is a diagram for explaining a state in which a multi-layer lamination is performed by applying pressure. At this time, since the FPC cable layer 51 has been slit in advance, the FPC cable layer 51 may be twisted and bent by pressure stress at the time of laminating the layers, and problems such as cracks 61 generated in the FPC cable layer 51 have been observed. .

FIG. 8 (c) is a view for explaining a state in which a backing reinforcing plate is stuck to the tip of the FPC cable layer and multi-layer lamination is performed by applying pressure. The outer shape of the FPC cable layer and the sticking of the backing reinforcing plate are illustrated. It is difficult to adjust the alignment position, and often causes the misalignment 62 of the backing reinforcing plate. Reference numeral 61 denotes a crack generated in the FPC cable layer.

[0010]

However, the conventional flex-rigid multilayer wiring board and the method of manufacturing the same have the following problems. (1) FPC due to mistake during machining such as half-cut to expose FPC cable layer after multilayer lamination
Cable layer breakage. (2) Man-hours for the half-cutting process itself. (3) The number of man-hours for attaching a backing reinforcing plate to the FPC cable layer. (4) When the FPC cable layer is preliminarily shaped, damage such as cracks or the like occurs in the FPC cable layer due to the pressure at the time of multilayer lamination. (5) Insufficiency due to misalignment when attaching the backing reinforcing plate to the FPC cable layer.

[0011]

According to a first aspect of the present invention, there is provided a flex-rigid multilayer wiring board comprising: an FPC inner layer core substrate;
An outer core base material is laminated on both sides of the substrate, and a method of manufacturing a flex-rigid multilayer printed wiring board having a multilayer wiring portion and an FPC cable layer drawn out from the multilayer wiring portion, wherein one outer layer core substrate is provided. To the inner layer side
Forming body and extending part of FPC cable layer
Forming a dummy conductor pattern at a position corresponding to
Temporary connection at the part corresponding to the part where the C cable layer is pulled out
Provided release film coverlay or pattern attached
Forming an applied adhesive layer, and contacting the outer core substrate.
Work to adhere and laminate with FPC inner layer core substrate by adhesion layer
And the laminated outer layer core base material and FPC inner layer core base.
For the material, remove the part where the FPC cable layer is drawn out.
Forming step, and the externally processed FPC inner layer core base
Outer layer of a portion where the dummy conductor pattern is formed from a material
Peeling off the core base material .

[0012] A method for manufacturing a flex-rigid multilayer wiring board according to claim 2 of the present invention uses an adhesive sheet layer is trimmed in the shape of a multi-layer wiring portion, in said FPC
The layer core base material and the outer layer core base material are bonded to each other.

According to a third aspect of the present invention, there is provided a method of manufacturing a flex-rigid multilayer wiring board , wherein the other outer core base material has a hollow portion, and a guide mark for external processing is provided on the FPC cable layer. It is characterized by having done.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a flex-rigid multilayer wiring board, wherein a film cover lay for covering a guide mark for processing the outer shape of the FPC cable layer is provided. is there.

Further, a method of manufacturing a flex-rigid multilayer wiring board according to a fifth aspect of the present invention is characterized in that a part of the other outer core substrate is used as a backing reinforcing plate.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a flex-rigid multilayer wiring board , wherein a conductor formed on an outer core material or an FPC cable layer for fine adjustment of a finished thickness of the flex-rigid multilayer wiring board. Alternatively, a film coverlay is provided.

Furthermore, a method of manufacturing a flex-rigid multilayer wiring board according to claim 7 of the present invention is characterized in that the outer core material covering the FPC cable layer is removed without using a machining tool such as a blade. It is.

[0018]

1 to 4 are views showing a flex-rigid multilayer wiring board according to an embodiment of the present invention and a method of manufacturing the same (manufacturing process). FIG. 1 is a diagram showing an overall flow of a method for manufacturing a flex-rigid multilayer wiring board. FIG. 1 is divided into three drawings, FIGS.
A schematic cross-sectional view of a structure of a flex-rigid multilayer wiring board having a layer as an example and a method of manufacturing the same will be described.

FIG. 2 is a view showing the structure and manufacturing process of the FPC inner layer core base material and the outer layer core base material, and FIG.
FIG. 2 shows the structure and manufacturing method of a PC inner layer core base material.
2B shows the structure and manufacturing method of the outer core substrate (the outer layer material in contact with the exposed side of the FPC conductor), and FIG. 2C shows the structure and the structure of the outer core substrate in contact with the other backing reinforcing plate. The manufacturing method will be described.

In FIG. 2 (a), an FPC cable layer (FPC inner layer core base material) 11 has a circuit formed by etching or the like in advance, and 12 denotes a conductor of the FPC cable layer. Applied on one or both sides or inside. Next, an FPC film coverlay 13 covering the conductors 12 of the FPC cable layer
(Upper side) and 14 (lower side) are provided, and a process such as gold plating is applied to the FPC terminal portion as necessary. The manufacturing process of the FPC inner layer core base material ends.

In FIG. 2B, the inner layer side and the outer layer side of one outer layer core base material (the outer layer material in contact with the exposed side of the FPC conductor) 15 are different. Is the inner conductor 16 of the outer substrate on which the circuit is formed.
In addition, the inner-layer-side dummy conductor pattern 17 where no circuit is formed is formed. On the outer layer side of the outer layer core base material 15,
Outer layer side conductor 18 which is not formed yet and is left as it is.
There is. Next, a release film coverlay 20 that is temporarily bonded to the adhesive sheet layer 19 and the outer layer core base material is provided (laminated), and the manufacturing process ends. The release film coverlay 20 is for facilitating peeling.

More specifically, a dummy conductor pattern 17 previously formed in a circuit etching step is provided at a portion corresponding to the FPC cable layer of the outer core material on the side where the conductor is exposed for the FPC cable layer. The dummy film coverlay 20 has the same shape and the same area as the pattern of the dummy conductor pattern 17 (excluding the area to be cut and removed). At this time, the protective dummy film cover lay 20 is always stuck to the outer layer core material side in a direction to be adhered, and the film surface of polyimide or the like is in contact with the FPC cable side. Thus, the outer core material on the FPC cable does not adhere to the FPC cable, and the unnecessary outer core material can be easily peeled off after the outer shape processing.

In FIG. 2 (c), the outer core substrate 21 in contact with the other one of the backing reinforcing plates is also different between the inner layer side and the outer layer side. The inner layer side conductor 22 of the outer layer base material is formed,
On the outer layer side of the outer layer core substrate 21, there is an outer layer side conductor 23 which is left without forming a circuit. Next, the hollow portion 24 of the outer layer base material at a portion corresponding to the FPC cable layer portion is formed.
Are formed, and 25 is a portion corresponding to a backing reinforcing plate. The adhesive sheet layer 26 is formed on the hollow outer core substrate 21.
Is provided (laminated), and this manufacturing process ends.

FIGS. 3A and 3B are diagrams illustrating a flex-rigid multilayer wiring board according to an embodiment of the present invention and a multi-layer laminating process of a method of manufacturing the same. FIG. 3A is a schematic cross-sectional view of the multi-layer laminating process. (B) is a schematic sectional view of the hollowing step, and (c) is a top view of the hollowing step.

FIG. 3 shows the FP made in FIG. 2 in the previous step.
This is a step of laminating the C cable layer 11, the outer core base material 15, and the outer core base material 21 in contact with the backing reinforcing plate side, and bonding the upper and lower adhesive sheet layers 19 and 26 together. The temporarily bonded release film cover lay 20 can be separated if necessary. After lamination, by heating and pressing,
The upper and lower adhesive sheet layers 19 and 26 are cured and integrated.

In FIG. 3A, from the center, 11
Is FPC cable layer (FPC inner layer core base material), 12 is F
PC cable layer conductors, 13 and 14 are FPC film coverlays, 15 is an outer layer core base material (outer layer material in contact with the exposed side of the FPC conductor), 16 is an inner layer side conductor, 17 is an inner layer side where no circuit is formed. A dummy conductor pattern, 18 is an outer layer side conductor which is left without forming a circuit, 19 is an adhesive sheet layer, 20 is a release film coverlay temporarily bonded to an outer layer core base material, and then directed downward. Reference numeral 21 denotes an outer core substrate in contact with the backing reinforcing plate, 22 denotes an inner conductor of the outer substrate on which a circuit is formed, 23 denotes an outer conductor that is left without forming a circuit, and 24 denotes an FPC cable layer. Hollow portion of the outer layer base material at a position corresponding to 25 minutes, 25
Is a portion corresponding to a backing reinforcing plate, 26 is an adhesive sheet layer,
It is. Thereafter, in a multilayer laminating step, the adhesive sheet layers 19 and 26 are cured by applying heat and pressure. In order to obtain an electrical connection between the layers, a through hole 27 is formed, and a plating connection is performed by copper plating or the like in the through hole.

In FIG. 3B, the outer conductors 18 and 23 which have not been formed and are left as they are are then patterned to form outer circuits 18a and 23a.
Outer layer side conductor 23 at a location 25 corresponding to a backing reinforcing plate
Is etched and removed in a patterning step. Thereafter, the circuits 18a and 23a in the upper and lower outer layer portions are formed with a solder resist layer 28 by a printing method or the like, symbols 29 are printed as necessary, and gold plating is applied to the outer layer land portions (not shown). Alternatively, solder coating or flux treatment is performed. Next, the outer shape processing other than the FPC cable portion is performed by die punching or the like.

In FIG. 3C, the outer shape processing of the FPC portion is punched out using the outer shape processing guide mark 30 provided on the FPC cable layer. Since the outer shape processing guide mark 30 is disposed outside the area of the product, it is discarded after punching.

FIGS. 4A and 4B are explanatory views of a flex-rigid multilayer wiring board according to an embodiment of the present invention and a step of peeling an outer core substrate of a method for manufacturing the same, wherein FIG. 4A is a top view and FIG. ) Is a side view.

4 (a) and 4 (b), the outer core material portion covering the conductor-exposed layer of the FPC cable layer from the multilayer circuit portion 31, the FPC cable portion 32 and the reinforcing plate portion 33 is shown. 34 is peeled off. At this time, the outer core material (15, 17, 19) and the FPC (11, 12, 13)
Are in contact with each other via the release dummy film coverlay 20, so that the outer layer core material and the FPC do not adhere to each other during multilayer lamination. In addition, the edge of the dummy pattern 17 provided on the outer core material side raises the outer core material vertically so that the boundary between the multilayer portion and the FPC cable portion can be clearly distinguished. It can be easily separated from the porori without the need for delicate processing. In particular, it is more effective to match the direction of the fiber of the glass cloth of the outer core material with the direction of the straight portion to be cut. In a flex-rigid multilayer wiring board and a method for manufacturing the same according to an embodiment of the present invention,
At this time, the thickness of the outer core material (17 + 15 + 18)
At a thickness of 0.06 mm, 0.10 mm, and 0.15 mm, it was possible to peel off with almost no load.

FIG. 5 is a view showing a flex-rigid multilayer wiring board according to another embodiment of the present invention and a method of manufacturing the same (manufacturing process). Here, a six-layer flex-rigid multilayer wiring board is taken as an example. FIG. 1 is a schematic cross-sectional view of the structure and a diagram for explaining a manufacturing method thereof, particularly showing a case where an adhesive sheet can be held alone as a unit capable of performing mechanical processing or the like.

In FIG. 5, 11 is an FP from the center.
C cable layer (FPC inner layer core base material), 12 is a conductor of the FPC cable layer, 13 and 14 are film coverlays of the FPC, and the film coverlays are selectively laminated on both sides of the FPC.

Next, toward the upper side, 15 is an outer layer core base material (an outer layer material in contact with the exposed side of the FPC conductor), 16 is an inner layer conductor, 17 is an inner layer dummy conductor pattern on which no circuit is formed, and 18 is an inner layer dummy conductor pattern. An outer layer side conductor which is left without forming a circuit, 19 is an adhesive sheet layer, and 41 is a dummy pattern at a portion corresponding to a peeled portion of the outer layer core base material.
Next, downward, 21 is an outer core substrate in contact with the backing reinforcement plate side, 22 is an inner layer conductor of the outer layer substrate on which a circuit is formed, and 23 is an outer layer conductor left without forming a circuit. Reference numeral 24 denotes a hollow portion of the outer layer base material at a portion corresponding to the FPC cable layer, reference numeral 25 denotes a portion corresponding to the backing reinforcing plate, and reference numeral 26 denotes an adhesive sheet layer.

The outer core material (the outer layer material in contact with the exposed side of the FPC conductor) 15 and the FPC cable layer (FPC
Adhesive sheet layers 42 and 43 are interposed between the inner core substrate 11 and the outer core substrate 21 that is in contact with the backing reinforcing plate.

The adhesive sheet layers 42 and 43 are adhesive sheet layers in which unnecessary portions are previously cut out by machining. The unnecessary part of the adhesive sheet layer at that time is
It corresponds to the same shape and the same area as the dummy conductor on the inner layer side of the FPC conductor exposed side core material.

On the other hand, on the outer layer core base material side which is in contact with the backing reinforcing plate side of the FPC, the adhesive sheet is cut out at a portion corresponding to the FPC cable layer. that time,
The portion corresponding to the backing reinforcing plate is set so that the adhesive sheet exists. Thereafter, multi-layer lamination is performed and processed by the same process as described with reference to FIG. Unnecessary outer core material on the exposed side of the FPC conductor is sufficiently separated from the conductor such as a copper foil by the FPC, as in the case of the dummy film coverlay 20 for release shown in FIGS. It can be easily peeled off.

FIGS. 6A and 6B are diagrams showing a flex-rigid multilayer wiring board according to another embodiment of the present invention and a method of manufacturing the same (manufacturing process). FIG.
It is a schematic sectional drawing of A ', (b) is a schematic sectional drawing of BB' of (c), (c) is a top view.

In FIG. 6 (a), from the center, 11
Is FPC cable layer (FPC inner layer core base material), 12 is F
PC cable layer conductors, 13 and 14 are FPC film coverlays, 45 is an FP disposed on the FPC cable layer
This is a guide mark for processing the outer shape of the portion C.

Next, toward the upper layer, 15 is an outer layer core base material (an outer layer material in contact with the exposed side of the FPC conductor), 18 is an outer layer conductor which is left without forming a circuit, and 19 is an adhesive sheet layer Reference numerals 46 denote escape holes in the guide hole portion.

Next, downward, reference numeral 21 denotes an outer core substrate in contact with the backing reinforcing plate side, and reference numeral 26 denotes an adhesive sheet layer. The external processing guide mark 45 of the FPC portion provided in the FPC cable layer can be peeped through the escape hole 46 of the guide hole portion.

In FIG. 6 (b), 11
Is FPC cable layer (FPC inner layer core base material), 12 is F
The conductor of the PC cable layer, 12a is a conductor of the FPC cable layer for adjusting the thickness at a location 25 corresponding to the backing reinforcing plate, and 13 and 14 are FPC film coverlays.

Next, toward the upper layer, 15 is an outer layer core base material (an outer layer material in contact with the exposed side of the FPC conductor), 16 is an inner layer conductor, 17 is an inner layer dummy conductor pattern on which no circuit is formed, 18 Denotes an outer layer side conductor which is left without forming a circuit, 19 denotes an adhesive sheet layer, and 20 denotes a release film coverlay temporarily bonded to an outer layer core base material.

Next, downward, 21 is an outer core substrate in contact with the backing reinforcing plate side, 22 is an inner conductor of the outer substrate on which a circuit is formed, and 23 is left without forming a circuit. An outer layer side conductor, 24 is a hollow portion of the outer layer base material at a portion corresponding to the FPC cable layer, 25 is a portion corresponding to the backing reinforcing plate, and 26 is an adhesive sheet layer. Thereafter, in a multilayer laminating step, heating and pressing are performed to form the adhesive sheet layer 1
9 and 26 are cured. In order to obtain an electrical connection between the layers, a through hole 27 is drilled (not shown), and a plating connection is performed by copper plating or the like in the through hole (not shown).

The subsequent steps are as described with reference to FIGS. In FIG. 6, reference numeral 45 denotes a guide mark for processing the outer shape of the FPC portion set in the FPC cable layer, and reference numeral 46 denotes a relief hole of a guide hole portion provided in the outer layer core base material (the outer layer material which is in contact with the exposed side of the FPC conductor) 15. And is a characteristic component of FIG. Since the escape hole 46 of the guide hole portion is provided on the outer layer core base material 15 to be cut and removed, it is not necessary to make the hole as small as about φ2.0 mm. It is possible to almost eliminate the restriction on the process.

In the flex-rigid multilayer wiring board and the method of manufacturing the same according to another embodiment of the present invention shown in FIG. 6, the outer core material 15 has a thickness of 0.06 mm,
It has been found that it is possible to peel off with little load up to a thickness of 0.10 mm and 0.15 mm. Also, FP
The outer core material 21 on the side opposite to the exposed surface of the C conductor has the FPC cable layer and the backing reinforcing plate automatically formed when the outer shape processing of the FPC portion is performed. No need to shape,
Man-hours and processing accuracy can be greatly improved.

Next, a method of setting the punching guide marks 45 when the outer shape of the FPC cable layer is processed will be described. In the method of manufacturing a flex-rigid multilayer wiring board according to another embodiment of the present invention shown in FIG. 6, when the outer shape processing of the FPC portion is performed, the FPC is Now it is invisible from the outside. If the outer shape is processed as it is, F
Punching deviation easily occurs with respect to the pattern of the PC layer, which causes a problem. As a countermeasure, it is necessary to set the punching guide mark 45 on the same layer as the FPC pattern layer. In order to pass a guide pin for punching through this guide mark, it is necessary to make a hole of about φ2.0 mm. There is a method of using a guide drilling device with a X-ray fluoroscopic function, but a special device has to be prepared, and the production efficiency is not good.

Therefore, in the flex-rigid multilayer wiring board and the method of manufacturing the same according to one embodiment of the present invention, the punching guide mark 45 for the FPC portion is set in the structure shown in FIG. First, the film coverlay 13 is coated on the punching guide marks 45 formed on the FPC layer 11 in advance by a method such as etching. In the core material 15 of the outer layer, a portion corresponding to the position of the guide hole and a relief hole 46 in the guide hole portion are hollowed out. The outer core material 21 on the back side does not particularly need to cut through the guide hole. After that, even after the multi-layer lamination, the guide mark 45 set on the FPC is formed by the through hole 4 of the outer layer material.
6 through which the film cover lay layer 13 can be seen through. Since the guide mark pattern 45 is completely protected by the film cover lay 13, it is not damaged even if immersed in a chemical such as through-hole copper plating or circuit etching, and before the final FPC portion outer shape processing. The guide hole can be formed by a simple drilling device such as a transparent drilling device.

Thereafter, the outer core material that is in contact with the unexposed side of the conductor of the FPC cable layer is cut through a portion corresponding to the FPC cable layer. At that time, FPC
The outer layer core material corresponding to the backing reinforcing plate for the cable layer is left so as not to penetrate.

In order to adjust the thickness of the backing reinforcing plate to the required thickness, it is basically determined by the thickness of the outer core material to be bonded. Whether to remove by etching or F
Fine adjustment can be made depending on whether or not the conductor corresponding to the portion of the backing reinforcing plate for the PC cable layer is etched away. The above method is particularly effective when the adhesive sheet layer is a laminate type or a coating (liquid) type, which is difficult to handle alone.

[0050]

As described above, according to the method for manufacturing a flex-rigid multilayer wiring board according to the first aspect of the present invention, half-cutting or the like performed to expose an FPC cable layer after laminating multiple layers. In this case, the FPC cable layer is not damaged due to an error during the machining, and a highly reliable flex-rigid multilayer wiring board can be obtained. In particular, when applied to a so-called flying tail specification in which the conductor is exposed in the FPC cable layer, the advantage is great, and particularly in the case of a structure in which a backing reinforcing plate is attached to the FPC cable layer.

Further, according to the method for manufacturing a flex-rigid multilayer wiring board according to the second aspect of the present invention, it is not necessary to shape the FPC cable layer in advance, and the FPC cable layer can be cracked due to the pressure during lamination. And a highly reliable flex-rigid multilayer wiring board free from the occurrence of breakage can be obtained.

[0052] Further, according to the method of manufacturing the flex-rigid multilayer wiring board according to claim 3 of the present invention, after the multi-layer laminate,
It is possible to obtain a flex-rigid multilayer wiring board that is accurately and easily subjected to external processing.

[0053] Further, according to the method of manufacturing the flex-rigid multilayer wiring board according to claim 4 of the present invention, gas Idomaku, because they are fully protected by the film coverlay, subsequent Sulfol copper plating, circuit etching No damage even if immersed in a chemical solution such as
It is possible to perform guide hole processing with a simple drilling device such as a translucent hole drilling device before processing the outer shape of the portion C.

Further, according to the method for manufacturing a flex-rigid multilayer wiring board according to the fifth aspect of the present invention, even if the FPC portion requires a backing reinforcing plate, the man-hour for attaching the backing reinforcing plate is unnecessary. There is no need to newly prepare a material for the backing reinforcing plate, an adhesive or the like. In addition, the positioning accuracy of the backing reinforcing plate is excellent.

[0055] Further, according to the method of manufacturing the flex-rigid multilayer wiring board according to claim 6 of the present invention does not require a member or steps for fine adjustment of the finished thickness of the flex rigid multilayer wiring board.

[0056] Further, according to the manufacturing method of the flex-rigid multilayer wiring board according to claim 7 of the present invention, in order to remove the outer layer core material of unwanted parts, it is necessary to perform mechanical processing of the half-cut or the like This is a manufacturing method in which the setting of the boundary between the multilayer portion and the FPC cable layer can be determined by processing with high positional accuracy such as etching, and a so-called laminate type (such as a double-sided tape) in which the adhesive sheet cannot be held alone. ) Is a manufacturing method that can be applied to either the type of coating in liquid or the type that can perform mechanical processing such as piercing by itself, eliminating the need for man-hours for attaching a backing reinforcing plate. Yes,
It is possible to obtain a manufacturing method in which troubles such as twisting of the FPC portion do not occur at the time of multilayer lamination and there is no occurrence of breakage or the like of the FPC portion due to twisting of the FPC portion.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall flow of a flex-rigid multilayer wiring board and a method of manufacturing the same according to an embodiment of the present invention, the details of which are shown in FIGS.

FIG. 2 is a view showing a structure and a manufacturing process of an FPC inner layer core substrate and an outer layer core substrate of a flex-rigid multilayer wiring board and a method of manufacturing the same according to an embodiment of the present invention;
(A) is a figure which shows the structure and manufacturing method of an FPC inner layer core base material, (b) and (c) is a figure which shows the structure and manufacturing method of an outer layer core base material.

3A and 3B are diagrams illustrating a flex-rigid multilayer wiring board according to an embodiment of the present invention and a multilayer laminating process of a method for manufacturing the same, wherein FIG. 3A is a schematic cross-sectional view of the multilayer laminating process; ) Is a schematic sectional view of the hollowing process,
(C) is a top view of the hollowing step.

4A and 4B are explanatory views of a flex-rigid multilayer wiring board according to an embodiment of the present invention and a step of peeling an outer core substrate of a method of manufacturing the same, wherein FIG. 4A is a top view and FIG.
Is a side view.

FIG. 5 is a schematic cross-sectional view of a structure relating to a flex-rigid multilayer wiring board and a method of manufacturing the same according to another embodiment of the present invention, and a diagram illustrating a method of manufacturing the same.

FIG. 6 is a schematic cross-sectional view of a structure relating to a flex-rigid multilayer wiring board and a method for manufacturing the same according to another embodiment of the present invention, and a diagram for explaining the method for manufacturing the same.
FIG. 3C is a schematic cross-sectional view taken along the line AA ′ of FIG.
(C) is a top view.

7A and 7B are diagrams illustrating a conventional flex-rigid multilayer wiring board, where FIG. 7A is a schematic cross-sectional view, and FIG.
It is a figure explaining a mode that unnecessary outer core material which covers a cable layer part is removed.

8A and 8B are diagrams illustrating a printed wiring board in a process of externally processing an FPC cable layer according to a conventional example when viewed from directly above, and FIG. 8A illustrates a state of the FPC cable layer before performing multilayer lamination processing. It is a figure which shows, and (b) and (c) are the figures explaining a mode that a multilayer lamination | stacking is performed by applying a pressure.

[Explanation of symbols]

Reference Signs List 11 FPC cable layer (FPC inner layer core substrate) 12 FPC cable layer conductor 12a FPC cable layer conductor for thickness adjustment 13 FPC film coverlay 14 FPC film coverlay 15 Outer core substrate (FPC conductor exposed side) 16 Inner layer side conductor 17 Inner layer side dummy conductor pattern not formed with circuit 18 Outer layer side conductor 18a left without forming circuit 18a Circuit of outer layer portion 19 Adhesive sheet layer 20 Outer layer core base material Temporarily bonded release film cover lay 21 Outer core base material in contact with the backing reinforcing plate 22 Inner layer conductor of outer layer substrate on which circuits are formed 23 Outer layer conductor 23a left without forming circuits 23a Circuit 24 Hollow-out portion of outer layer base material at the portion corresponding to FPC cable layer 25 Backing reinforcement 26 Adhesive sheet layer 27 Through hole 28 Solder resist layer 29 Symbol 30 Outline guide mark arranged on FPC cable layer 31 Multilayer circuit section 32 FPC cable section 33 Reinforcement plate section 34 FPC cable layer with conductor exposed Outer layer core material portion 41 coated on the layer 41 Dummy pattern at a position corresponding to a peeled portion of the outer layer core base material 42 Adhesive sheet layer 43 Adhesive sheet layer 45 Guide mark for external processing of FPC portion provided on FPC cable layer 46 Escape hole for guide hole

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 3/46 H05K 1/02

Claims (7)

(57) [Claims] An outer core base is provided on both sides of an FPC inner core base material.
In a method for manufacturing a flex-rigid multilayer printed wiring board having a multilayer wiring portion and an FPC cable layer drawn out of the multilayer wiring portion , an inner-layer conductor is formed with respect to an inner-layer side of one outer-layer core base material.
At the same time as the FPC cable layer
Form a dummy conductor pattern at the corresponding location, and
Temporarily bonded to the part corresponding to the part where the bull layer is pulled out
Mold release film coverlay or pattern provided
A step of forming an adhesive layer, and an FPC inner layer core substrate by the adhesive layer of the outer layer core substrate.
Bonding the outer core substrate and the FPC inner core substrate.
And process the outer part of the FPC cable layer to be drawn out
Carrying out the dummy conduction from the externally processed FPC inner layer core base material.
Peel off the outer layer core substrate where the body pattern is formed
Method for manufacturing a flex-rigid multilayer wiring board which comprises a that step. 2. A method for manufacturing a flex-rigid multilayer wiring board according to claim 1, wherein, using an adhesive sheet layer is trimmed in the shape of a multi-layer wiring portion, said FPC inner core
A method for producing a flex-rigid multilayer wiring board , comprising bonding a substrate and an outer core substrate . 3. The method for manufacturing a flex-rigid multilayer wiring board according to claim 1, wherein the other outer core base material has a hollow portion, and a guide mark for external processing is provided on the FPC cable layer. A method for producing a flex-rigid multilayer wiring board. 4. A method for manufacturing a flex-rigid multilayer wiring board according to claim 3, wherein the flex-rigid multilayer wiring board characterized by being provided a film coverlay for covering the guide mark for outer shape of the FPC cable layer
Manufacturing method . 5. The method of manufacturing a flex-rigid multilayer wiring board according to claim 1, wherein, the production method of the flex-rigid multilayer wiring board, which comprises using a portion of the other outer core substrate as a backing reinforcement plate. 6. The method for manufacturing a flex-rigid multilayer wiring board according to claim 1, wherein the conductor formed on the outer core material or the FPC cable layer or for fine adjustment of the finished thickness of the flex-rigid multilayer wiring board. A method for manufacturing a flex-rigid multilayer wiring board , comprising disposing a film coverlay. 7. The flex-rigid multilayer wiring according to claim 1, wherein the outer core material covering the FPC cable layer is removed without using a machining tool such as a blade. Plate manufacturing method.