CN105282987A - Preparation method for reducing splicing plate discarding of FPC flexible circuit board - Google Patents
Preparation method for reducing splicing plate discarding of FPC flexible circuit board Download PDFInfo
- Publication number
- CN105282987A CN105282987A CN201510658273.XA CN201510658273A CN105282987A CN 105282987 A CN105282987 A CN 105282987A CN 201510658273 A CN201510658273 A CN 201510658273A CN 105282987 A CN105282987 A CN 105282987A
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- China
- Prior art keywords
- fpc
- preparation
- scrapped
- plate
- flexible circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a preparation method for reducing splicing plate discarding of a FPC flexible circuit board. A FPC board is included. The FPC board employs an inner layer splicing mode and comprises at least two inner layer plates. The method comprises the following steps: a, utilizing laser to cut a discarded region of the FPC board and taking out a discarded inner layer plate; b, using a tool to fill the discarded region cut by the laser with a good inner layer plate; and c, applying a protective film to the FPC board with the good inner layer plate, then laminating the protective film, and finally carrying out baking processing. Via the above way, the FPC board employs the inner splicing mode, uses the laser to remove the discarded inner layer plate of an inner circuit, fills the cut region with the good inner layer plate, improves the yield rate of the whole board, and meanwhile ensures the accuracy of applying the inner layer plate. Spliced plates can achieve completely same production effect as the whole board in the prior art, satisfies the needs of production cost reduction, and improves the yield rate.
Description
Technical field
The present invention relates to the field of electronic circuit board FPC, particularly relate to a kind of FPC flexible circuit board jigsaw and reduce the preparation method scrapped.
Background technology
Flexible circuit board, also known as " soft board ", is the printed circuit made with flexible insulating substrate.Flexible circuit provides excellent electrical property, can meet design needs that are more small-sized and more high-density installation, also contributes to reducing assembling procedure and strengthening reliability.Flexible circuit board is the only solution meeting miniaturization of electronic products and movement requirement.Can free bend, winding, folding, the dynamic bending of millions of times can be born and do not damage wire, can require to arrange arbitrarily according to space layout, and move arbitrarily at three dimensions and stretch, thus reaching components and parts and assemble the integration be connected with wire; Flexible circuit board can reduce the volume and weight of electronic product greatly, is suitable for the needs of electronic product to high density, miniaturization, highly reliable future development.Flexible circuit board has plurality of advantages such as saving space, weight reduction and flexibility height, and the whole world increases just year by year to the demand of flexible circuit board.
Along with developing of company, the product also diversification that flexible circuit board is produced, is progressively being strided forward to more complicated Rigid Flex, HDI plate by simple single double sided board; Therefore, more or less occur because bad defect causes single PCS to scrap at internal layer circuit, and badly staggering with it of occurring on skin, the scrappage forming SUBPANL increases, and meanwhile, needs the auxiliary material of laminating essential again, to this increase production cost.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of FPC flexible circuit board jigsaw and reduces the preparation method scrapped, FPC plate uses the mode of internal layer jigsaw, utilize the inner plating that laser removal internal layer circuit is scrapped, fill up the inner plating of normal non-defective unit, improve justifying yield, use tool laminating to ensure the laminating accuracy of product itself when filling up non-defective unit simultaneously, splice plate can reach the production effect the same with former whole plate completely, make it meet the requirement reducing production cost, improve the object of yields.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of FPC flexible circuit board jigsaw and reduce the preparation method scrapped, comprise FPC plate, described FPC plate adopts the mode of internal layer jigsaw, at least comprise two inner platings, the preparation method that described reduction is scrapped comprises following concrete steps:
A, utilize laser to cut FPC plate to scrap region, takes out the inner plating scrapped;
B, tool is used to scrap at laser the inner plating that normal non-defective unit is filled up in region;
C, the FPC plate of inner plating being fitted with normal non-defective unit is fitted diaphragm, then pressing diaphragm, finally carry out baking process.
In a preferred embodiment of the present invention, described inner plating is connected and fixed by pin pin and FPC plate.
In a preferred embodiment of the present invention, described laser adopts laser lens to carry out operation.
In a preferred embodiment of the present invention, the described tool laminating that uses when filling up the inner plating of normal non-defective unit ensures to fit tightly between adjacent inner layer plate.
In a preferred embodiment of the present invention, described tool adopts tool contraposition to mend the mode of plate.
The invention has the beneficial effects as follows: FPC flexible circuit board jigsaw of the present invention reduces the preparation method scrapped, FPC plate uses the mode of internal layer jigsaw, utilize the inner plating that laser removal internal layer circuit is scrapped, fill up the inner plating of normal non-defective unit, improve justifying yield, use tool laminating to ensure the laminating accuracy of product itself when filling up non-defective unit, splice plate can reach the production effect the same with former whole plate completely simultaneously, make it meet the requirement reducing production cost, improve the object of yields.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the flow chart that FPC flexible circuit board jigsaw of the present invention reduces a preferred embodiment of the preparation method scrapped.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
As shown in Figure 1, the embodiment of the present invention comprises:
FPC flexible circuit board jigsaw reduces the preparation method scrapped, and comprises FPC plate, and described FPC plate adopts the mode of internal layer jigsaw, and at least comprise two inner platings, the preparation method that described reduction is scrapped comprises following concrete steps:
A, utilize laser to cut FPC plate to scrap region, takes out the inner plating scrapped;
B, tool is used to scrap at laser the inner plating that normal non-defective unit is filled up in region;
C, the FPC plate of inner plating being fitted with normal non-defective unit is fitted diaphragm, then pressing diaphragm, finally carry out baking process.
In above-mentioned, described inner plating is connected and fixed by pin pin and FPC plate, described inner plating is provided with pin hole, and described FPC plate is provided with the pin corresponding with pin hole, and inner plating enters pin by pin borehole jack and FPC plate is connected and fixed.
Further, described laser adopts laser lens to carry out operation, sends laser carry out cutting FPC plate scraps region by laser lens.
Further, the described tool laminating that uses when filling up the inner plating of normal non-defective unit ensures to fit tightly between adjacent inner layer plate, ensures the laminating accuracy of inner plating itself.Wherein, described tool adopts tool contraposition to mend the mode of plate.Tool laminating is adopted to produce, and the mode of fast pressing after improving the first false subsides of diaphragm, reach the object of project improvement with this, use in similar products.
By the splicing test adopting the inner plating of normal non-defective unit to replace the inner plating scrapped, show from test result: inner plating and the inner plating scrapped of normal non-defective unit determine profile by the mode of laser and under the prerequisite of tool laminating type, splice plate can reach the production effect the same with former whole plate completely; Meet the requirement reducing production cost, improve the object of yields.
In sum, FPC flexible circuit board jigsaw of the present invention reduces the preparation method scrapped, FPC plate uses the mode of internal layer jigsaw, the inner plating utilizing laser removal internal layer circuit to scrap, fills up the inner plating of normal non-defective unit, improves justifying yield, use tool laminating to ensure the laminating accuracy of product itself when filling up non-defective unit simultaneously, splice plate can reach the production effect the same with former whole plate completely, makes it meet the requirement reducing production cost, improves the object of yields.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (5)
1. FPC flexible circuit board jigsaw reduces the preparation method scrapped, and comprises FPC plate, it is characterized in that, described FPC plate adopts the mode of internal layer jigsaw, and at least comprise two inner platings, the preparation method that described reduction is scrapped comprises following concrete steps:
A, utilize laser to cut FPC plate to scrap region, takes out the inner plating scrapped;
B, tool is used to scrap at laser the inner plating that normal non-defective unit is filled up in region;
C, the FPC plate of inner plating being fitted with normal non-defective unit is fitted diaphragm, then pressing diaphragm, finally carry out baking process.
2. FPC flexible circuit board jigsaw according to claim 1 reduces the preparation method scrapped, and it is characterized in that, described inner plating is connected and fixed by pin pin and FPC plate.
3. FPC flexible circuit board jigsaw according to claim 1 reduces the preparation method scrapped, and it is characterized in that, described laser adopts laser lens to carry out operation.
4. FPC flexible circuit board jigsaw according to claim 1 reduces the preparation method scrapped, and it is characterized in that, the described tool laminating that uses when filling up the inner plating of normal non-defective unit ensures to fit tightly between adjacent inner layer plate.
5. FPC flexible circuit board jigsaw according to claim 1 reduces the preparation method scrapped, and it is characterized in that, described tool adopts tool contraposition to mend the mode of plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510658273.XA CN105282987A (en) | 2015-10-14 | 2015-10-14 | Preparation method for reducing splicing plate discarding of FPC flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510658273.XA CN105282987A (en) | 2015-10-14 | 2015-10-14 | Preparation method for reducing splicing plate discarding of FPC flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105282987A true CN105282987A (en) | 2016-01-27 |
Family
ID=55151072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510658273.XA Pending CN105282987A (en) | 2015-10-14 | 2015-10-14 | Preparation method for reducing splicing plate discarding of FPC flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105282987A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238966A (en) * | 1998-02-24 | 1999-08-31 | Sharp Corp | Flex-rigid multilayer interconnection board and manufacture thereof |
| CN101166396A (en) * | 2006-10-17 | 2008-04-23 | 比亚迪股份有限公司 | Joint tool and method for flexible printed circuit board |
| CN103140018A (en) * | 2011-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Protective film of soft printed circuit board, soft printed circuit board structure and manufacturing method of protective film of soft printed circuit board and soft printed circuit board structure |
| CN104284525A (en) * | 2014-09-29 | 2015-01-14 | 昆山思拓机器有限公司 | Method for repairing jointed PCB |
-
2015
- 2015-10-14 CN CN201510658273.XA patent/CN105282987A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11238966A (en) * | 1998-02-24 | 1999-08-31 | Sharp Corp | Flex-rigid multilayer interconnection board and manufacture thereof |
| CN101166396A (en) * | 2006-10-17 | 2008-04-23 | 比亚迪股份有限公司 | Joint tool and method for flexible printed circuit board |
| CN103140018A (en) * | 2011-12-05 | 2013-06-05 | 昆山雅森电子材料科技有限公司 | Protective film of soft printed circuit board, soft printed circuit board structure and manufacturing method of protective film of soft printed circuit board and soft printed circuit board structure |
| CN104284525A (en) * | 2014-09-29 | 2015-01-14 | 昆山思拓机器有限公司 | Method for repairing jointed PCB |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160127 |